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Data de Criação 15 de março de 2018
Ultima Atualização 3 de julho de 2018

MANUAL XGK CPU

Right choice for ultimate yield
LSIS strives to maximize customers' profit in gratitude of choosing us for your partner.
Programmable Logic Controller
XGK CPU Module
User’s Manual
 Read this manual carefully before
installing, wiring, operating, servicing
or inspecting this equipment.
Keep this manual within easy reach
for quick reference.
XGK-CPUUN
XGK-CPUHN
XGK-CPUSN
XGK-CPUU
XGK-CPUH
XGK-CPUA
XGK-CPUS
XGK-CPUE
XGT Series
http://eng.lsis.biz
Safety Instruction
Before using the product …
For your safety and effective operation, please read the safety instructions
thoroughly before using the product.
► Safety Instructions should always be observed in order to prevent accident
or risk with the safe and proper use the product.
► Instructions are separated into “Warning” and “Caution”, and the meaning of
the terms is as follows;
This symbol indicates the possibility of serious injury
or death if some applicable instruction is violated
This symbol indicates the possibility of slight injury

or damage to products if some applicable instruction
is violated

Caution

► The marks displayed on the product and in the user’s manual have the
following meanings.
Be careful! Danger may be expected.
Be careful! Electric shock may occur.
► The user’s manual even after read shall be kept available and accessible to
any user of the product.
Warning

Safety Instruction
Safety Instructions when designing
 Please, install protection circuit on the exterior of PLC to protect
the whole control system from any error in external power or PLC
module. Any abnormal output or operation may cause serious problem
in safety of the whole system.
- Install applicable protection unit on the exterior of PLC to protect
the system from physical damage such as emergent stop switch,
protection circuit, the upper/lowest limit switch, forward/reverse
operation interlock circuit, etc.
- If any system error (watch-dog timer error, module installation error,
etc.) is detected during CPU operation in PLC, the whole output is
designed to be turned off and stopped for system safety. However,
in case CPU error if caused on output device itself such as relay or
TR can not be detected, the output may be kept on, which may
cause serious problems. Thus, you are recommended to install an
addition circuit to monitor the output status.
 Never connect the overload than rated to the output module nor
allow the output circuit to have a short circuit, which may cause a
fire.
 Never let the external power of the output circuit be designed to
be On earlier than PLC power, which may cause abnormal output or
operation.
 In case of data exchange between computer or other external
equipment and PLC through communication or any operation of
PLC (e.g. operation mode change), please install interlock in the
sequence program to protect the system from any error. If not, it
may cause abnormal output or operation.
Warning
Safety Instruction
Safety Instructions when designing
Safety Instructions when designing
 I/O signal or communication line shall be wired at least 100mm
away from a high-voltage cable or power line. If not, it may cause
abnormal output or operation.
Caution
 Use PLC only in the environment specified in PLC manual or
general standard of data sheet. If not, electric shock, fire, abnormal
operation of the product or flames may be caused.
 Before installing the module, be sure PLC power is off. If not,
electric shock or damage on the product may be caused.
 Be sure that each module of PLC is correctly secured. If the
product is installed loosely or incorrectly, abnormal operation, error or
dropping may be caused.
 Be sure that I/O or extension connecter is correctly secured. If
not, electric shock, fire or abnormal operation may be caused.
 If lots of vibration is expected in the installation environment,
don’t let PLC directly vibrated. Electric shock, fire or abnormal
operation may be caused.
 Don’t let any metallic foreign materials inside the product, which
may cause electric shock, fire or abnormal operation..
Caution
Safety Instruction
Safety Instructions when wiring
 Prior to wiring, be sure that power of PLC and external power is
turned off. If not, electric shock or damage on the product may be
caused.
 Before PLC system is powered on, be sure that all the covers of
the terminal are securely closed. If not, electric shock may be caused
Warning
 Let the wiring installed correctly after checking the voltage rated
of each product and the arrangement of terminals. If not, fire,
electric shock or abnormal operation may be caused.
 Secure the screws of terminals tightly with specified torque when
wiring. If the screws of terminals get loose, short circuit, fire or abnormal
operation may be caused.
*
 Surely use the ground wire of Class 3 for PE terminals, which is
exclusively used for PLC. If the terminals not grounded correctly,
abnormal operation may be caused.
 Don’t let any foreign materials such as wiring waste inside the
module while wiring, which may cause fire, damage on the product
or abnormal operation.
Caution
Safety Instruction
Safety Instructions for test-operation or repair
Safety Instructions for waste disposal
 Don’t touch the terminal when powered. Electric shock or abnormal
operation may occur.
 Prior to cleaning or tightening the terminal screws, let all the
external power off including PLC power. If not, electric shock or
abnormal operation may occur.
 Don’t let the battery recharged, disassembled, heated, short or
soldered. Heat, explosion or ignition may cause injuries or fire.
Warning
 Don’t remove PCB from the module case nor remodel the module.
Fire, electric shock or abnormal operation may occur.
 Prior to installing or disassembling the module, let all the external
power off including PLC power. If not, electric shock or abnormal
operation may occur.
 Keep any wireless installations or cell phone at least 30cm away
from PLC. If not, abnormal operation may be caused.
Caution
 Product or battery waste shall be processed as industrial waste.
The waste may discharge toxic materials or explode itself.
Caution

◎ Contents ◎

CHAPTER 1 Introduction 1-1~1-5

1.1 Overview..........................................................................................................................1-1
1.2 Characteristics .................................................................................................................1-2
1.3 Terminology .....................................................................................................................1-4

CHAPTER 2 System Configuration................................................................2-1~2-11

2.1 XGT Series System Configuration....................................................................................2-1
2.2 List of Configuration Products ..........................................................................................2-2
2.3 Basic System...................................................................................................................2-6
2.3.1 Configuration method of basic system ................................................................................. 2-6
2.3.2 Max. configuration of basic system (Point fixed).................................................................. 2-7
2.3.3 Max. configuration of basic system (Point variable)............................................................. 2-8
2.3.4 Terminator connections ........................................................................................................ 2-9
2.3.5 Module selection when configuring basic system .............................................................. 2-10
2.4 Network System.............................................................................................................2-12
2.4.1 Network systems ................................................................................................................ 2-12
2.4.2 Remote I/O system............................................................................................................. 2-13

CHAPTER 3 General Specifications........................................................................ 3-1

3.1 General Specifications .....................................................................................................3-1

CHAPTER 4 CPU Module..................................................................................4-1~4-7

4.1 Technical Specifications ...................................................................................................4-1
4.2 Part Names and Functions...............................................................................................4-3
4.3 Battery .............................................................................................................................4-6
4.3.1 Battery specifications............................................................................................................ 4-6
4.3.2 Notice in using ...................................................................................................................... 4-6
4.3.3 Battery durability................................................................................................................... 4-6
4.3.4 Changing the battery ............................................................................................................ 4-7

CHAPTER 5 Program Configuration and Operation Method.......................5-1~5-25

5.1 Program Introduction .......................................................................................................5-1
5.1.1 Program execution methods ................................................................................................ 5-1
5.1.2 Operation processing during momentary power failure ....................................................... 5-2
5.1.3 Scan Time ............................................................................................................................ 5-3
5.2 Program Execution ..........................................................................................................5-5
5.2.1 Program configuration.......................................................................................................... 5-5
5.2.2 Program execution method.................................................................................................. 5-5
5.2.3 Interrupt. ............................................................................................................................... 5-7
5.3 Operation Mode .............................................................................................................5-13
5.3.1 RUN mode.......................................................................................................................... 5-13
5.3.2 STOP mode ........................................................................................................................ 5-14
5.3.3 DEBUG mode..................................................................................................................... 5-14
5.3.4 Changing operation mode .................................................................................................. 5-15
5.4 Memory..........................................................................................................................5-16
5.4.1 Program memory................................................................................................................ 5-16
5.4.2 Data memory...................................................................................................................... 5-17
5.5 Configuration Diagram of Data Memory .........................................................................5-19
5.5.1 XGK-CPUE......................................................................................................................... 5-19
5.5.2 XGK-CPUS......................................................................................................................... 5-20
5.5.3 XGK-CPUA......................................................................................................................... 5-21
5.5.4 XGK-CPUH......................................................................................................................... 5-22
5.5.5 XGK-CPUU......................................................................................................................... 5-23
5.5.5 Data Latch Area settings .................................................................................................... 5-24

CHAPTER 6 Functions of CPU Module..........................................................6-1~6-17

6.1 Self-Diagnosis..................................................................................................................6-1
6.1.1 Scan Watchdog Timer.......................................................................................................... 6-1
6.1.2 I/O Module Check function................................................................................................... 6-2
6.1.3 Battery Voltage Check function ............................................................................................ 6-2
6.1.4 Error History Save................................................................................................................ 6-2
6.1.5 Troubleshooting .................................................................................................................. 6-2
6.2 Clock................................................................................................................................6-4
6.3 Remote Function..............................................................................................................6-6
6.4 Forced I/O On/Off Function..............................................................................................6-7
6.4.1 Forced I/O setup method ..................................................................................................... 6-7
6.4.2 Forced On/Off execution point and execution method......................................................... 6-8
6.5 Direct I/O Operation.........................................................................................................6-8
6.6 Saving Operation History .................................................................................................6-9
6.6.1 Error history.......................................................................................................................... 6-9
6.6.2 Mode conversion history ...................................................................................................... 6-9
6.6.3 Power shutdown history ....................................................................................................... 6-9
6.6.4 System history...................................................................................................................... 6-9
6.7 External Device Error Diagnosis.. ..................................................................................6-11
6.8 Error Mask .....................................................................................................................6-13
6.9 I/O Module Skip .............................................................................................................6-14
6.10 Changing Module during Operation..............................................................................6-15
6.11I/O No. Allocation Method..............................................................................................6-16
6.11.1 Fixed I/O no. allocation ..................................................................................................... 6-16
6.11.2 Variable I/O no. allocation................................................................................................. 6-16
6.11.3 Module reservation function.............................................................................................. 6-17
6.12 Program Modification during Operation........................................................................6-17

CHAPTER 7 I/O Module...................................................................................7-1~7-24

7.1 Notice in selecting module ...............................................................................................7-1
7.2 Digital Input Module Specifications...................................................................................7-3
7.2.1 8 point DC24V Input module (Source/Sink Type) ................................................................ 7-3
7.2.2 16 point DC24V Input module (Source/Sink Type) .............................................................. 7-4
7.2.3 16 point DC24V Input module (Source Type) ...................................................................... 7-5
7.2.4 32 point DC24V Input module (Source/Sink Type) .............................................................. 7-6
7.2.5 32 point DC24V Input module (Source type) ....................................................................... 7-7
7.2.6 64 point DC24V Input module (Source/Sink Type) .............................................................. 7-8
7.2.7 64 point DC24V Input module (Source Type) ...................................................................... 7-9
7.2.8 16 point AC110V Input module........................................................................................... 7-10
7.2.9 8 point AC220V Input module .............................................................................................7-11
7.2.10 8 point AC220V isolated Input module............................................................................. 7-12
7.3 Digital Output Module Specifications..............................................................................7-13
7.3.1 8 point Relay Output module.............................................................................................. 7-13
7.3.2 16 point Relay Output module............................................................................................ 7-14
7.3.3 16 point Relay Output module (Surge Absorber built-in Type) .......................................... 7-15
7.3.4 16 point Triac Output module............................................................................................. 7-16
7.3.5 16 point Transistor Output module(Sink Type)................................................................... 7-17
7.3.6 32 point Transistor Output module(Sink Type)................................................................... 7-18
7.3.7 64 point Transistor Output module(Sink Type)................................................................... 7-19
7.3.8 16 point Transistor Output module(Source Type) .............................................................. 7-20
7.3.9 32 point Transistor Output module(Source Type) .............................................................. 7-21
7.3.10 64 point Transistor Output module(Source Type) ............................................................ 7-22
7.3.11 8 point Transistor isolated Output module........................................................................ 7-23
7.4 Digital IO Module ...........................................................................................................7-24
7.4.1 32 point I/O Combination module....................................................................................... 7-24
7.5 Event Input Module ........................................................................................................7-25
7.5.1 Event Input Module ............................................................................................................ 7-25
7.6 Smart Link......................................................................................................................7-26
7.6.1 Smart Link connectable module......................................................................................... 7-26
7.6.2 Smart Link connection........................................................................................................ 7-27

CHAPTER 8 Power Module...............................................................................8-1~8-5

8.1 Selection Method .............................................................................................................8-1
8.2 Specifications...................................................................................................................8-3
8.3 Part Names......................................................................................................................8-4
8.4 Current Consumption/Power Calculation Example...........................................................8-5

CHAPTER 9 Base and Extended Cable ...........................................................9-1~9-2

9.1 Specifications...................................................................................................................9-1
9.1.1 Main base............................................................................................................................. 9-1
9.1.2 Extended base ..................................................................................................................... 9-1
9.1.3 Extended cable..................................................................................................................... 9-1
9.2 Part Names......................................................................................................................9-2
9.2.1 Main base............................................................................................................................. 9-2
9.2.2 Expansion base.................................................................................................................... 9-2
10.1 Features .....................................................................................................................10-1
10.2 PID Control ................................................................................................................10-1
10.3 PID Control Operation ................................................................................................10-2
10.3.1 Terms .............................................................................................................................. 10-2
10.3.2 PID Expressions ............................................................................................................. 10-2
10.3.3 P Control ......................................................................................................................... 10-3
10.3.4 PI Control ........................................................................................................................ 10-4
10.3.5 PID Control ..................................................................................................................... 10-5
10.4 PID Instructions ..........................................................................................................10-6
10.4.1 PID Loop States .............................................................................................................. 10-6
10.4.2 PID Instruction Group ..................................................................................................... 10-7
10.5 PID Flag Configuration ...............................................................................................10-9
10.5.1 Common Bit Area .......................................................................................................10-11
10.5.2 Individual Data Area ..................................................................................................... 10-14
10.6 Convenient Additional Functions of PID Instructions .................................................10-21
10.6.1 Various PID-based control methods ............................................................................. 10-21
10.6.2 Operation and function of anti wind-up ........................................................................ 10-21
10.6.3 Operation and function of Auto-tuning (AT) .................................................................. 10-21
10.6.2 Operation and function of cascade (CAS) .................................................................... 10-21
10.7 How to Use PID Instructions .....................................................................................10-22
10.7.1 Hardware Configuration ............................................................................................... 10-22
10.7.2 Program example 1 ...................................................................................................... 10-21
10.7.3 PID controlling .............................................................................................................. 10-26
10.7.4 How to start up using AT (Auto-tuning) ....................................................................... 10-32
10.7.5 Program example 2 ...................................................................................................... 10-33
10.7.6 Startup using PWM ....................................................................................................... 10-34
10.7.7 Cascade startup ........................................................................................................... 10-35

CHAPTER 11 Installation and Wiring......................................................... 11-1~11-12

CHAPTER 10 Built-in PID Functions .....................................................10-1~10-35

11.1 Installation....................................................................................................................11-1
11.1.1 Installation environment.....................................................................................................11-1
11.1.2 Handling precautions.........................................................................................................11-4
11.1.3 Attachment/Detachment of module ...................................................................................11-7
11.2 Wiring...........................................................................................................................11-9
11.2.1 Power wiring ......................................................................................................................11-9
11.2.2 I/O Device wiring .............................................................................................................11-11
11.2.3 Ground wiring ..................................................................................................................11-11
11.2.4 Cable specifications for wiring.........................................................................................11-12

CHAPTER 12 Maintenance and Repair........................................................12-1~12-2

12.1 Repair and Checking....................................................................................................12-1
12.2 Daily Checking.............................................................................................................12-1
12.3 Regular Checking ........................................................................................................12-2
13.1 Requirements for Conformance to EMC Directive........................................................13-1
13.1.1 EMC Standard.................................................................................................................. 13-1
13.1.2 Control Panel.................................................................................................................... 13-2
13.1.3 Cables .............................................................................................................................. 13-3
13.2 Requirement to Conform to the Low-voltage Directive .................................................13-4
13.1.1 Standard Applied for MasterLogic-200 Series.................................................................. 13-4
13.1.2 XGT Series PLC Selection............................................................................................... 13-4

CHAPTER 14 Troubleshooting...................................................................14-1~14-16

14.1 Basic Procedure for Troubleshooting ...........................................................................14-1
14.2 Troubleshooting ...........................................................................................................14-1
14.2.1 Action when Power LED is OFF....................................................................................... 14-2
14.2.2 Action when ERR LED is blinking .................................................................................. 14-3
14.2.3 Action when RUN, STIOP LED is OFF ........................................................................... 14-4
14.2.4 Action when I/O Module does not work normally ........................................................... 14-5

CHAPTER 13 EMC Directive .....................................................................13-1~13-4

14.2.5 Action when Program Write does not work normally ...................................................... 14-7
14.3 Questionnaire for Troubleshooting ...............................................................................14-8
14.4 Cases ..........................................................................................................................14-9
14.4.1 Input circuit error types and corrective actions ................................................................ 14-9
14.4.2 Output circuit error types and corrective actions............................................................ 14-10
14.5 Error Code List...........................................................................................................14-12
14.5.1 Error code during CPU operation................................................................................... 14-12
14.5.2 Error code of program operation.................................................................................... 14-15

Appendix 1 Flag List .......................................................................App.1-1~App.1-14

App.1.1 Special Relay (F) List........................................................................................ App.1-1
App.1.2 Communication Relay (L) List......................................................................... App.1-10
App.1.3 Link Register (N) List ...................................................................................... App.1-13

Appendix 2 Dimensions....................................................................App.2-1~App.2-3

Appendix 3 Compatibility with MASTER-K .....................................App.3-1~App.3-5

Warranty

※ The number of User’s manual is indicated right part of the back cover.
ⓒ LSIS Co., Ltd 2006 All Rights Reserved.
Revision History

Version	Date	Contents	Chapter
V 1.0	2006. 2	First Edition	-
V1.1	2009.10	1. XGK-CPUU added 2. Fnet -> Rnet modified 3. Scan Time modified 4. Interrupt module removed 5. Clock data F device modified 6. Heavy error/light error modified 7. Fault mask -> “Release by program” removed 8. Skip function -> “Release by program” removed 9. Product list modified 10. Program language SFC, ST added 11. XGQ-SOEA added 12. Flag list modified	Ch1.1, Ch2.3.1, Ch2.4.1, Ch4.1 Ch1.3 Ch5.1.3 Ch7.1 Ch6.2 Ch6.7 Ch6.8 Ch6.9 Ch2.2 Ch4.1 Ch7.5 Appendix 1
V1.6	2010.3	1. Product list modified 2. Supported functions according to OS version 3. Description on Reset/D.Clear switch added 4. Wiring diagram of Smart Link added 5. Flag added (indicated version to decimal places _OS_VER_PATCH) 6. Typos fixed	Ch2.2, Ch2.4.2 Ch4.1 Ch4.2 Ch7.6.3 App1.1 Ch1.1, Ch1.2, Ch1.3 Ch3.1, Ch4.1 Ch5.2.3, Ch5.5 Ch8.1 Ch10.3, Ch10.7 CH12.2, 12.3
V1.7	2013.1	1. Product list modified 2. Size of data refresh area added 3. Supported functions according to CPU OS version added 4. Fixed cycle task’s flag information added 5. Digital I/O module added XGI-A21C, XGQ-TR1C 6. Flag added	Ch2.2 Ch2.3.5 Ch4.1 Ch5.2.3 Ch7.2.10 Ch7.3.11 App1.1

부록3 MASTER-K와의 호환성
[텍스트 입력]

Version	Date	Contents	Chapter
V 1.8	2015. 2	1.CPU Module Added (XGK-CPUUN, XGK-CPUHN, XGK-CPUSN)	1.2, 2.2, 2.3, 2.4, 4.1, 4.2, 5.1.3, 5.4.1, 5.4.2 5.5, 6.13, 8.1, Appendix1.1
V 1.9	2015. 9	1. Circuit configuration modified 2. Smart Link Model name modified 3. Rated input voltage modified 4. Terminology modified (FG  PE) 5. CPU Processing Speed Unit changed (us  ns) 6. List of Configuration Products updated	7.2, 7.3, 7.4, 7.5 7.6 8.2 8.3, 9.1, 9.2, 11.2, 13.1 1.2, 4.1 2.2

About User’s Manual
About User’s Manual
Thank you for purchasing PLC of LS Industrial System Co., Ltd.
Before use, make sure to carefully read and understand the User’s Manual about the functions,
performances, installation and programming of the product you purchased in order for correct
use and importantly, let the end user and maintenance administrator to be provided with the
User’s Manual.
The User’s Manual describes the product. If necessary, you may refer to the following
description and order accordingly. In addition, you may connect our
website(http://www.lsis.com/) and download the information as a PDF file.
Relevant User’s Manuals

Title	Description	No. of User’s Manual
XGK / XGB Instructions & Programming	It is the user’s manual for programming to explain how to use commands that are used PLC system with XGK CPU and XGB CPU.	10310000510
XG5000	It describes how to use XG5000 software especially about online functions such as programming, printing, monitoring and debugging by using XGT series products.	10310000512

Chapter 1 Introduction
1-1
Chapter 1 Introduction
1.1 Overview
This User’s Manual provides the information for the specification, performance and operation method of each
product required to use a PLC system configured by XGK series CPU modules.
The configuration of User’s Manual is as follows :

Chapter	Items	Description
Chapter 1	Overview	Describes the configuration of this user’s manual, product characteristics and terminology.
Chapter 2	System Configuration	Describes the product type and system configuration method to be used for XGK series.
Chapter 3	General Specifications	Shows the common specification of each module used for series. XGK
Chapter 4	CPU Module	Describes the performance, specification and operation method of XGK-CPU
Chapter 5	Program Operation MConfiguration ethod and
Chapter 6	Function of CPU Module
Chapter 7	I/O Module	Describes the specification and the method to use I/O module and power module except CPU module.
Chapter 8	Power Module
Chapter 9	Base and Extended Cable
Chapter 10	Built-in PID	Describes on the built-in PID function
Chapter 11	Installation and Wiring	Describes the installation, wiring method and notices to secure the reliability of PLC system.
Chapter 12	Maintenance & Repair	Describes the checking items and methods to run the PLC system normally for a long time.
Chapter 13	EMC Directive	Summarizes the precautions on conformance to the EMC Directive of the machinery assembled using XGK series.
Chapter 14	Trouble Shooting	Describes various errors and action methods occurred while using a system.
Appendix 1	Flag List	Describes various type of each flag and its description.
Appendix 2	Dimensions	Shows the outer dimension of CPU, I/O module and Base.
Appendix 3	Compatibility with MASTER-K

Notes

1) This user’s manual does not describe the special/communication module and program writing method.
For the corresponding function, please refer to the related user’s manual.
2) XGK CPU is one of the XGT PLC system and CPU types of XGT PLC system are as follows.
① XGK series: XGT PLC system that cosists of CPU using Master-K
② XGI series: XGT PLC system that consists of single CPU using IEC language
③ XGR series: XGT PLC system that consists of redundaccy CPU using IEC language

Chapter 1 Introduction
1-2
1.2 Characteristics
XGK system has the features as below.
1) Compact size
The function is extended to large sized but the size is reduced innovatively to make the installation in the
small space for any purpose easily.
2) High speed processing
(1) XGK-CPUUN
• Sequence command: 8.5 ns
• MOV command: 25.5 ns
• Floating point arithmetic operation(the operation for the single real number and double real number
accuracy is profoundly improved)

Classification	+	-	×	÷
Single Real	183 ns	183 ns	336 ns	345 ns
Double Real	327 ns	327 ns	727 ns	808 ns

(2) XGK-CPUU
• Sequence command: 28 ns
• MOV command: 84 ns
• Floating point arithmetic operation

Classification	+	-	×	÷
Single Real	602 ns	602 ns	1,106 ns	1,134 ns
Double Real	1,078 ns	1,078 ns	2,394 ns	2,660 ns

(3) Improvement of data transfer speed between modules through base.
• 16 point I/O module data process: 200 ns ~ 800 ns
• Analogue 1 Ch data process: 200 ns ~ 800 ns
• 1 KB communication module data process: 12,800 ns
• Parallel process by I/O data auto refresh during programming
3) Convenience to use Analog Data
Analog module enforced the precision and stability and provides the convenience as below :
• Program simplification by providing analog data dedicated ‘U ‘ device
• Setting without memory map of special module is available by providing parameter setting method.
4) System Configuration
Various convenient functions are provided to meet the demands of users.
• Filter value adjustment of input module
• Output hold at emergency time
• Varistor built-in relay output module with strong durability
• Total extension length of expanded base shall be 15m.
• Provides system RUN contact to power module.
• Cost efficiency of setup, startup and maintenance/repair by enforced self-diagnosis function
Chapter 1 Introduction
1-3
5) Various communication system
Provides various network function to satisfy both the user convenience and compatibility.
• Network opening available without writing a ladder program
• Network setting and operation status monitoring by dedicated tool(XG-PD)
• Supports Open network of various international specification
• Dedicated network to provide the ease in use and optimal performance
• Network compatibility with the existing products (MASTER-K, GLOFA-GM)
6) Enforcement of program and online function
Minimized the program writing time by providing the convenience of programming and available to
complete the control system of equipment without stopping the system by enforcement of online function.
• Compatibility of ladder and text (Mnemonic) method
• Enforcement of symbolic program
• Automatic conversion of MASTER-K program
• Available to modify the program during operation and secure the stability
• Available to install and change the network during operation
• Enforcement of trend monitoring function
• User event function
• Data trace function
7) User’s convenience
Various functions are provided for user’s convenience.
• Module Changing Wizard (User’s tool is unnecessary.)
• System Diagnosis
• Skip I/O
• Fault Mask
• I/O Allocation Method
• Various Operation History
Chapter 1 Introduction
1-4
1.3 Terminology
Here describes the terminology used in this user’s manual.

Terminology	Definition	Remarks
Module	A device like I/O board assembled to insert in a motherboard or base as a standardized factor having the regular function to configure the system.	Ex) CPU module, power module, I/O module etc.
Unit	A module or module aggregate which is the minimum unit in operation of PLC system. It configures the PLC system by connecting to other module or module aggregate.	Ex) Basic unit, Extended unit
PLC System	A system consisted of PLC and peripherals and which is configured to enable the control by user program
XG 5000	Graphic loader to carry out program writing, editing and debug function
I/O image area	Internal memory area of CPU module installed to maintain the input and output state
Rnet	Remote Network (Remote dedicated network)
Fnet	Field bus Network
RAPIEnet	Real-time Automation Protocols for Industrial Ethernet
Cnet	Computer Network
FEnet	Fast Ethernet Network
Pnet	Profibus-DP Network
Dnet	DeviceNet Network
RTC	Real Time Clock. A general name of universal IC having the clock function
Watchdog Timer	A timer to monitor the assigned running time of program and give an alarm if failed to complete the processing within the assigned time.
Task	There are three kind of tasks. (cycle time task, internal device task, external device task by external interrupt module’s input signal)

Chapter 1 Introduction
1-5

Terminology	Definition	Remarks
Sink input	The mode that the current flows from the switch to PLC input terminal when input signal is ON.	Z : Input resistance
Source input	The mode that the current flows from PLC input terminal to the switch when input signal is ON.
Sink output	The mode that the current flows from load to output terminal when PLC output contact is ON.
Source output	The mode that the current flows from output contact when PLC output contact is ON.

+ -

+ -
Power
PLC
Current
Output contact
Common
Load

-
+

Z
Power
PLC
Switch
Common
Current
Power Z
PLC
Switch Current
Common
Power
PLC
Current
Output
contact
Common
Load
Chapter 2 System Configuration
2-1
Chapter 2 System Configuration
XGT series are equipped with various products proper for basic system, computer link and network system
configuration. Here describes the configuration method of each system and its features.
2.1 XGT Series System Configuration
XGT series system configuration is as below:
CPUModule
Battery
RS-232C,
USB Cable
XG5000
Main Base (XGB-M□□A)
Diskette
PowerModule
(XGP-□□□□)

XGP-PAF1

XGK-CPUH

Expanded Base(XGB-E□□A)
Expanded Cable(XGC-E□□□)

XGK-CPUH

I/OModule
(XGI-□□□□)
(XGQ-□□□□)
SpecialModule
(XGF-□□□A)

XGL-DMEA

CommunicationModule
(XGL-□□□□)

XGF-PO3A

Terminator(XGT-TERA)
Chapter 2 System Configuration
2-2
2.2 Configuration Products
The product configuration of XGK series is as below :

Product	Model	Description	Remarks
CPU Module	XGK-CPUE	• Standard type CPU module (Max I/O point: 1,536 points)	16kstep
XGK-CPUS	• Standard type CPU module (Max I/O point: 3,072 points)	32kstep
XGK-CPUA	• High speed type CPU module (Max. I/O point: 3,072 points)	32kstep
XGK-CPUH	• High speed type CPU module (Max. I/O point: 6,144 points)	64kstep
XGK-CPUU	• High speed type CPU module (Max. I/O point: 6,144 points)	128kstep
XGK-CPUSN	• High speed type CPU module (Max. I/O point: 3,072 points)	64kstep
XGK-CPUHN	• High speed type CPU module (Max. I/O point: 6,144 points)	128kstep
XGK-CPUUN	• High speed type CPU module (Max. I/O point: 6,144 points)	256kstep
Digital Input Module	XGI-D21A	• DC 24V Input, 8 point (Current source / sink input)	-
XGI-D21D	• DC 24V Diagnostic Input, 8 point (Current sink input)	-
XGI-D22A	• DC 24V Input, 16 point (Current source / sink input)	-
XGI-D24A	• DC 24V Input, 32 point (Current source / sink input)	-
XGI-D28A	• DC 24V Input, 64 point (Current source / sink input)	-
XGI-D22B	• DC 24V Input, 16 point (Current source input)	-
XGI-D24B	• DC 24V Input, 32 point (Current source input)	-
XGI-D28B	• DC 24V Input, 64 point (Current source input)	-
XGI-A12A	• AC 110V input, 16 point	-
XGI-A21A	• AC 220V input, 8 point	-
XGI-A21C	• AC 220V isolated input, 8 points	-
Digital Output Module	XGQ-RY1A	• Relay output, 8 point (for 2A, single COM.)	-
XGQ-RY1D	• Diagnostic Relay output, 8 point (for 2A, single COM.)	-
XGQ-RY2A	• Relay output, 16 point (for 2A)	-
XGQ-RY2B	• Relay output, 16 point (for 2A), Varistor attached	-
XGQ-TR2A	• Transistor output, 16 point (for 0.5A, Sink output)	-
XGQ-TR4A	• Transistor output, 32 point (for 0.1A, Sink output)	-
XGQ-TR8A	• Transistor output, 64 point (for 0.1A, Sink output)	-
XGQ-TR2B	• Transistor output 16 point (for 0.5A, Source output)	-
XGQ-TR4B	• Transistor output 32 point (for 0.1A, Source output)	-
XGQ-TR8B	• Transistor output 64 point (for 0.1A, Source output)	-
XGQ-SS2A	• Triac output, 16 point (for 0.6A)	-
XGQ-TR1C	• Transistor isolated output, 8 points (2A)	-
Digital I/O Module	XGH-DT4A	• • Transistor output DC 24V input, 16, 16 point point (current source (for 0.1A, Sink output / sink input ) )	-

Chapter 2 System Configuration
2-3

Product	Model	Description	Remarks
Main Base	XGB-M04A	• for 4 module installation	-
XGB-M06A	• for 6 module installation	-
XGB-M08A	• for 8 module installation	-
XGB-M12A	• for 12 module installation	-
Expanded Base	XGB-E04A	• for 4 module installation	-
XGB-E06A	• for 6 module installation	-
XGB-E08A	• for 8 module installation	-
XGB-E12A	• for 12 module installation
Power module	XGP-ACF1	AC100V~240V input	• DC5V: 3A, • DC24V: 0.6A	-
XGP-ACF2	AC100V~240V input	• DC5V: 6A	-
XGP-AC23	AC100V~240V input	• DC5V: 8.5A	-
XGP-DC42	DC24V Input	• DC5V: 6A	-
Extended cable	XGC-E041	• Length : 0.4 m	Total extension distance should not exceed 15m
XGC-E061	• Length : 0.6 m
XGC-E121	• Length : 1.2 m
XGC-E301	• Length : 3.0 m
XGC-E501	• Length : 5.0 m
XGC-E102	• Length : 10 m
XGC-E152	• Length : 15 m
Terminator	XGT-TERA	• Must use for base expansion	-
Dust-proof Module	XGT-DMMA	• Dust protection module for not-used slot	-
Battery	XGT-BAT	• Battery for XGT (DC 3.0V / 1,800 mAh)	-

Chapter 2 System Configuration
2-4

Product	Model	Description	Remarks
Analog input Module	XGF-AV8A	• Voltage Input: 8 channel • DC 1 ~ 5V / 0 ~ 5V / 0 ~ 10V / -10 ~ +10V	-
XGF-AC8A	• Current Input: 8 channel • DC 4 ~ 20mA / 0 ~ 20mA	-
XGF-AD08A	• Voltage/Current Input: 8 channels	-
XGF-AD4S	• Voltage/Current Input: 4 channels • Insulation between channels	-
XGF-AD16A	• Voltage/Current Input: 16 channels	-
XGF-AW4S	• 2-wire voltage/current input: 4 –channel, insulation between channels • 2-wire transmitter driver power supported	-
Analog output Module	XGF-DV4A	• Voltage Output: 4 channels • DC 1 ~ 5V / 0 ~ 5V / 0 ~ 10V / -10 ~ +10V	-
XGF-DC4A	• Current Output:: 4 channels • DC 4 ~ 20mA / 0 ~ 20mA	-
XGF-DV4S	• Current Output:: 4 channels • Insulation between channels	-
XGF-DC4S	• Current Output:: 4 channels • Insulation between channels	-
XGF-DV8A	• Voltage Output: 8 channels • DC 1 ~ 5V / 0 ~ 5V / 0 ~ 10V / -10 ~ +10V	-
XGF-DC8A	• Current Output:: 8 channels • DC 4 ~ 20mA / 0 ~ 20mA	-
Analog I/O Module	XGF-AH6A	• • Voltage/Current input 4 channels Voltage/Current output 2 channels	-
HART I/F Analog Input Module	XGF-AC4H	• Current Input : 4 channel • HART I/F, DC 4 ~ 20mA	-
HART I/F Analog Output Module	XGF-DC4H	• Current Output : 4 channel • HART I/F, DC 4 ~ 20mA	-
Thermocouple Input Module	XGF-TC4S	• • Temperature Insulation between channels (T/C) Input, 4 channels,	-
RTD Input Module	XGF-RD4A	• Temperature (RTD) Input, 4 channels	-
XGF-RD4S	• Temperature (RTD) Input, 4 channels • Insulation between channels	-
XGF-RD8A	• Temperature (RTD) Input, 8 channels	-
Temp. control Module	XGF-TC4UD	• Control loop : 4 loops • Input(4 channels, TC/RTD/voltage/current), Output(8 channels, TR/current)	-
XGF-TC4RT	• Control loop: 4 loops • input (4 channels, RTD), Output (8 channels, TR)	-
High speed Counter Module	XGF-HO2A	• Voltage Input type (Open Collector type) • 200kHz, 2 channel	-
XGF-HD2A	• Differential Input type (Line Driver type) • 500kHz, 2 channel	-
XGF-HO8A	• Voltage Input type (Open Collector type) • 200kHz, 8 channel	-

Chapter 2 System Configuration
2-5

Product	Model	Description	Remarks
Positioning Module	XGF-PO3A	• Pulse output (Open Collector type), 3 axes	-
XGF-PO2A	• Pulse output (Open Collector type), 2 axes	-
XGF-PO1A	• Pulse output (Open Collector type), 1 axis	-
XGF-PD3A	• Pulse output (Line Drive type), 3 axes	-
XGF-PD2A	• Pulse output (Line Drive type), 2 axes	-
XGF-PD1A	• Pulse output (Line Drive type), 1 axis	-
XGF-PO4H	• Pulse output (Open Collector type), 4 axes	-
XGF-PO3H	• Pulse output (Open Collector type), 3 axes	-
XGF-PO2H	• Pulse output (Open Collector type), 2 axes	-
XGF-PO1H	• Pulse output (Open Collector type), 1 axes	-
XGF-PD4H	• Pulse output (Line Drive type), 4 axes	-
XGF-PD3H	• Pulse output (Line Drive type), 3 axes	-
XGF-PD2H	• Pulse output (Line Drive type), 2 axes	-
XGF-PD1H	• Pulse output (Line Drive type), 1 axes	-
XGF-PN8A	• Network type(EtherCat), 8 axes, LS dedicated type	-
XGF-PN8B	• Network type(EtherCat), 8 axes, Standard type	-
Motion Control Module	XGF-M16M	• Motion dedicated net (M-II) type, 16 axes	-
XGF-M32E	• Motion dedicated net (EtherCAT) type, 32 axes	-
Event Input Module	XGF-SOEA	• DC 24V input, 32 point, Sequence of Event module	-
Data Log Module	XGF-DL16A	•• USB 2.0, CF2001, Max 16GB 32 points (Input: 22 points , Output : 10 points)	-

Chapter 2 System Configuration
2-6

Product	Model	Description	Remarks
FEnet Module (Optical/Elec.)	XGL-EFMF	• Fast Ethernet(optical), Master • 100/10 Mbps support	-
XGL-EFMT	• Fast Ethernet(electrical), Master • 100/10 Mbps support	-
XGL-ESHF	• Fast Ethernet Switch module(optical)	-
XGL-EH5T	• Fast Ethernet Switch module(electrical)	-
RAPIEnet	XGL-EIMT	• Communication Module between PLCs (electrical) • 100 Mbps Industrial Ethernet supported	-
XGL-EIMF	• Communication Module between PLCs (optical) • 100 Mbps Industrial Ethernet supported	-
XGL-EIMH	• Communication Module between PLCs (electrical / optical) • 100 Mbps Industrial Ethernet supported	-
XGL-ES4T	• Communication Module between PLCs (electrical) • 100 Mbps Industrial Ethernet supported • RAPIEnet Switch	-
Cnet Module	XGL-C22A	• Serial communication • RS-232C, 2 channel	-
XGL-C42A	• Serial communication • RS-422(485), 2 channel
XGL-CH2A	• Serial communication • RS-232C 1 channel / RS-422(485) 1 channel
FDEnet Module(Master)	XGL-EDMF	• Dedicated Ethernet(optical), Master • Deterministic communication support • 100/10 Mbps support	-
XGL-EDMT	• Dedicated Ethernet(electrical), Master • Deterministic communication support • 100/10 Mbps support
Rnet Module	XGL-RMEA	• for Rnet Master I/F (Smart I/O communication available) • Fast response speed support(against the existing Fnet module) • 1 Mbps base band • for twisted cable	-
Profibus-DP Module	XGL-PMEA XGL-PMEC	• Profibus-DP Master module	-
Pnet Slave I/F module	XGL-PSEA	• Profibus-DP Slave module	-
DeviceNet Module	XGL-DMEA	• DeviceNet Master module	-
Ethernet/IP Module	XGL-EIPT	•• EtherNet/IP(electric) 100/10 Mbps support	-
BACnet/IP I/F Module	XGL-BIPT	••100/10 Mbps support BACNet/IP(electric)	-
Fnet I/F module	XGL-FMEA	• Field Bus master module	-
40-point connector	1473381-1	• 40-point connector (For I/O, special module)	-

Chapter 2 System Configuration
2-7

Note
1) For the further information about active coupler, optical converter, repeater and block type remote module, which are network devices, refer to the user’s manual of network. 2) O/S version of communication module applicable to XGK system is as follows.
Name	Module
FEnet	FDEnet	Cnet	Rnet	Pnet	Dnet	RAPIEnet	IFOS module
Model	XGL-EFMT XGL-EFMF	XGL-EDMT XGL-EDMF	XGL-C22A XGL-CH2A XGL-C42A	XGL-RMEA	XGL-PMEA	XGL-DMEA	XGL-EIMF XGL-EIMT XGL-EIMH	XGL-ESHF
Applicable version	V2.0 or above	V2.0 or above	V2.1 or above	V1.0 or above	V1.0 or above	V1.0 or above	V1.0 or above	V1.0 or above

Chapter 2 System Configuration
2-8
2.3 Basic System
2.3.1 Configuration method of Basic System
The features of Basic system consisted by connecting the main base and expanded base by a cable are
as follows. The number of stages of expanded base is limited according to the CPU type and the
allocation method of I/O No. is available to select the fixed type and variable type according to the
setting of basic parameter.

Classification	XGK-CPUE	XGK-CPUS XGK-CPUSN	XGK-CPUA	XGK XGK-CPUHN -CPUH	XGK XGK-CPUUN -CPUU
Max. expanded stages	1 stage	3 stages	3 stages	7 stages	7 stages
Max. no. of I/O Module install	24 Module	48 Module	48 Module	96 Module	96 Module
Max. I/O point	1,536 points	3,072 points	3,072 points	6,144 points	6,144 points
Max. extended distance	15m
Allocation of I/O No. (fixed type)	• Each slot of base is allocated by 60 points regardless module installation and type. • For one base, I/O no. of 16 slots is allocated. That is, the start no. of No.1 base becomes P00640. (Refer to 2.3.2) • The example of I/O no. of 12 Slot base is as below : I : input, O : output
0	1	2	3	4	5	6	7	8	9	10	11
P0 ~ P3F	P40 ~ P7F	P80 ~ P11F	P120 ~ P15F	P160 ~ P19F	P200 ~ P23F	P240 ~ P27F	P280 ~ P31F	P320 ~ P35F	P360 ~ P39F	P400 ~ P43F	P440 ~ P47F
Allocation of I/O no. (variable type)	• The point is allocated according to the assignment of installation module per slot. - If assigned installation module by I/O parameter, the assigned point is allocated. - The slot not assigned by I/O parameter shall be allocated automatically according to actual installation slot (Note: 8 point module shall be allocated by 16 point.) - The empty slot not assigned by I/O parameter shall be processed by 16 point. • Available to assign the point only by I/O parameter without module assignment. • The slot installed by special module or communication module is allocated by 16 point. • The example of I/O no. of 12 Slot base is as below : I : input, O : output
0	1	2	3	4	5	6	7	8	9	10	11
P00 ~ P0F	P10 ~ P1F	P20 ~ P3F	P40 ~ P7F	P80 ~ P8F	P90 ~ P10F	P110 ~ P12F	P130 ~ P16F	P170 ~ P18F	P190 ~ P19F	P200 ~ P21F	P220 ~ P23F

Notes

1) The allocation method of I/O no. shall be set in basic parameter.
2) For Main base, the base no. is fixed as “0” and the expanded base has a switch to set the base no.
3) In case of setting module type by I/O parameter, it starts the operation when the type of actually installed
module is matched.

PWR
I 16
I 16
I 32
I 64
O 16
O 32
O 32
O 64
I 32
O 32
O 16
O 32
CPU

SlotNo.

PWR
I 16
I 16
I 32
I 64
O 16
O 32
O 32
O 64
I 32
O 32
O 16
O 32
CPU

Chapter 2 System Configuration
2-9
2.3.2 Max. Configuration of Basic System (Point Fixed)

System Configuration
Example 1
-I/O point fixed
-XGK-CPUH
-8 slot base

Expanded base
Expanded cable
Main base
(base no.:0)
Base no.
setting switch:1
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7

1 2 3 4
CPU
P0000
~
P003F
P0040
~
P007F
Power
P0080
~
P011F
P0120
~
P015F
P0160
~
P019F
P0200
~
P023F
P0240
~
P027F
P0280
~
P031F
Slot no.: 0 1 2 3 4 5 6 7
P0640
~
P067F
P0680
~
P071F
Power
P0720
~
P075F
P0760
~
P079F
P0800
~
P083F
P0840
~
P087F
P0880
~
P091F
P0920
~
P095F
P1280
~
P131F
P1320
~
P135F
Power
P1360
~
P139F
P1400
~
P143F
P1440
~
P147F
P1480
~
P151F
P1520
~
P155F
P1560
~
P159F
P1920
~
P195F
P1960
~
P199F
Power
P2000
~
P203F
P2040
~
P207F
P2080
~
P211F
P2120
~
P215F
P2160
~
P219F
P2200
~
P223F
P2560
~
P259F
P2600
~
P263F
Power
P2640
~
P267F
P2680
~
P271F
P2720
~
P275F
P2760
~
P279F
P2800
~
P283F
P2840
~
P287F
P3200
~
P323F
P3240
~
P327F
Power
P3280
~
P331F
P3320
~
P335F
P3360
~
P339F
P3400
~
P343F
P3440
~
P347F
P3480
~
P351F
P3840
~
P387F
P3880
~
P391F
power
P3920
~
P395F
P3960
~
P399F
P4000
~
P403F
P4040
~
P407F
P4080
~
P411F
P4120
~
P415F
P4480
~
P451F
P4520
~
P455F
power
P4560
~
P459F
P4600
~
P463F
P4640
~
P467F
P4680
~
P471F
P4720
~
P475F
P4760
~
P479F
Chapter 2 System Configuration
2-10
2.3.3 Max. Configuration of Basic System (Point variable)

System Configuration
Example 2
-I/O point variable
-XGK-CPUH
-8 slot base
-When installing
16 point Module

Expanded cable
Main base
(base no.:0)
Base no.
setting switch:1
Expanded base
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7
Slot no.: 0 1 2 3 4 5 6 7

1 2 3 4
CPU
P0000
~
P000F
P0010
~
P001F
Power
P0020
~
P002F
P0030
~
P003F
P0040
~
P004F
P0050
~
P005F
P0060
~
P006F
P0070
~
P007F
Slot no.: 0 1 2 3 4 5 6 7
P0080
~
P008F
P0090
~
P009F
Power
P0100
~
P010F
P0110
~
P011F
P0120
~
P012F
P0130
~
P013F
P0140
~
P014F
P0150
~
P015F
P0160
~
P016F
P0170
~
P017F
Power
P0180
~
P018F
P0190
~
P019F
P0200
~
P020F
P0210
~
P021F
P0220
~
P022F
P0230
~
P023F
P0240
~
P024F
P0250
~
P025F
Power
P0260
~
P026F
P0270
~
P027F
P0280
~
P028F
P0290
~
P029F
P0300
~
P030F
P0310
~
P031F
P0320
~
P032F
P0330
~
P033F
Power
P0340
~
P034F
P0350
~
P035F
P0360
~
P036F
P0370
~
P037F
P0380
~
P038F
P0390
~
P039F
P0400
~
P040F
P0410
~
P041F
Power
P0420
~
P042F
P0430
~
P043F
P0440
~
P044F
P0450
~
P045F
P0460
~
P046F
P0470
~
P047F
P0480
~
P048F
P0490
~
P049F
Power
P0500
~
P050F
P0510
~
P051F
P0520
~
P052F
P0530
~
P053F
P0540
~
P054F
P0550
~
P055F
P0560
~
P056F
P0570
~
P057F
Power
P0580
~
P058F
P0590
~
P059F
P0600
~
P060F
P0610
~
P061F
P0620
~
P062F
P0630
~
P063F
Chapter 2 System Configuration
2-11
2.3.4 Terminator Connections
When an expansion base is connected, a terminator must installed for the system reliability on the
expansion connector (OUT) of the last expansion base.
2.3.4.1 Structure
2.3.4.2 Installation Position
Extension cable
Main base
(No. 0)
Expansion base
(No. 1)
Slot No. 0 1 2 3 4 5 6 7

CPU

P0000
~
P000F

P0010
~
P001F

Power

P0020
~
P002F

P0030
~
P003F

P0040
~
P004F

P0050
~
P005F

P0060
~
P006F

P0070
~
P007F

Slot No. 0 1 2 3 4 5 6 7

P0080
~
P008F

P0090
~
P009F

CPU

P0100
~
P010F

P0110
~
P011F

P0120
~
P012F

P0130
~
P013F

P0140
~
P014F

P0150
~
P015F

Terminator
Chapter 2 System Configuration
2-12
2.3.5 Module selection when configuring basic system
When configuring basic system, you must consider about size of each module’sDataRefresh area. DataRefresh area is used for
data transmission between CPU and modules in XGK/XGI CPU system. Data Refresh area is allocated to CPU memory,
irrespective of module’s operation. You must consider about maximum size of Data Refresh area. If it exceeds 1,024 words,
system doesn’t operate properly.
2.3.5.1 Size of each module’sDataRefresh area
(Unit :WORD)

Item	Type	Refresh Size	Item	Type	Refresh Size
Digital input module	XGI-A12A	1	Digital output module	XGQ-RY1A	1
XGI-A21A	1	XGQ-RY2A	1
XGI-A21C	1	XGQ-RY2B	1
XGI-D21A	1	XGQ-SS2A	1
XGI-D22A/B	1	XGQ-TR1C	1
XGI-D24A/B	2	XGQ-TR2A/B	2
XGI-D28A/B	4	XGQ-TR4A/B	4
Digital I/O module	XGH-DT4A	2	XGQ-TR8A/B	8
Analog input module	XGF-AC8A	22	Temperature detector input module	XGF-RD4A	30
XGF-AV8A	22	XGF-RD4S	30
XGF-AD8A	22	XGF-TC4S	30
XGF-AD16A	21	XGF-RD8A	23
XGF-AD4S	12	Temperature control module	XGF-TC4RT	31
XGF-AW4S	12	XGF-TC4UD	31
XGF-AC4H	11	High speed counter module	XGF-HO2A	25
Analog output module	XGF-DC8A	11	XGF-HD2A	25
XGF-DV8A	11	XGF-HO8A	25
XGF-DC4A	11	SOE module	XGF-SOEA	2
XGF-DV4A	11	Data log module	XGF-DL16A	32
XGF-DC4S	11	Communication module	XGL-EFMT	16
XGF-DV4S	11	XGL-EFMF	16
XGF-DC4H	7	XGL-ESHF	16
Analog I/O module	XGF-AH6A	11	XGL-DMEA	16
APM module ( Advanced Position module )	XGF-PO1A	2	XGL-PSEA	16
XGF-PO2A	2	XGL-PMEA	16
XGF-PO3A	2	XGL-PMEC	16
XGF-PD1A	2	XGL-EDMT	16
XGF-PD2A	2	XGL-EDMF	16
XGF-PD3A	2	XGL-EDST	16
XGF-PO1H	2	XGL-EDSF	16
XGF-PO2H	2	XGL-RMEA	16

Chapter 2 System Configuration
2-13

Item	Type	Refresh Size	Item	Type	Refresh Size
APM module ( Advanced Position module )	XGF-PO3H	2	Communication module	XGL-FMEA	16
XGF-PO4H	2	XGL-C22A	16
XGF-PD1H	2	XGL-C42A	16
XGF-PD2H	2	XGL-CH2A	16
XGF-PD3H	2	XGL-EIMT	16
XGF-PD4H	2	XGL-EIMH	16
XGF-PN8A	3	XGL-EIMF	16
XGF-PN8B	3	XGL-ES4T	16
XGF-M16M	1	XGL-BBM	16
XGF-M32E	4	XGL-EIPT	16

2.3.5.2Calculation of Data Refresh area’s size
1) Limit of DataRefresh area’s size
Sum of DataRefresh area’s size installedinsystem ≤ 1,024words
2) Example
In a system, below modules are installed.
XGI-D28A(20 EA),XGQ-D24A(10EA), XGF-AC8A(20EA), XGF-RD4A(10EA)
→ (4 * 20) + (2 * 10) + (22 * 20) + (30 * 10) = 840words ≤ 1,024 words

Note

1) Sum of Data Refresh area’s size must not exceed 1,024 words.
2) If size of Data Refresh area exceeds 1,024 words, XGK/I system doesn’t operate properly.

Chapter 2 System Configuration
2-14
2.4 Network System
XG series provides various network system for easy system configuration.
This provides Ethernet (FEnet, FDEnet) and Cnet for communication between PLC and upper system or
between PLCs and provides a dedicated Ethernet (FDEnet), Profibus-DP, DeviceNet, Rnet etc. as lower
control network system.
2.4.1 Network Systems
(1) Local Network
It is available to install max. 24 communication module without any constraint of Main base and
Expanded base. It is recommended to install the module with lots of communication capacity in Main
base considering system operation and performance. The constraints per function are shown on the
table as below.

Classification per purpose	XGK-CPUE	XGK-CPUS XGK-CPUSN	XGK-CPUA	XGK-CPUH XGK-CPUHN	XGK-CPU XGK-CPUUN
No. of max. high speed link setting module	12
No. of max. P2P service module	8
No. of max. dedicated service module	24

*Note 1) P2P service : 1 : 1 communication
(2) Computer Link (Cnet I/F) System
Cnet I/F system is the system to carry out the data communication between computer or various
external equipment and CPU module by using RS-232C, RS-422 (or RS-485) port of Cnet module.
For further information of Cnet module, please refer to the user’s manual related to Cnet module.
As mentioned on the above “Local Network”, Cnet module is available to install max. 24 bases
(including other communication module) regardless Main base and Expanded base.
Cnet does not provide high speed link but supports P2P service up to 8.
2.4.2 OS Version of Communication module
(1) O/S version of communication module applicable to XGK system
O/S version of communication module applicable to XGK system is as follows.

Name	Module
FEnet	FDEnet	Cnet	Rnet	Pnet	Dnet	RAPIEnet	IFOS module
Model	XGL-EFMT XGL-EFMF	XGL-EDMT XGL-EDMF	XGL-C22A XGL-CH2A XGL-C42A	XGL-RMEA	XGL-PMEA	XGL-DMEA	XGL-EIMF XGL-EIMT XGL-EIMH	XGL-ESHF
Applicable version	V2.0 or above	V2.0 or above	V2.1 or above	V1.0 or above	V1.0 or above	V1.0 or above	V1.0 or above	V1.0 or above

Chapter 2 System Configuration
2-15
2.4.3 Remote I/O System
This is the network system to control I/O module installed at far distance. Network system such as
Profibus-DP, DeviceNet, Rnet, Cnet etc is applied.
(1) I/O System Application per Network Type
Remote I/O module is classified by base board type and block type (Smart I/O etc.) and there might be
the one that does not support base board type according to network.

Network type (master)	Smart IO
Block type	Expansion type
Profibus-DP	O	O
DeviceNet	O	O
Rnet	O	O
Modbus(Cnet)	O	-
FEnet	-	O
Ethernet/IP	-	O
RAPIEnet	-	-

* The above description is subject to change for function improvement. For correct information,
please refer to each network system manual.
Max. no. of installation and max. no. of module per service is the same as local network.
In case that I/O module and Special module are installed together in Rack type Remote, one remote
master module shall use 1 high speed link and 1 P2P.
(2) Block Type Remote I/O System
1) System Configuration
This system is configured by Profibus-DP, DeviceNet and Rnet and it is available to use block type
Remote I/O regardless of the series. Profibus-DP and DeviceNet were developed based on
International Standard which enables to connect with Smart-I/O of our company as well as the
product of other manufacturer.
• Master module is available to install up to max. 12 and also available in the expanded base.
2) I/O allocation method and I/O no. assignment
• It is available to allocate ‘P’, ‘M’, ‘K’ and ‘D’ device to Remote I/O by high speed link parameter.
‘P’ area is recommended to use the forced ON/OFF function and initial reset function.
• Max. available point of I/O device (P area) is 32,768 point(P00000 ~P2047F).
• For the setting method of high speed link parameter per module, please refer to XG-PD manual.
XGP-ACF1
XGK-CPUH
XGL-****
Pnet/Dnet/Rnet
Master module
Main base

Smart-I/O

CHAPTER 3 General Specifications
3-1
Chapter 3 General Specifications
3.1 General Specifications
The General Specification of XGT series is as below.

No.	Items	Specifications	Related standards
1	Ambient temperature	0 ~ 55 °C
2	Storage temperature	-25 ~ +70 °C
3	Ambient humidity	5 ~ 95%RH (Non-condensing)
4	Storage humidity	5 ~ 95%RH (Non-condensing)
5	Vibration resistance	Occasional vibration	-
Frequency	Acceleration	Amplitude	times	IEC61131-2
5 ≤ f < 8.4 Hz	-	3.5mm	10 times each directions (X, Y and Z)
8.4 ≤ f ≤ 150Hz	9.8m/s2(1G)	-
Continuous vibration
Frequency	Acceleration	Amplitude
5 ≤ f < 8.4 Hz	-	1.75mm
8.4 ≤ f ≤ 150Hz	4.9m/s2(0.5G)	-
6	Shock resistance	• Peak acceleration: 147 m/s2(15G) • Duration: 11ms • Half-sine, 3 times each direction per each axis	IEC61131-2
7	Noise resistance	Square wave Impulse noise	±1,500 V	LSIS standard
Electrostatic discharge	4kV	IEC61000 IEC61131-1-2-2
Radiated electromagnetic field noise	80 ~ 1,000 MHz, 10V/m	IEC61131-2, IEC61000-1-3
Fast transient/bust noise	Segm ent	Power supply module	Digital/analog input/output communication interface	IEC61131-2 IEC61000-1-4
Voltage	2kV	1kV
8	Environment	Free from corrosive gasses and excessive dust
9	Altitude	Up to 2,000 ms
10	Pollution degree	2 or less
11	Cooling	Air-cooling

N0ote

1) IEC (International Electrotechnical Commission):
An international nongovernmental organization which promotes internationally cooperated standardization in
electric/electronic field, publishes international standards and manages applicable estimation system related with.
2) Pollution degree:
An index indicating pollution degree of the operating environment which decides insulation performance of the devices.
For instance, Pollution degree 2 indicates the state generally that only non-conductive pollution occurs. However, this state
contains temporary conduction due to dew produced.

Chapter 4 CPU Module
4-1
Chapter 4 CPU Module
4.1 Technical Specifications
There are 4 types of CPU modules; Standard type (XGK-CPUS), Economic type (XGK-CPUE), Advanced type
(XGK-CPUA) and High Performance type (XGK-CPUH), and their technical specifications are as follows.

Items	Specification	Remarks
XGK-CPUE	XGK-CPUS	XGK-CPUA	XGK-CPUH	XGK-CPUU
Operation method	Cyclic, Time-driven, Fixed Period	-
I/O control method	Scan synchronized batch method (refresh method), direct method by instruction	-
Program language	Ladder Diagram Instruction List SFC (Sequential Function Chart) ST (Structured Text)	-
Number of instructions	Basic	40	-
Application	700	-
Processing speed (Basic instruction)	LD	84 ns/Step	28 ns/Step	-
MOV	252 ns/Step	84 ns/Step	-
Real number operation	±: 1,442 ns(S), 2,870 ns(D) x : 1,948 ns(S), 4,186 ns(D) ÷ : 1,974 ns(S), 4,200 ns(D)	±: 602 ns(S), 1,078 ns(D) x : 1,106 ns(S), 2,394 ns(D) ÷ : 1,134 ns(S), 2,660 ns(D)	S: Single real number D: Double real number
Programming memory capacity (When check auto-allocation)	16kstep (64KB)	32kstep (128KB)	32kstep (128KB)	64kstep (256KB)	128kstep (512KB)	-
I/O point (setting available)	1,536	3,072	3,072	6,144	-
Data area	P	P00000 ~ P2047F (32,768 point)	-
M	M00000 ~ M2047F (32,768 point)	-
K	K00000 ~ K2047F (32,768 point)	-
L	L00000 ~ L11263F (180,224 point)	-
F	F00000 ~ F2047F (32,768 point)	-
T	100ms: T0000 – T0999 10ms: T1000 – T1499 1ms: T1500 – T1999 0.1ms: T2000 – T2047	Change area is available by parameter setting
C	C0000 ~ C2047

S	S00.00 ~ S127.99
D	D0000 ~ D19,999	D0000 ~ D32,767
U	U0.0 ~ U1F.31	U0.0 ~ U3F.31	U0.0 ~ U3F.31	U0.0 ~ U7F.31	data refresh area Special module
Z	128 points	Index
N	N00000 ~ N21,503
R	1 block	2 block	32K word per 1 block (R0 ~ R32767)
Flash area	2 Mbyte, 32 block	Controlled by R device

Chapter 4 CPU Module
4-2

Items	Specification	Remarks
XGK-CPUE	XGK-CPUS	XGK-CPUA	XGK-CPUH	XGK-CPUU
Program configu ration	Total number of program	256
Initialization task	1
Cyclic task	32
Internal device task	32
Operation mode	RUN, STOP, DEBUG
Self-diagnosis	Operation delay monitoring, memory error, input/output error, battery error, power error etc.
Program port	RS-232C(1CH), USB(1CH)	Modbus slave supported via RS-232C port
Data storage method at power off	Latch area setting at Basic parameter
Max. base expansion	1 stages	3 stages	3 stages	7 stages	Max. 15m
Internal consumption current	940mA	960mA
Weight	0.12kg

Note
- Supported functions according to CPU OS version: the following OS version and XG500 version is needed for each function
CPU OS	XG5000	Function	Remark
V3.0	V3.0	SFC, ST language Automatic assignment variable	-
V3.1	V3.1	Event input module(XGF-SOEA)	-
V3.2	V3.2	Effective conversion value, alarm function of analog input module	-
V3.4	V3.3	User defined function/function block for XGK Instruction for positioning (APM/XPM): VRD, VWR, XVRD, XVWR	-
V3.50	V3.4	Enhanced password function (in order to connect, XG5000 V3.4 or above is needed.) You can disable the Reset/D.Clear switch Version information is indicated to two decimal places (_OS_VER_PATCH flag added)	-
V3.60	V3.5	Instruction : TRAMP, RTRAMP, VTPP, XVTPP
V3.70	V3.6	Scan time of fixed cycle task flag P2P, HS enable-disable flag SOE flag

Chapter 4 CPU Module
4-3
The performance specifications of the CPU module (XGK-CPUUN/CPUHN/CPUSN) are as follows.

Items	Specification	Remarks
XGK-CPUSN	XGK-CPUHN	XGK-CPUUN
Operation method	Cyclic, Time-driven, Fixed Period	-
I/O control method	Scan synchronized batch method (refresh method), direct method by instruction	-
Program language	Ladder Diagram Instruction List SFC (Sequential Function Chart) ST (Structured Text)	-
Number of instructions	Basic	40	-
Application	700	-
Processing speed (Basic instruction)	LD	8.5 ns/Step	-
MOV	25.5 ns/Step	-
Real number operation	±: 182.8ns (S), 327.3ns (D) x : 336ns (S), 727ns (D) ÷ : 345ns (S), 808ns (D)	S: Single real number D: Double real number
Programming memory capacity (When check auto-allocation)	64kstep (256KB)	128kstep (512KB)	256kstep (1,024KB)	-
I/O point (setting available)	3,072	6,144	-
Data area	P	P00000 ~ P4095F (65,536 point)	-
M	M00000 ~ M4095F (65,536 point)	-
K	K00000 ~ K4095F (65,536 point)	-
L	L00000 ~ L11263F (180,224 point)	-
F	F00000 ~ F4095F (65,536 point)	-
T	100ms: T0000 – T2999 10ms: T3000 – T5999 1ms: T6000 – T7999 0.1ms: T8000 – T8191	Change area is available by parameter setting
C	C0000 ~ C4095	-
S	S00.00 ~ S255.99	-
D	D0000 ~ D262143	D0000 ~ D524287	-
U	U0.0 ~ U3F.31	U0.0 ~ U7F.31	Special module data refresh area
Z	256 points	Index
N	N00000 ~ N21503	-
R	2 block	8 block	16 block	32K word per 1 block (R0 ~ R32767)
Flash area	2 Mbyte, 32 block	Controlled by R device

Chapter 4 CPU Module
4-4

Items	Specification	Remarks
XGK-CPUSN	XGK-CPUHN	XGK-CPUUN
Program configu ration	Total number of program	256	-
Initialization task	1	-
Cyclic task	32	-
Internal device task	32	-
Operation mode	RUN, STOP, DEBUG	-
Self-diagnosis	Operation delay monitoring, memory error, input/output error, battery error, power error etc.	-
Program port	USB(1CH), Ethernet(1CH)
Data storage method at power off	Latch area setting at Basic parameter	-
Max. base expansion	3 stages	7 stages	Max. 15m
Internal consumption current	960mA	-
Weight	0.12kg	-

XGK-CPUUN/CPUHN/CPUSN has Ethernet communication. Performance Specifications are as follows.

Item	Specifications	Remarks
XGK-CPUSN/CPUHN/CPUUN
Ethernet	Features	1 Port	-
10/100BASE-TX	-
Auto negotiation (Full-duplex and half duplex)	-
Auto MDIX Crossover	-
Max. Support 4 channel	Support 8Kbyte each send and receive channel
Max. Distance between nodes : 100m	-
Max. Protocol size : 1500Byte	IP Fragmentation is not supported.
UTP, STP, FTP cables is available	FTP, STP is recommended to prevent noise
Service	Setting communication parameters with XG5000	-
Loader service (XG5000 connection) supported	remote stage 1 connection with PLC is available
LS protocol(XGT) supported.	Server function & TCP supported. UDP not supported.
other company’s protocol (MODBUS TCP/IP) supported

Chapter 4 CPU Module
4-5

Note
- Supported functions according to CPU OS version: the following OS version and XG500 version is needed for each function.
CPU OS	XG5000	Function	Remark
V1.0	V4.0	XGK-CPUUN/CPUHN/CPUSN are added.	-

4.2 Part Names and Functions

No.	Names	Description
①-a	RUN/STOP LED	This indicates the operation state of CPU module.  Green ON: indicates ‘in operation’ by ‘RUN’ mode state. ▶ ‘RUN’ operation by RUN/STOP mode switch ▶ ‘REMOTE RUN’ operation in the state that mode switch is at ‘STOP’  Red ON: indicates ‘in operation’ by ‘STOP’ mode state ▶ ‘STOP’ operation by RUN/STOP mode switch ▶ REMOTE ‘STOP’ operation in the state that mode switch is at ‘STOP’
①-b	REM LED	 ON (Yellow): indicates ‘remote enabled’ ▶ In case that ’REMOTE’ switch is ‘On’  OFF: indicates ‘remote disabled’ ▶ In case that ‘REMOTE’ switch is ‘Off’


-a
-a
  
-b
-c
-d
-e
-f
-b
-c

XGK-CPUH
RUN/STOP
REM
ERR
PS
BAT
CHK
Boot
/Nor
REMOTE
M.XCHG
RUN STOP
 RST D.CLR
Chapter 4 CPU Module
4-6

No.	Names	Description
①-c	ERR LED	 ON (Red): indicates that the error not possible to operate occurred.  OFF: indicates ‘no error’
①-d	PS LED (Programmable Status)	 ON (Red): ▶ In case that ‘user assigned flag’ is ‘On’ ▶ ‘In case of operating in the error state by ‘operation proceeding in the error’ setting ▶ ‘In case that the module is detached or other module is installed in the state that ‘M.XCHG‘ switch is ‘On’  OFF: ▶ Indicates ‘no error’
①-e	BAT LED	 ON (Red): in case that battery voltage is lowered  OFF: no battery error
①-f	CHK LED	 ON (Red): indicates the setting is different from standard setting (Available to add/delete[clear] by parameter) ▶ In case that ‘Module change’ switch is set as ‘Module change’ ▶ ‘In case of operating in ‘DEBUG mode’ ▶ ‘Forced ON’ setting state ▶ In case that ‘fault mask’, ‘SKIP’ flag is set ▶ In case that Warning occurs during operation ▶ Extended base power error  Blink: indicates in case arithmetic error occurs during Program Proceeding is set.  OFF: indicates during operation by standard setting
②-a	Boot/Nor switch	Used when downloading the O/S before releasing.  On (right): executes control action in normal operation mode.  Off (left): used for manufacturing, user’s operation prohibited. (Download mode of O/S)  Note: Boot/Nor switches should be both set in On (right) side. If set in Off (left) side, it may cause abnormal operation.
②-b	REMOTE enabled switch	Limits the operation of PLC by remote connection.  On (right): all function enabled (REMOTE mode)  Off (left): remote function limited ▶ D/L of program, Operation mode limited ▶ Monitor, data change enabled
②-c	M.XCHG (Module change switch)	Used in case of performing the module change during operation.  On (right): performs the module change ▶ Available to change the module only by key switch operation  Off (left): completes the module change
③	RUN/STOP mode switch	Sets the operation mode of CPU module.  STOP → RUN : executes the operation of program  RUN → STOP : stops the operation of program Operates prior to REMOTE switch.

Chapter 4 CPU Module
4-7

No.	Names	Description
④	Reset/ D.Clear switch	You can enable/disable Reset/D.Clear switch in “XG5000  Basic Parameter  Basic Operation Setup” 1. When Reset switch is enabled 2. When D.Clear switch is enabled  Note: DATA CLEAR acts only in “STOP” operation mode.
Operation	Result
move to left  return to center	Reset
move to left  keep 3 seconds or above  return to center	Overall reset
Operation	Result
move to right  return to center:	General data area and retain area (M, Automatic variable) will be cleared.
move to left  keep 3 seconds or above  return to center:	General data area, retain area (M, Automatic variable) and R area will be cleared.
⑤	USB connector	A connector to connect with peripherals (XG5000 etc.) (USB 1.1 support)
⑥	RS-232C connector	A connector to connect with peripherals  XG5000 connection: support basically  Modbus equipment connection: Modbus protocol support(Only as Server) TX: no.7 Pin, RX: no.8 Pin, GND: no.5 Pin
⑦	Battery built-in cover	Back-up battery built-in cover

Chapter 4 CPU Module
4-8
The name of each part about XGK-CPUUN/CPUHN/CPUSN is as followings.

No.	Name	Description
① - a	RUN/STOP LED	Shows the operation status of the CPU module.  Green light: ‘RUN’ mode; the module is in operation ▶ ‘RUN’ operation by RUN/STOP mode switch ▶ ‘Remote RUN’ operation with RUN/STOP mode switch in ‘STOP’  Red light: ‘STOP’ mode; the module is in operation ▶ ‘STOP’ operation by RUN/STOP mode switch ▶ ‘Remote STOP’ operation with Mode switch in ‘STOP’ ▶ If an error causing the suspension of operation is detected
① - b	REM LED	 On(yellow): remote enabled ▶ If ‘REMOTE’ switch is ‘On’;  Off: remote disabled ▶ If ‘REMOTE’ switch is ‘Off’

10/100 BASE-TX
XGK-CPUUN
RUN/STOP
REM
ERR
PS
BAT
CHK
LINK
TX/RX
REMOTE
M.XCHG
RUN STOP
RST D.CLR


-a
-a
  
-b
-c
-d
-e
-f
-b

 
Chapter 4 CPU Module
4-9

No.	Name	Description
① - c	ERR LED	 On(red): displaying an error of operation disabled  Off: displaying normal operation
① - d	PS LED (Programmable Status)	 On(red): ▶ If ‘User Defined Flag’ is ‘On’ ▶ Operation in erroneous status by ‘Operation in Error Status’ setting ▶ If removing the module or installing other module with ‘M.XCHG‘ switch ‘On’  Off: ▶ displaying normal operation
① - e	BAT LED	 On(red): low battery voltage  Off: normal battery level
① - f	CHK LED	 On(red): displayed if other settings but the standard setting is set (it can be added/deleted(cancelled) by parameters) ▶ If ‘Module Change’ switch is set to ‘Module Change’ ▶ If operating in ‘Debug Mode’ ▶ If ‘Forcible On’ setting ▶ If ‘Fault Mask’/ ‘SKIP’ flag is set ▶ If a warning occurs during operation ▶ In case of power fault of extension base  Off: displayed if operating in standard setting
② - a	REMOTE Switch	Remotely controlling the operation of PLC.  On(right): every function enabled (REMOTE mode)  Off(left): remote functions disabled ▶ Program D/L, operation mode control limited ▶ Monitor and data change allowed
② - b	M.XCHG (module change switch)	It replaces a module during operation.  On (right): replacing a module ▶ A module is replaced by operating the key switch  Off(left): module is replaced completely
③	RUN/STOP Mode switch	Setting the operation mode of the CPU module.  STOP → RUN : execute program operation  RUN → STOP : stop program operation The control is prior to Remote switch control.

Chapter 4 CPU Module
4-10

No.	Name	Description
④	Reset/ D.Clear switch	You can enable/disable Reset/D.Clear switch in “XG5000  Basic Parameter  Basic Operation Setup” 1. When Reset switch is enabled 2. When D.Clear switch is enabled  Data clear process operates only in “STOP” operation mode.
Operation	Result
move to left  return to center	Reset
move to left  keep 3 seconds or above  return to center	Overall reset
Operation	Result
move to right  return to center:	General data area and retain area (M, Automatic variable) will be cleared.
move to left  keep 3 seconds or above  return to center:	General data area, retain area (M, Automatic variable) and R area will be cleared.
⑤	USB connector	Connector for peripherals (XG5000 and etc): USB 1.1 supported
⑥	Ethernet connector	Connector for peripherals  XG5000 connection: basically supported  TCP/IP Server connection
⑦	Battery cover	Backup battery cover

4.3 Battery
4.3.1 Battery Specifications

Items	Specification
Nominal voltage/current	DC 3.0 V / 1,800 mAh
Warranty	5 years (ambient temperature)
Purpose	Program and data backup, RTC operation when power-off
Specification	Manganese dioxide lithium battery
Outer dimension (mm)	φ 17.0 X 33.5 mm

4.3.2 Notice in Using
1) Do not apply the heat or solder to the electric pole. (If not, battery life shortening may be caused.)
2) Do not measure the voltage with tester or have a short-circuit. (If not, fire or flames may be caused.)
3) Do not disassemble the battery.
4.3.3 Battery Durability
The durability of battery depends on power-out time, ambient temperature etc. However, these CPUs are
designed to use the battery around 5 years under normal circumstances.
If the voltage of battery is lowered, CPU module occurs ‘Battery voltage drop warning’ . It is available to check it
through CPU module LED and flag or error message of XG5000.
As the battery works for an amount of time normally even after ‘battery voltage drop warning’ occurs, you can
take an action after warning in the system of daily checking.
Chapter 4 CPU Module
4-11

Notes

In general, the battery warning occurs 5 years after purchasing but it may occur earlier due to a poor
battery or excessive current discharge caused by leakage current etc. If the warning occurs again within
the short time after battery change, you need to request A/S service for CPU module.

4.3.4 Changing the Battery
The battery used for program backup or data backup at power out needs the regular change. Even if the battery
is removed, program and power-out keeping data shall be kept for 30 minutes by super capacity but it is
required to change the battery as fast as possible.
The battery change procedure is as below.

Start to change the battery

Open the battery built-in cover
BAT LED OFF?
No

Poor battery

Draw the battery in use from the holder
and remove the connector.
Insert new battery into the holder to the
correct direction and connect the connector
Check if ‘BAT.’ LED of CPU module is OFF.
Yes
End
Chapter 5 Program Configuration and Operation Method
5 - 1
Chapter 5 Program Configuration and Operation Method
5.1 Program Instruction
5.1.1 Program Execution Methods
1) Cyclic operation method (Scan)
This is a basic program proceeding method of PLC that performs the operation repeatedly for the prepared
program from the beginning to the last step, which is called ‘program scan’. The series of processing like
this is called ‘cyclic operation method’. The processing is divided per stage as below.

Stage	Processing description
 Supply power & Reset

Start
Initialization processing
Input image area refresh	 Reads the state of input module and saves it in input image area before starting the operation of program.
Program operation processing Program start Program last step
Output image area refresh
END
 A stage to start the scan processing which is executed once when power is applied or Reset is executed, as below.  Address allocation of I/O module and type register
 Performs the operation in order from the program start to last step.
 If the operation of program is completed, it prints out the contents saved in output image area to output module.
 A processing stage to return to the first step after CPU module completes 1 scan processing and the processing performed is as below.  Update the current value of timer and counter etc.  User event, data trace service  Self-diagnosis  High speed link, P2P e-Service  Check the state of key switch for mode setting

 I/O module reset  Self-diagnosis execution
 Data clear

Chapter 5 Program Configuration and Operation Method
5 - 2
2) Interrupt Operation (Time-driven, Internal Device)
This is the method that stops the program operation in proceeding temporarily and carries out the
operation processing which corresponds to interrupt program immediately in case that there occurs the
status to process emergently during PLC program execution.
The signal to inform this kind of urgent status to CPU module is called ‘interrupt signal’ and there is a timedriven method that operates program every appointed time. Besides, there is an internal device start
program that starts according to the state change of device assigned inside.
3) Constant Scan (Fixed Period)
This is the operation method that performs the scan program every appointed time. This stands by for a
while after performing all the scan program, and starts again the program scan when it reaches to the
appointed time. The difference from constant program is the update of input/output and the thing to
perform with synchronization.
At constant operation, the scan time indicates the net program processing time where the standby time is
deducted. In case that scan time is bigger than ‘constant’, ‘_CONSTANT_ER [F0005C]’ flag shall be ‘ON’.
5.1.2 Operation Processing during Momentary Power Failure
CPU module detects the momentary power failure when input power voltage supplied to power module is
lower than the standard. If CPU module detects the momentary power failure , it carries out the operation
processing as follows.
1) Momentary power failure within 20ms
2) Momentary power failure exceeding 20ms

Notes

1) Momentary power failure?
This means the state that the voltage of supply power at power condition designated by PLC is
lowered as it exceeds the allowable variable range and the short time (some ms ~ some dozens ms)
interruption is called ‘momentary power failure ).

Input power
Within 20ms momentary power failure
(1) Stops the operation in the output state when
momentary power failure occurred.
(2) If momentary power failure is released, the
operation continues.
(3) Output voltage of power module keeps the value
within the standard.
(4) Even if the operation stops by momentary
power failure, timer measurement and interrupt
timer measurement shall be executed normally.
Input power
Momentary power failure exceeding 20ms momentary
power failure exceed
 Restart processing like at power input shall be
performed.
Chapter 5 Program Configuration and Operation Method
5 - 3
5.1.3 Scan Time
The time required to complete it from the first step 0 to the next step 0 of a program, that is, a time taken for a
control operation is called ‘scan time.’ It is directly related to the control performance of the system.
1) Operation and performance of XGK
Program execution time, I/O data process time and communication service time are important factors
affecting the ‘scan time.’
The XGK impressively reduces scan time by means of the improved data reception performance through
backplane, ladder program execution and ladder program execution by MPU and parallel execution of I/O
data scan etc.

Type	Program processing time	Module processing time
Ladder execution (32kstep)	System Task	Digital I/O module (32 points, 1module)	Analog module (8 ch, 1module)	Communication module (basic/extension) (200 byte, 1 block)
CPUSN/HN/UN	0.272 ms	0.2 ms	20 us	75 us	170 + 44 (200byte 1 block) ㎲
CPUA,H,U	0.896 ms	0.6 ms
CPUE,S	2.688 ms	0.8 ms

2) Calculation of scan time
The CPU module executes controls along the following steps. A user can estimate the control performance
of a system that the user is to structure from the following calculation.
(1) Scan time = ① Scan program process ＋ ② System check & Task process ＋ ③I/O data Refresh
+ ④ Network Service + ⑤ XG5000 Service + ⑥ User Task Program process
① Scan program process = no. of program steps created x 0.028 (㎲) [0.084 for CPUS]
② System check & Task process: 600 ㎲ ~ 1.0 ms [parameter depending on the usage of auxiliary
functions]
③ I/O data Refresh [including special module]: minimum 0.06ms~0.2ms
Program
Scan

① Ladder Scan ② System check & Task process	Ladder Sca Ladder Scan ④ Network Service ⑤ XG5000 service
I/O Module Data Refresh
Network Module Data exchange
Input	Output

I/O Module
Processing
Time
③ I/O data Refresh

Chapter 5 Program Configuration and Operation Method
5 - 4
④ Network Service = Service of communication module in basic base+ Service of communication
module in expansion base
= (No. of Service x 3 ㎲) + (total TRX data(byte)/4 x 0.056 [CPUS:0.112] ㎲)
+ (Comm. module TRX data of basic base (byte))/4 x 0.084 ㎲
+ (Comm. module TRX data of expansion base (byte))/4 x 0.280 ㎲
* The number of service and TRX data occurred within one scan are standard of calculation
⑤XG5000 Service process time: 100 ㎲ at the max data monitor
(But, in case of changing the monitor screen, scan time increases for the mean time. In case of
connected with “USB Max. Write”, 6ms. In case of connected “USB Normal Write”, 1.6ms.
⑥ Task Program process time: sum of task processing time that occurs within a scan; the time
calculation by task programs are as same as that of scan program.
(2) Example
The scan time of a system consisting of CPUH (program 16kstep) + six 32-point I/O modules + six analog
modules + four communication modules (200 byte 8 blocks per module)
Scan time(㎲) = ladder execution time + system processing time + digital module I/O processing
time + analog I/O processing time
+ communication module processing time + XG5000 Service processing time
= (16000 x 0.028) + (600) + (20 x 6) + (75 x 6) + ((170 + 44 x 8) x 4) + (100)
= 3806 ㎲
= 3.806 ㎳
2) Scan time monitor
(1) Scan time is saved into the following flag(F) areas.

 F0050 : max value of scan time (unit: 0.1ms)
 F0052 : current scan time value (unit: 0.1ms)

 F0051 : min value of scan time (unit: 0.1ms)

Set the “F” devices as INT type monitoring the scan time.
Chapter 5 Program Configuration and Operation Method
5 - 5
5.2 Program Execution
5.2.1 Program Configuration
The program is consisted of all function factors required to execute the specific control and saved in the built-in
RM or flash memory of CPU module. These function factors are generally classified as follows.

Function factor	Process description
Scan program	• Processing of signal that repeats regularly every 1 scan.
Time-driven interrupt program	• The program is performed according to the fixed time interval in case that the required processing time condition is as below.  In case that the faster processing than 1 scan average processing time is required  In case that the longer time interval than 1 scan average processing time is required  In case that program is processed with the appointed time interval
Subroutine program	• Only when some condition is satisfied.(in case that input condition of CALL instruction is On)

5.2.2 Program Execution Method
Here describes the program proceeding method that is executed when the power is applied or key switch is
‘RUN’.
The program performs the operation processing according to the configuration as below.
Operation start
Scan program
END
Subroutine program
Task program
Executes only
when the condition
is satisfied.
Chapter 5 Program Configuration and Operation Method
5 - 6
1) Scan Program
(1) Function
• This program performs the operation repeatedly from 0 step to last step in order prepared by the
program to process the signal that is repeatedly regularly every scan.
• In case that the execution condition of interrupt by task interrupt or interrupt module while executing
scan program is established, stop the current program in execution and perform the related
interrupt program.
2) Interrupt Program
(1) Function
• This program stops the operation of scan program and then processes the related function in prior
to process the internal/external signal occurred periodically/non-periodically.
(2) Type
• Task program is divided as below.
(a) Time-driven task program : available to use up to 32
(b) Internal device task program : available to use up to 32
- Time-driven task program
▶ Performs the program according to the fixed time internal.
- Internal device task program
▶ Performs the corresponding program when the start condition of internal device occurs.
▶ The start condition detection of device shall be performed after processing of scan program.

PPoin
1) For further information of interrupt program, please refer to 5.2.3 Interrupt.

Notes

Chapter 5 Program Configuration and Operation Method
5 - 7
5.2.3 Interrupt
For your understanding of Interrupt function, here describes program setting method of XG5000 which is an
XGT programming S/W. (For further information of XG5000, please refer to XG5000 user’s manual)
Scan Program

Notes

When power On, all Interrupts are in the state
‘Disable’.

Interrupt 1
Interrupt 1 occur (Program 1)
Interrupt 2
(Program 2)
Interrupt 2 occur

Interrupt 3
(Program 3)

Interrupt 2 occur

Interrupt 3 occur
Interrupt 2
(Program 2)
Interrupt 4 occur
Interrupt 4
(Program 4)
END
Chapter 5 Program Configuration and Operation Method
5 - 8
1) How to Prepare Interrupt Program
Generate the task in the project window of XG5000 as below and add the program to be performed by
each task. For further information, please refer to XG5000 user’s manual.
2) Task Type
Task type and function is as follows.

Type Spec	Cyclic task (interval task)	Internal device task (single task)
Task number	32	32
Start condition	Cyclic (setting up to max. 4,294,967.295 sec. by 1ms unit)	Internal device execution condition
Detection & execution	Cyclic execution per setting time	Retrieve the condition and execute after completing Scan Program
Detection delay time	Max. 0.2 ms delay	Delay as much as max. scan time
Execution priority	2 ~ 7 level setting (2 level is highest in priority.)	Same as left
Task no.	Within 0~31 range without user duplication)	With 64~95 range without user duplication

3) Processing Method of Task Program
Here describes common processing method and notices for Task Program.
(1) Features of Task Program
 Task Program is executed only when execution condition occurs without every scan repeat
processing. When preparing Task Program, please consider this point.
 For example, if a timer and counter were used in cyclic task program of 10 second cycle, this timer
occurs the tolerance of max. 10 seconds and the counter and the timer and as the counter checks
the input status of counter per 10 seconds, the input changed within 10 seconds is not counted up.
Chapter 5 Program Configuration and Operation Method
5 - 9
(2) Execution priority
 In case that several tasks to be executed are waiting, execute from the highest Task Program in
priority. When the same priority tasks are waiting, execute from the order occurred.
 Task priority relates to each task.
 The task program priority should be set considering the program features, importance and the
emergency when the execution requested.
(3) Processing delay time
There are some causes for Task Program processing delay as below. Please consider this when task
setting or program preparation.
 Task detection delay (Refer to detailed description of each task.)
 Program proceeding delay caused by Priority Task Program proceeding
(4) Relationship of initialize, Scan Program and Task Program
 User identification task does not start while performing Initialization Task Program.
 As Scan Program is set as lowest priority, if task occurs, stop Scan Program and process Task
Program in advance. Accordingly, if task occurs frequently during 1 scan or concentrates
intermittently, scan time may extend abnormally. Cares should be taken in case of task condition
setting.
(5) Protection of Program in execution from Task Program
 In case that the continuity of program execution is interrupted by high priority Task Program during
program execution, it is available to prohibit the execution of Task Program partially for the part in
problem. In this case, it is available to perform the program protection by ‘ DI(Task Program Start
Disabled) and ‘EI(Task Program Start Enabled)’ application instruction.
 Insert ‘DI’ application instruction in the start position of the part requiring the protection and insert ‘EI’
application instruction in the position to release. Initialization Task is not influenced by ‘DI’, ‘EI’
application instruction.
4) Time Driven Task Program Processing Method
Here describes the processing method in case that task (start condition) of Task Program is set as Timedriven.
(1) Items to be set in Task
 Set the execution cycle and priority which are the start condition of Task Program to execute. Check
the task no. to manage the task.
(2) Time-driven Task Processing
 Performs the corresponding Time-driven task program per setting time interval (execution cycle).

Notes

1) For further information of interrupt program, please refer to 5.2.3 Interrupt.

Chapter 5 Program Configuration and Operation Method
5 - 10
(3) Notice in using Time-driven Task Program
 When Time-driven task program is in execution currently or waiting for execution, if the demand to
execute the same task program occurs, the new occurred task shall be disregarded.
 Timer that makes a demand to execute Time-driven task program only while operation mode is
RUN mode, shall be added. The shutdown time shall be all disregarded.
 When setting the execution cycle of Time-driven task program, consider the possibility that the
demand to execute several Time-driven task program at the same time occurs.
If 4 Time-driven task programs that the cycle is 2sec, 4sec, 10sec and 20sec are used, 4 demands of
execution per 20 seconds shall be occurred at the same time and scan time may extend
instantaneously.
 You can check maximum, minimum, and current scan time of fixed cycle task with flag of fixed cycle
task
.
_CYCLE_TASK_SCANx_MAX : Maximum scan time of number ‘x’ Time-driven task (x=0~31)
_CYCLE_TASK_SCANx_MIN : Minimum scan time of number ‘x’ Time-driven task
_CYCLE_TASK_SCANx_CUR : Current scan time of number ‘x’ Time-driven task
Initial value of minimum scan time flag is 16#ffff. It can verify fixed cycle task is not used, or never
executed.
5) Internal Device Task Program Processing Method
Here describes the processing method of Internal Device Task Program which extended the task (start
condition) of Task Program from contact point to device as execution range.
(1) Items to be set in Task
 Set the execution condition and priority to the task being executed. Check the task no. for task
management.
(2) Internal Device Task Processing
 After completing the scan program execution in CPU module, if the condition of device that
becomes the start condition of internal device task program is met, according to the priority, it shall
be executed.
(3) Precautions in using internal Device Task Program
 Accordingly, even if the execution condition of internal device task program occurs in Scan Program
or Task Program (Time-driven), it shall not be executed immediately but executed at the time of
completion of Scan Program.
 If the demand to execute Internal Device Task Program occurs, the execution condition shall be
examined at the time of completion of Scan Program. Accordingly, if the execution condition of
Internal Device Task occurs by Scan Program or Task Program (Time-driven) during ‘1 scan’ and
disappears, the task shall not be executed as it is not possible to detect the execution at the time of
examination of execution condition.
6) Task Processing at the Momentary power failure
 When restarting the task as the momentary power failure time is long, disregard the task in standby and
the task issued during shutdown all and process only the task from the starting point.
 In the shutdown state within 20ms, the task in standby before shutdown shall be executed, after
recovering the shutdown. The cyclic task and Interrupt task that occurred in double during shutdown,
shall be disregarded.
Chapter 5 Program Configuration and Operation Method
5 - 11
7) Verification of Task Program
Verify the following contents after writing the Task Program.
(1) Is the task setting proper ?
If task occurs frequently more than needed or several tasks occur in one scan at the same time, scan
time may lengthen or be irregular. In case not possible to change the task setting, verify max. scan
time.
(2) Is the priority of task arranged well?
The low priority task program shall be delayed by the high priority task program, which results in
disabling the processing within the correct time and even task collision may occur as next task
occurs in the state that the execution of previous task is delayed. Consider the emergency of task
and execution time etc when setting the priority.
(3) Is the Task Program written in shortest?
If the execution time of Task Program is longer, scan time may lengthen or be irregular. Even it may
cause the collision of task program. Write the execution time as short as possible. (Especially,
when writing the cyclic task program, write the execution time so that the task program can be
executed within 10% cycle of the shortest task among several tasks.)
(4) Is program protection for the high priority task needed during program execution?
If other task is inserted during task program execution, complete the task in execution and operate the
standby tasks in the order of high priority. In case that it is not allowed to insert other task in Scan
Program, prevent the insert partially by using ‘DI’ and ‘EI’ application instruction. The problem may
occur while processing the global variables used commonly with other program or special or
communication module.
8) Program Configuration and Processing Example
If task and program are registered as below,
• Task registration :

T_SLOW ( cycle time	: = 10ms, Priority:= 3 )
PROC_1 ( internal device: = M0, Priority := 5 ) • Program registration : Program --> P0
Program --> Program --> Program -->	P0 (scan program) P1 (start by task T_SLOW) P2 (start by task PROC_1)

And program execution time and the occurrence time of interrupt signal is same as follows,
• Execution time of each Program : P0 = 17ms, P1 = 2ms, P2 = 7ms
• PROC_1 occur: The execution of program occurred during Scan Program is as below.
Chapter 5 Program Configuration and Operation Method
5 - 12
 Process per time

Time (ms)	Process
0	Scan started and scan program P0 started to execute
0~10	Program P0 executed
10~12	P1 execution demand, P0 stopped and P1 executed
17	P2 execution demand
12~20	P1 execution completed and continues the stopped P0
20~22	P1 execution demand, P0 stopped and P1 executed
22~25	P1 execution completed and the stopped P0 execution finished
25	P2 execution demand check at the completion time of Scan Program(P0), and P2 executed
25~30	Program P2 executed
30~32	P1 execution demand, P2 stopped and P1 executed
32~34	P1 execution completed and the stopped P2 execution finished
34	New scan starts (P0 starts to execute)

Chapter 5 Program Configuration and Operation Method
5 - 13
5.3 Operation Mode
For operation mode of CPU module, there are 3 types such as RUN mode, STOP mode and DEBUG mode..
Here describes the operation processing of each operation mode.
5.3.1 RUN Mode
This is the mode to execute Program operation normally.
1) Processing at Mode Change
At the beginning, execute initialization of data area and examine the effectiveness of program and judge
the possibility of execution.
2) Operation Processing Contents
Execute I/O refresh and Program operation.
(1) Detects the start condition of Interrupt Program and executes Interrupt Program.
(2) Examines the normal operation or missing of built-in module.
(3) Communication service and other internal processing.
RUN mode first scan start

Initialize data area

Examine Program effectiveness and
judge the possibility of execution

Execute input refresh
Program execute, Interrupt Program
execute

Examine the normal operation or
missing of built-in module

Communication service and internal
processing

Execute output refresh

Operation
mode change
RUN mode keep
Change to other mode
Operation by changed operation
mode
Chapter 5 Program Configuration and Operation Method
5 - 14
5.3.2 STOP Mode
This is the mode in stop state without Program operation. It is available to transmit the program through
XG5000 only in Remote STOP mode.
1) Processing at Mode Change
Clear the output image area and execute output refresh.
2) Operation Processing Contents
(1) Executes I/O refresh.
(2) Examines the normal operation or missing of built-in module.
(3) Communication service or other internal processing.
5.3.3 DEBUG Mode
This is the mode to detect Program error or trace the operation process and the conversion to this mode is
available only in STOP mode. This is the mode to check the program execution state and the contents of each
data and verify the program.
1) Processing at Mode Change
(1) Initializes the data area at the beginning of mode change.
(2) Clears the output image area and execute input refresh.
2) Operation Processing Contents
(1) Executes I/O refresh.
(2) Debug operation according to setting state.
(3) After finishing Debug operation by the end of Program, execute output refresh.
(4) Examine the normal operation or missing of built-in module.
(5) Executes communication service or other service.
3) Debug Operation Condition
There are 4 conditions for Debug operation and in case that it reaches break point, it is available to set
other type of break point.

Operation condition	Description
Execute by one operation unit (step over)	With operation instruction, it executes one operation unit and then stops.
Execute according to Break Point	If break point is assigned in Program, it stops at the assigned break point.
Execute according to the state of contact point	If the contact area desired to watch and the state (Read, Write, Value) desired to stop are assigned, it stops when the assigned operation occurs at the assigned contact point.
Execute according to scan times	If scan times to operate are assigned, it operates as much as the assigned scan times and stops.

4) Operation Method
(1) After setting Debug operation condition at XG5000, execute the operation.
(2) Interrupt Program is available to set whether or not to operate (Enable/Disable) by each Interrupt unit.
(For further information, please refer to Chapter 9 Debugging, XG5000 user’s manual.)
Chapter 5 Program Configuration and Operation Method
5 - 15
5.3.4 Changing Operation Mode
1) Operation Mode Change Method
The method to change operation mode are as follows.
(1) By mode key of CPU module
(2) By connecting the programming tool (XG5000) to communication port of CPU
(3) By changing the operation mode of other CPU module connected to network by XG5000 connected to
communication port of CPU
(4) By using XG5000, HMI, computer link module connected to network
(5) By ‘STOP‘ instruction during program execution
2) Type of Operation Mode
The operation mode setting is as follows.

Operation mode switch	Remote enabled switch	XG5000 instruction	Operation mode
RUN	X	X	Run
STOP	ON	RUN	Remote Run
STOP	Remote Stop
Debug	Debug Run
OFF	Mode change execute	Previous operation mode
RUN -> STOP	X	-	Stop

(1) Remote mode conversion is available only in the state of ‘Remote Enabled: On’, ‘Mode switch: Stop’.
(2) In case of changing the Remote ‘RUN’ mode to ‘STOP’ by switch, operate the switch as follows.
(STOP)  RUN  STOP .

Notes

1) In case of changing Remote RUN mode to RUN mode by switch, PLC operation continues
the operation without interruption.
2) It is available to modify during RUN in RUN mode by switch but the mode change
operation by XG5000 is limited. This should be set only in case that remote mode change
is not allowed.

Chapter 5 Program Configuration and Operation Method
5 - 16
5.4 Memory
There are two types of memory in CPU module that the user can use. One is Program Memory that saves the
user program written by the user to build the system, and the other is Data Memory that provides the device area
to save the data during operation.
5.4.1 Program Memory
The configuration of user program memory is as below.

Items	Memory Capacity (Kbyte)
CPUUN	CPUHN	CPUSN	CPUU	CPUH	CPUA	CPUS	CPUE
Parameter Setting area : • Basic parameter area • I/O parameter area • Special module parameter area • Communication module parameter area • User Event parameter area • Data Trace parameter area	320	320	320	320	320
Program Save area • Scan Program area 1 • Scan Program area 2 • Variable/Explanation sentence area	2,320	1,288	772	704	352
System area • User Event Data area • Data Trace Data area • System Log area • Device Backup area	2,552	2,040	1,656	896	896
Execution Program area • Execution Program area1 • Execution Program area2 • System Program area	4,096	2.048	1,024	2,048	1,024	512	512	256

Chapter 5 Program Configuration and Operation Method
5 - 17
5.4.2 Data Memory
1) Bit Device area
Various Bit Device are provided per function. The indication method is indicated by device type for first digit,
word position by decimal for middle digit and bit position for the last digit.

Area per Device	Device features	Description
P00000 ~ P4095F	I/O device “P” 65,536 points	Image area to save the state of I/O device. After reading the input module state, saves it in the corresponding P area and sends P area Data saving the operation result to output module.
M00000 ~ M4095F	I/O device “M” 65,536 points	Internal Memory provided to save Bit Data in Program
L00000 ~ L11263F	I/O device “L” 180,224 points	Device to indicate high speed link/P2P service state information of communication module.
K00000 ~ K4095F	I/O device “K” 65,536 points	Device area to preserve the data during power shutdown, which is used without setting power shutdown preservation parameter separately.
F00000 ~ F4095F	I/O device “F” 65,536 points	System flag area that manages the flag necessary for system operation in PLC.
T0000 ~ T8191	I/O device “T” 8,192 points	Area to save the state of timer device
C0000 ~ C4095	I/O device “C” 4,096 points	Area to save the state of counter device
S00.00 ~ S255.99	Step controller “S” 256 x 100 steps	Relay for step control

Note

The following devices are limited to the area according to CPU type.

구분	P***1	M***2	K***3	F***4	T***5	C***6	S***7
XGK-CPUE	P2047F	M2047F	K2047F	F2047F	T2047	C2047	S127.99
XGK-CPUS
XGK-CPUA
XGK-CPUH
XGK-CPUU
XGK-CPUSN	P4095F	M4095F	K4095F	F4095F	T8191	C4095	S255.99
XGK-CPUHN
XGK-CPUUN

Chapter 5 Program Configuration and Operation Method
5 - 18
2) Word Device area

Area per Device	Device features	Description
D00000 ~ D524287 ***1	Data Register “D” 524,288 words	Area to preserve the internal data. Bit expression possible.
R00000 ~ R32767	File Register “R” 32,768 words	Dedicated device to access Flash Memory. Consisted of 1,2,8,16 banks depending on the CPU Types Bit expression possible
U00.00 ~ U7F.31 ***2	Analog Data Register “U” 4,096 words	Register used to read data from special module installed in the slot. Bit expression possible
N00000 ~ N21503	Communication Data Register “N” 21,504 words	P2P Service Save area of communication module. Bit expression impossible
Z000 ~ Z255	Index Register “Z” 256 words	Dedicated device to use Index function Bit expression impossible
T0000 ~T 8191	Timer Current Value Register “T” 8192 words	Area to indicate the current value of timer
C0000 ~C 4095	Counter Current Value Register “C” 4096 words	Area to indicate the current value of counter

Notes

The following devices are limited to the area according to CPU type.

구분	D***1	U***2	Z***3	T***4	C***5
XGK-CPUE	D19999	U1F.31	Z127	T2047	C2047
XGK-CPUS	U3F.31
XGK-CPUA	D32767	U3F.31
XGK-CPUH	U7F.31
XGK-CPUU
XGK-CPUSN	D262143	U3F.31	Z255	T8191	C4095
XGK-CPUHN	D524287	U7F.31
XGK-CPUUN

Chapter 5 Program Configuration and Operation Method
5 - 19
5.5 Configuration Diagram of Data Memory
5.5.1 XGK-CPUE
P2047
M0000
Bit Data area Word Data area User Program area

I/O Relay
(32768 points)
“P”

Keep Relay
(32768 points)
“K”

Special Relay
(32768 points)
“F”

Auxiliary Relay
(32768 points) “M”

Auxiliary Relay
(180224 points) “L”
P0000
L00000
M2047
K0000
K2047
F0000
F2047

Data Register
(20000 word)
“D”

File Register
(32K word * 1 bank)
“R”

D00000
D19999

Timer setting value
(2048 words)

Timer current value
(2048 words)

Counter setting value
(2048 words)

Counter current
value (2048 words)

T0000
T2047
T0000 T2047 C0000
C2047
C0000
C2047

Parameter area

User Program area
(16K step)

Timer
(2048 points)
“T”

Counter
(2048 points)
“C”

Comm. Data Register
(N21504 words)
“N”
T0000
N00000
N21503
Step Controller
(128 x 100 step)
S00.00~S127.99 “S”
S00
S127
0 ~ F 0000 ~ FFFF
C0000
C2047
R00000
R32767
Index Register
(128 words)
U1F.31
Z127 “Z”
Analog Data
Register
(1024 words) “U”
U00.00
Z000
L11263
T2047
Chapter 5 Program Configuration and Operation Method
5 - 20
5.5.2 XGK-CPUS
Bit Data area Word Data area User Program area

I/O Relay
(32768 points)
“P”

Keep Relay
(32768 points)
“K”

Special Relay
(32768 points)
“F”

Auxiliary Relay
(32768 points) “M”

Auxiliary Relay
(180224 points) “L”
P0000
P2047
M0000
L00000
M2047
K0000
K2047
F0000
F2047

Data Register
(20000 word)
“D”

File Register
(32K word * 1 bank)
“R”

D00000
D19999

Timer setting value
(2048 words)

Timer current value
(2048 words)

Counter setting value
(2048 words)

Counter current
value (2048 words)

T0000
T2047
T0000 T2047 C0000
C2047
C0000
C2047

Parameter area

User Program area
(32K step)

Timer
(2048 points)
“T”

Counter
(2048 points)
“C”

Comm. Data Register
(N21504 words)
“N”
T0000
N00000
N21503
Step Controller
(128x100 step)
S00.00~S127.99 “S”
S00
S127
0 ~ F 0000 ~ FFFF
C0000
C2047
R00000
R32767
Index Register
(128 words)
U3F.31
Z127 “Z”
Analog Data
Register
(2048 words) “U”
U00.00
Z000
L11263
T2047
Chapter 5 Program Configuration and Operation Method
5 - 21
5.5.3 XGK-CPUA
Bit Data area Word Data area User Program area

I/O Relay
(32768 points)
“P”

Keep Relay
(32768 points)
“K”

Special Relay
(32768 points)
“F”

Auxiliary Relay
(32768 points) “M”

Auxiliary Relay
(180224 points) “L”
P0000
P2047
M0000
L00000
M2047
K0000
K2047
F0000
F2047

Data Register
(32768 word)
“D”

File Register
(32K word * 2bank)
“R”

D00000
D32767

Timer setting value
(2048 words)

Timer current value
(2048 words)

Counter setting value
(2048 words)

Counter current
value (2048 words)

T0000
T2047
T0000 T2047 C0000
C2047
C0000
C2047

Parameter area

User Program area
(32K step)

Timer
(2048 points)
“T”

Counter
(2048 points)
“C”

Comm. Data Register
(N21504 words)
“N”
T0000
N00000
N21503
Step Controller
(128x100 step)
S00.00~S127.99 “S”
S00
S127
0 ~ F 0000 ~ FFFF
C0000
C2047
R00000
R32767
Index Register
(128 words)
U3F.31
Z127 “Z”
Analog Data
Register
(2048 words) “U”
U00.00
Z000
L11263
T2047
Chapter 5 Program Configuration and Operation Method
5 - 22
5.5.4 XGK-CPUH
P2047
M0000
L11263
Bit Data area Word Data area User Program area

I/O Relay
(32768 points)
“P”

Keep Relay
(32768 points)
“K”

Special Relay
(32768 points)
“F”

Auxiliary Relay
(32768 points)
“M”

Auxiliary Relay
(180224points)
“L”
P0000
L00000
M2047
K0000
K2047
F0000
F2047

Data Register
(32768 words)
“D”

File Register
(32K words * 2bank)
“R”

D00000
D32767

Timer setting value
(2048 words)

Timer current value
(2048 words)

Counter setting value
(2048 words)

Counter current
value (2048 words)

T0000
T2047
T0000 T2047 C0000
C2047
C0000
C2047

Parameter area

User Program area
(64K step)

Timer
(2048 points)
“T”

Counter
(2048 points)
“C”

Comm. Data Register
(N21504 words)
“N”
T0000
N00000
N21503
Step Controller
(128x100 step)
S00.00~S127.99 “S”
S00
S127
0 ~ F 0000 ~ FFFF
C0000
C2047
R00000
R32767
Index Register
(128 words)
U7F.31
Z127 “Z”
Analog Data
Register
(4096 words) “U”
U00.00
Z000
T2047
Chapter 5 Program Configuration and Operation Method
5 - 23
5.5.5 XGK-CPUU
Bit Data area Word Data area User Program area

I/O Relay
(32768 points)
“P”

Keep Relay
(32768 points)
“K”

Special Relay
(32768 points)
“F”

Auxiliary Relay
(32768 points) “M”

Auxiliary Relay
(180224points) “L”
P0000
P2047
M0000
L00000
M2047
K0000
K2047
F0000
F2047

Data Register
(32768 words)
“D”

File Register
(32k words * 2Bank)
“R”

D00000
D19999

Timer setting value
(2048 words)

Timer current value
(2048 words)

Counter setting value
(2048 words)

Counter current value
(2048 words)

T0000
T2047
T0000
T2047 C0000
C2047
C0000
C2047

Parameter area

User Program area
(128k step)

Timer
(2048 points) “T”

Counter
(2048 points) “C”

Comm. Data Register
(N21504 words) “N”
T0000
N00000
N21503
Step Controller
(128 x 100 step)
S00.00~S127.99 “S”
S00
S127
0 ~ F 0000 ~ FFFF
C0000
C2047
R00000
R32767
Index Register
(128 words)
U7F.31
Z127 “Z”
Analog Data
Register
(4096 words) “U”
U00.00
Z000
L11263
T2047
Chapter 5 Program Configuration and Operation Method
5 - 24
5.5.6 XGK-CPUSN
P4095
M0000
Bit Data area Word Data area User Program area

I/O Relay
(65536 points)
“P”

Keep Relay
(65536 points)
“K”

Special Relay
(65536 points)
“F”

Auxiliary Relay
(65536 points) “M”

Auxiliary Relay
(180224points) “L”
P0000
L00000
M4095
K0000
K4095
F0000
F4095

Data Register
(262143 words)
“D”

File Register
(32k words * 2Bank)
“R”

D00000
D19999

Timer setting value
(8192 words)

Timer current value
(8192 words)

Counter setting value
(4096 words)

Counter current value
(4096 words)

T0000
T8191
T0000
T8191 C0000
C4095
C0000
C4095

Parameter area

User Program area
(64k step)

Timer
(8192 points) “T”

Counter
(4096 points) “C”

I/O Relay
(65536 points)
“P”

Keep Relay
(65536 points)
“K”

Special Relay
(65536 points)
“F”

Auxiliary Relay
(65536 points) “M”

Auxiliary Relay
(180224points) “L”
P0000
L00000
M4095
K0000
K4095
F0000
F4095

Data Register
(524287 words)
“D”

File Register
(32k words * 8Bank)
“R”

D00000
D524287

Timer setting value
(8192 words)

Timer current value
(8192 words)

Counter setting value
(4096 words)

Counter current value
(4096 words)

T0000
T8191
T0000
T8191 C0000
C4095
C0000
C4095

Parameter area

User Program area
(128k step)

Timer
(8192 points) “T”

Counter
(4096 points) “C”

I/O Relay
(65536 points)
“P”

Keep Relay
(65536 points)
“K”

Special Relay
(65536 points)
“F”

Auxiliary Relay
(65536 points) “M”

Auxiliary Relay
(180224points) “L”
P0000
L00000
M4095
K0000
K4095
F0000
F4095

Data Register
(524287 words)
“D”

File Register
(32k words * 16Bank)
“R”

D00000
D524287

Timer setting value
(8192 words)

Timer current value
(8192 words)

Counter setting value
(4096 words)

Counter current value
(4096 words)

T0000
T8191
T0000
T8191 C0000
C4095
C0000
C4095

Parameter area

User Program area
(256k step)

Timer
(8192 points) “T”

Counter
(4096 points) “C”

Comm. Data Register
(N21504 words) “N”
T0000
N00000
N21503
Step Controller
(256 x 100 step)
S00.00~S255.99 “S”
S00
S255
0 ~ F 0000 ~ FFFF
C0000
C4095
R00000
R32767
Index Register
(256 words)
U7F.31
Z255 “Z”
Analog Data
Register
(4096 words) “U”
U00.00
Z000
L11263
T8191
Chapter 5 Program Configuration and Operation Method
5 - 27
5.5.9 Data Latch Area Setting
When PLC stops and restarts the data required for operation or the data occurred during operation, if you
want to keep and use those data, data latch can be used and it is available to use a certain area of some
data device as latch area by parameter setting.
The below shows the features for latch device.

Device	1st latch	2nd latch	Features
P	X	X	Image area to save the state of I/O device
M	O	O	Internal device area
K	X	X	Device keeping the device state during power shutdown
F	X	X	System flag area
T	O	O	Timer related area (Bit/words both)
C	O	O	Counter related area (Bit/words both)
S	O	O	Relay for step control
D	O	O	General words data save area
U	X	X	Analog Data Register (latch disabled )
L	X	X	High speed link/P2P Service state device of communication module (latch enabled)
N	X	X	P2P Service address area of communication module (latch enabled)
Z	X	X	Index dedicated Register (latch disabled)
R	X	X	Flash memory dedicated area (latch enabled)

Notes

1) K, L, N, R devices are basically latched.
2) K, L, R devices operate like the 1st Latch that clears data by using Overall Reset or the CPU
module D.CLR switch.
3) For more information, refer to the Online section of the XG 5000 user’s manual.

Chapter 5 Program Configuration and Operation Method
5 - 28
4) Data Latch Area Operation
The method to delete the latched data is as below.
- D.CLR switch operation of CPU module
- latch 1, latch 2 clear operation by XG5000
- write by Program (initialization program recommended)
- write ‘0’ FILL from XG5000 monitor mode.
D.CLR Clear does not operate in RUN mode. Convert to STOP mode to operate. Also when clearing by
D.CLR switch, bear in mind that general area shall be initialized.
When operating D.CLR momentarily, latch 1 area only shall be removed. If keeping D.CLR for 3
seconds, 6 LEDs shall be blinked and at this time, if returning the switch, even latch 2 area shall be
cleared.
For keep or reset (clear) operation of latch area data according to PLC operation, please refer to the below
table.

No.	Classification	Detailed operation	Latch 1	Latch 2	Remarks
1	Power change	Off/On	Keep	Keep	-
2	Reset switch	Reset	Keep	Keep	-
Overall reset	Reset	Keep	-
3	D.CLR switch	Clear Latch 1	Reset	Keep	-
Clear Latch 2	Reset	Reset	-
4	Program write (online)	-	Keep	Keep	-
5	Data broken	SRAM broken by battery error	Reset	Reset	-
Data broken by other reason	Reset	Reset	-
6	XG5000 online	Clear Latch 1	Reset	Keep	-
Clear Latch 2	Reset	Reset	-

5) Data Initialization
In case of Memory Delete state, the memory of all device shall be cleared as ‘0’. In case of giving the data
value at the beginning according to system, please use the initialization task.
Chapter 6 Function of CPU Module
6 -1
Chapter 6 Functions of CPU Module
6.1 Self-diagnosis
(1) Self-diagnosis function means the function that CPU module diagnoses the error of PLC system itself.
(2) If the power of PLC system is applied or the error occurs during operation, it detects the error and prevents
the abnormal operation.
6.1.1 Scan Watchdog Timer
WDT (Watchdog Timer) is the function to detect the program congestion by the error of hardware and
software of PLC CPU module.
1) WDT is the timer used to detect the operation delay by user program error. The detection time of WDT
is set in Basic parameter of XG5000.
2) If WDT detects the excess of detection setting time while watching the elapsed time of scan during
operation, it stops the operation of PLC immediately and makes the output all off.
3) If the excess of Scan Watchdog Time is expected in the program processing of specific part while
performing the user program (FOR ~ NEXT instruction, CALL instruction), clear the timer by using ‘WDT’
instruction.
‘WDT’ instruction initializes the elapsed time of Scan Watchdog Timer and starts the time measurement
from 0 again.
(For further information of WDT instruction, please refer to Instruction.)
4) To clear the error state of watchdog, we can use the following method : power re-supply, manipulation
of manual reset switch, mode conversion to STOP mode.

Notes

1) The setting range of Watchdog Timer is 10 ~ 1000ms (1ms unit).

0 1 2 3 ….. …8 9

0 1 2 …
0 1 2 … …6 7

0 1 2 …

WDT Reset WDT instruction SCAN END
execution
WDT
count(ms) SCAN END

Chapter 6 Function of CPU Module
6 -2
6.1.2 I/O Module Check Function
This function is to check the error state of I/O module at the time of start or during operation.
1) In case that the module different from parameter setting is built-in at the time of start or it occurs the error
or
2) In case I/O module is removed or occurs the error during operation,
the error state is detected and warning lamp (ERR) in front of CPU module and then CPU stops to operate.
6.1.3 Battery Voltage Check Function
If battery voltage falls less than memory backup voltage, CPU module detects it and informs of it. The warning
lamp(BAT) in front of CPU module shall be ON.
For further information, please refer to “4.3.3 Durability of Battery”.
6.1.4 Error History Save Function
CPU module has the function that records the error history and analyzes the cause of the error to take a
proper action if the error occurs. (Refer to 6.6.1 Error History)
This is the function to save each error code in special relay F0006.

Notes

All results of self-diagnosis shall be recorded in ‘F’ device area.
For further information of self-diagnosis comments and error actions, please refer to Chapter 12
Trouble shooting, 12.5 Error Code List.

6.1.5 Troubleshooting
1) Classification of Error
The error occurs by PLC itself error, error in system configuration or error detection from operation results.
The error is classified by heavy error mode that stops the operation for the system safety and light error
mode that informs of the error occurrence warning to the user and continues the operation.
The error causes of PLC system is as follows.
 PLC hardware error
 Error in system configuration
 Operation error during user program proceeding
 Error detection by external device failure
2) Action Mode in case that Error Occurs
If error occurs, PLC system records the error comments in flag and stops to operate or continues the
operation according to error mode.
Chapter 6 Function of CPU Module
6 -3
(1) PLC hardware error
In case of heavy error that the normal operation of PLC such as CPU module, power module is disabled,
the system ‘stop’s and in case of light error such as battery error, it continues to operate.
(2) Error in system configuration
This error occurs when hardware configuration of PLC is different from the configuration identified in
software, and the system stops.
(3) Operation Error during User Program Proceeding
This is the error occurred during user program proceeding and in case of numeric operation error, it is
indicated in the error flag and the system continues to operate. While performing the operation, if the
operation time exceeds the scan watchdog time or the built-in I/O module can not be controlled normally,
the system stops.

Notes

1) The operation process is determined by selecting ‘Basic Parameters → Error Operation
Setup → Continue running when an arithmetic error occurs’.
2) The default is set to ‘Continue running when an arithmetic error occurs’.

(4) Error detection by external device error
This is to detect the error of external control device by PLC user program. In case of heavy error, the
system stops but in case of light error, the system indicates the error state only and continues to operate.

Notes

1) If the error occurs, the error codes are saved in special relay F1026.
2) The error code is saved in F1027 when a soft-fault is detected.
3) For further information on the Flag, please refer to Appendix 1 Flag List.

Chapter 6 Function of CPU Module
6 -4
6.2 Clock
CPU module has a built-in clock device (RTC). RTC continues the clock action by battery backup even in case
of power off or instantaneous interruption.
It is available to perform the time management such as operation history or failure history of system by using a
clock data of RTC. The current time of RTC can be updated in F device related to the clock every scan.
1) Read and Setting from XG5000
Click ‘PLC RTC’ from ‘PLC information’ of online mode.
The time of PLC RTC is displayed. If the time of PLC RTC is wrong, you can adjust the time correct by
setting the time directly to transmit to PLC or selecting ‘Synchronize with PC clock’ that transmits the time
of PC connected to PLC.
2) RTC Read by Device
It is available to monitor RTC by special device as shown on the table below.

RTC Read F device	Data example	Description
_MON_YEAR (F0053)	h0599	May xx99
_TIME_DAY (F0054)	h1512	12(day), 15 (time)
_SEC_MIN (F0055)	h4142	42min 41sec
_HUND_WK (F0056)	h2001	Monday 20xx

RTC Data of _TIME_DAY_DT is displayed by 24hours system.
Chapter 6 Function of CPU Module
6 -5
3) RTC Data Modification by Program
It is available for the user to set the RTC value by program.
This function is used when setting the time manually through external Digit switch or making the system
that corrects the time periodically through network.
‘DATEWR’ instruction is to insert the setting value in the F area device below and write the time to RTC at
scan END.

RTC write F device	Comments	Setting range
_MON_YEAR_DT (F1034)	Month/Year	1984 ~ 2163 Year, Jan.~ Dec.
_TIME_DAY_DT (F1035)	Time/Day	1~31 Days, 0~23 Hour
_SEC_MIN_DT (F1036)	Second/Minute	0~59 minute, 0~59 second
_HUND_WK_DT (F1037)	100years/Weekday	0 ~ 6

It is available to write the data to RTC without using a instruction, by writing the RTC data to the above
area and making ‘_RTC_WR (F10240)’ to be ‘On’.
• In case that time data does not match with the form, the value is not allowed to write.
(But if the week does not match, it shall be set as it is without error detection.)
• Monitor the RTC read device after writing RTC data, and check if it is modified correctly.
4) Weekday Expression Method

No.	0	1	2	3	4	5	6
Day	Sunday	Monday	Tuesday	Wednesday	Thursday	Friday	Saturday

5) Time Tolerance
RTC tolerance depends on ambient temperature. Time tolerance according to temperature per day was
indicated on the table as below.

Operation temperature	Max. tolerance (second/day)	Normal case (second/day)
0 °C	- 4.67 ~ 1.38	-1.46
25 °C	- 1.64 ~ 2.42	0.43
55 °C	- 5.79 ~ 0.78	-2.29

1) RTC may not have the clock data written at first.
2) When using a CPU module, you must set the clock data correctly at first.
3) In case that the data out of range of clock data is written in RTC, it may not work normally.
Ex) 14Month 32Day 25Hour
4) RTC may stop or occur error because of battery error. If new clock data is written in RTC, the
error shall be cleared.
5) For more information about the time date modification by program, refer to the XGK
Instructions user’s manual.

Note

Chapter 6 Function of CPU Module
6 -6
6.3 Remote Function
CPU module enables to change the operation by communication except key switch mounted in the module. If
you want to operate it by Remote, you should set ‘REM enable’ switch (4-pin deep) of CPU module as ‘ON’
position and ‘RUN/STOP’ switch as ‘STOP’ position.
1) Type of Remote Operation
(1) Operated by connecting XG5000 through USB or RS-232 port mounted in CPU module.
(2) Available to operate other PLC connected to the network of PLC in the state that XG5000 is connected
to CPU module.
(3) Controls the operation state of PLC by MMI software through dedicated communication
2) Remote RUN/STOP
(1) Remote RUN/STOP performs RUN/STOP when the deep switch of the CPU module is in the
REMOTE position and the RUN/STOP switch is in the STOP position.
(2) Convenient function in case that CPU module is installed in the position difficult to operate or CPU
module inside control panel is controlled by RUN/STOP from outside.
3) Remote DEBUG
(1) Remote DEBUG is the function to perform DEBUG operation in the state that Deep switch of CPU
module is in REMOTE position and the RUN/STOP switch is in the STOP position. DEBUG operation
means the function performed according to the operation condition assigned for program operation.
(2) Convenient function in case of checking the execution state of program or the contents of each data
from Debugging work
4) Remote Reset
(1) Remote Reset is the function to reset a CPU module by remote operation in case that the error occurs
in the place not possible to operate a CPU module.
(2) This supports ‘Reset’ and “Overall Reset’ as like an operation by switch.

Notes

1) For operation method of Remote Function, please refer to ‘Online’ part from XG5000 user’s manual.

5) Flash memory operation of PLC
(1) When PLC operation mode Changes to Run, it executes Run operation after copying the program
in the flash memory to the program memory. In other words, it runs PLC through the program
in the flash memory.
(PLC operation in Run mode: it means that the operation mode changes from Stop to Run,
and that the operation mode is Run when PLC is powered back on)
Chapter 6 Function of CPU Module
6 -7
(2) Flash memory operation mode setting
Online  Set Flash Memory  Check the ‘Enable flash memory operation mode’  Click OK

Notes

1) Initial mode is Disable flash memory run mode
2) Set Enable flash memory run mode at once, it keeps the mode On until the PADT is Off
3) Change of the flash memory operation mode is available regardless of RUN/STOP Mode
4) Make sure that the program write to the flash memory completely
when you try ‘modification during run’ in flash memory operation mode.
If it can’t be written completely, the program you write before will be carried out.
5) When you set the flash memory operation mode, it is necessary that flash memory programming
Is completed, the flash memory operation mode is applied. If you restart the PLC before
program writing is completed, "flash memory operation mode" will be canceled.

Chapter 6 Function of CPU Module
6 -8
(3) Flash memory operation method
If you want to change the restart or operation mode the PLC system to RUN, depending on the setting
of the flash operation mode, it works as follows.

Set of flash memory operation m ode	Operation contents
ON	Or different contents of the flash memory and program memory, if the contents of the reasons the program memory such as a decrease in the battery voltage is damaged, then operation after downloading the program stored in the flash memory to program memory.
OFF	CPU runs at a program that is recognized as programmed into the flash memory does not exist are stored in on-chip RAM.

(4) The saving data in flash memory mode

CPU Mode	Saving data
Run	Local Ethernet Parameter
Communication Parameter
Stop	Program
Basic Parameter
Local Ethernet Parameter
Communication Parameter
Special module Parameter
Auto Variable
Comments
Modification During Run	Program
Auto Variable
Comments

Chapter 6 Function of CPU Module
6 -9
6.4 Forced I/O On/Off Function
Forced I/O function is used to force I/O area ON/OFF regardless of the result of program execution.
6.4.1 Forced I/O Setup Method
Click ‘Forced I/O setup’ in online mode.
To set Forced I/O, select the proper flag and data check box of P device.
To set the value “1”, select the correspond bit data and flag.
To set the value “0”, select the flag only not bit data.
The setting is applied when forced input or output is enabled.
For further information of setting method, please refer to the XG5000 user’s manual.

Notes

1) The Forced I/O setting is only available for the local I/O module.
2) It is not available for the remote I/O module (Smart I/O module).
3) The PS LED is turned On if Forced I/O is selected.

Chapter 6 Function of CPU Module
6 -10
6.4.2 Forced On/Off Execution Point and Execution Method
(1) Forced Input
Input replaces the data of contact point set as forced On/Off from the data read in input module at the time
of input refresh with the forced setting data and updates the input image area. Therefore, the user program
operates with actual input data while the forced setting area operates with forced setting data.
(2) Forced Output
Output replaces the data of contact point set as forced On/Off from the data of output image area having
the operation result, at the time of output refresh after completion of user program operation execution,
with the forced setting data and makes prints in output module. In case of output other than input, the data
of output image area does not change by forced On/Off setting.
(3) Notices in using forced I/O function
 It operates from the point setting ‘enable’ of each input/output, after setting the forced data.
 It is available to set the forced input even if actual I/O module is not built-in.
 Even if there are power Off -> On, change of operation mode or operation by reset key, On/Off setting data
set in before is kept in CPU module.
 Forced I/O data shall not be cleared even in Stop mode.
 If you want to set the new data from the beginning, clear all settings by using ‘Delete all’ before using.
6.5 Direct I/O Operation
By making Refresh for I/O contact point with using ‘IORF’ instruction, it enables to read the state of input contact
point directly during program execution and use it for operation, and also this is used when printing out the result
of operation directly in output contact point.

Notes

1) For further information of IORF instructions, please refer to XGK Instruction manual.
2) If IORF instruction is used, the value is applied immediately, and it is used prior to Forced I/O.

Chapter 6 Function of CPU Module
6 -11
6.6 Saving Operation History
For operation history, there are 4 types such as error history, mode conversion history, power shutdown history
and system history.
The time, numbers and operation contents that each event occurred, are saved in the memory and is monitored
conveniently through XG5000.
Operation history is kept saving in PLC unless it is deleted by XG5000 etc.
6.6.1 Error History
This saves the error history occurred during operation.
• Saves the error code, date, time, error detailed contents etc.
• Saves up to max. 2048
• Automatic release in case that memory backup is broken by battery voltage falling etc.
6.6.2 Mode Conversion History
This saves the changed mode information and time in case of operation mode change.
• Saves the date, time, mode conversion contents
• Saves up to max. 1024
6.6.3 Power Shutdown History
This saves the time that the power is ON or OFF with ON/OFF information.
• Saves ON/OFF information, date, time
• Saves up to max. 1024
6.6.4 System History
This saves the operation history of system occurred during operation.
• Saves the date, time and operation change contents
• XG5000 operation information, key switch change information
• Saves up to max. 2048
Chapter 6 Function of CPU Module
6 -12

Notes

1) The saved information will not be deleted before selecting the menu from XG5000 to delete.
2) If the index number saved is over 100, select Read All to check previous history.

Chapter 6 Function of CPU Module
6 -13
6.7 External Device Error Diagnosis
This is the flag provided so that the user can detect the error of external device and realize the stop and
warning of system easily. By using this flag, it enables to indicate the error of external device without
preparing the complicated program and monitor the error position without special device (XG5000) or
source program.
1) Detection and classification of external device error
(1) The error of external device is detected by the user program and classified by heavy error that needs
to stop the PLC operation and light error (warning) that continues the PLC operation and only indicates
the error state, according to the contents of detected error.
(2) For heavy error, ‘_ANC_ERR flag’ is used and for light error, ‘_ANC_WAR flag’ is used.
2) Treatment of heavy error of external device
(1) In case that heavy error of external device is detected in the user program, classify the type of error
defined by the user and write the value except ‘0’ in the system flag ‘_ANC_ERR’, and set system flag
‘_CHK_ANC_ERR’. System representative error flag ‘_ANNUN_ER’ of ‘_CNF_ER’ is set, PLC shall shut
off all output module and becomes the error state same as PLC own error detection.
(2) If the error occurs, the user can find the cause of error by using a XG5000 or by monitoring
‘_ANC_ERR flag’.
(3 It is available to write the error code assigned temporarily by the user at _ANC_ERR and the available
numbers are from 1 to 65,535.
 Example
3) Treatment of light error of external device
(1) In case that heavy error is detected in the user program, classify the type of error defined by the user
and write the value except ‘0’ in the system flag ‘_ANC_WAR’, and set system flag ‘_CHK_ANC_WAR’.
Then, system representative error flag ‘_ANNUN_WAR’ of ‘_CNF_WAR’ is set and light error code of
external device is saved at _ANC_WAR.
(2) If the error occurs, the user can find the cause of error by monitoring ‘_ANC_WAR’ flag directly.
(3) If the light error of external device is released, ‘_ANC_WAR’ will be released after user program is
executed and system flag ‘_ANNUN_WAR” of ‘_CNF_WAR’ will be reset.
Chapter 6 Function of CPU Module
6 -14
 Example
If P10003 is on, inputs ‘100’ at ‘_ANC_WAR’ and sets system flag ‘_CHK_ANC_WAR’. And ‘_ANNUM_WAR’ is
set and stops PLC.
Chapter 6 Function of CPU Module
6 -15
6.8 Fault Mask
1) Purpose and Operation Overview
• Fault Mask is the function to continue the program execution even if the module error occurs during
operation. The module assigned as Fault Mask shall be operated normally before error occurs.
• If the error occurs in the module where the Fault Mask is set, the corresponding module stops the operation
but the whole system continues the operation.
• If the module error occurs during operation, CPU module will set the error flag and the front “PS LED” shall
be “ON”. If connecting XG5000, you can see the error state.
2) Fault Mask Setting Method
• The Fault Mask Setting is available on the online menu of XG5000. For further information, please refer to
XG5000 user’s manual.
• The Fault Mask Setting is also available by setting the Fault Mask flag by program. (Please refer to
Appendix 1 Flag List.)
3) Release of Fault Mask
The Fault Mask is released only by the same method as the setting.
• Setting release from online menu of XG5000.
• Automatic release in case that memory backup is broken by battery voltage falling.
The Fault Mask shall not be released in the following cases. Cares should be taken.
• Power Off  On
• Change of operation mode
• Program download
• Operation of reset key
• Data clear

Notes

1) If releasing the Fault Mask in the state that error flag of CPU module is not deleted even if the
cause of error occurrence is removed, the system stops. Before releasing the Fault Mask flag,
check the state of error flag.

Chapter 6 Function of CPU Module
6 -16
6.9 I/O Module Skip
1) Purpose and Operation Overview
This is the function to exclude the module assigned during operation, from operation. For the assigned
module, it is disabled to update I/O data or diagnose the error from the assigned moment. It is allowed to use
only in case of temporary operation excluding the error part.
2) Setting Method and I/O Data Processing
• It is available to set by I/O module unit.
(For further information, please refer to XG5000 user’s manual.)
• As Input(I) image area stops input refresh, it keeps the value before skip setting. But, at this time, it is
effective to operate the image by forced On/Off.
• Actual output of output module shall be OFF in case of skip setting but output(Q) image area is changed
according to the user program operation regardless of skip setting. It is not allowed to operate output value
of output module by forced On/Off after skip setting.
• The execution of skip function when using direct I/O function is same.
3) Release of Skip Function
The skip of I/O module shall be released only by the same method as setting.
• Setting release from online menu of XG5000
• Automatic release in case the memory backup is broken by battery voltage falling
The Fault Mask shall be released even in the cases as below. Cares should be taken.
• Power Off→On
• Change of operation mode
• Program download
• Operation of reset key
• Data clear

1) When releasing a skip, if the error occurs in the corresponding module, the system may stop.
Release the skip in the state that the Fault Mask is set and check the normal operation of module
before releasing the skip.

Notes

Chapter 6 Function of CPU Module
6 -17
6.10 Changing Module during Operation
XGK system enables to change the module during operation. But, as the change of module during operation
may occur the abnormal operation of whole system, special attention should be taken. Just follow the procedure
assigned in this user’s manual.
1) Notices in Using
• Not allowed to change the base and power module.
• Some part of communication module (XGL-PMEA, XGL-DMEA) needs the network setting (Sycon used) for
communication.
• In case of module change, match the joint part of the lower part of base and module correctly before inserting.
If not, it may cause the system shutdown.
2) Module Change Method
There are 2 kinds of module change method.
(1) By using XG5000 “Module Change Wizard” function.
For further information, please refer to XG5000 user’s manual.
(2) By using CPU module switch
(1) Set “Module change switch (M.XCHG)” in front of CPU module as right(ON).
(2) Remove the module. (PS LED is ON)
(3) Setup the new module. (in case of normal module setup, PS LED is OFF)
(4) Check if module operates normally.
(5) Set “Module change switch (M.XCHG)” as left (OFF).
1) When changing the module, shut down the load power for safety.
2) When changing the input module, consider the setting of input image state by using the
forced On/Off.
Notes
When installing the module, it may cause an abnormal operation if the lower connection is not
mounted on the base completely.
Warning
Chapter 6 Function of CPU Module
6 -18
6.11 I/O No. Allocation Method
The allocation of I/O No. is to give the address to the I/O terminal of each module in order to read the data from
input module and print the data to output module when performing the operation.
For I/O No. allocation, base no., slot position, module type for setup and parameter setting etc. are related. XGK
provides 2 types such as fixed and variable.
6.11.1 Fixed I/O No. Allocation
By selecting “Assign fixed points to I/O slot” from basic parameter, 64 points shall be allocated to each slot
regardless of setup module. In this case, I/O parameter shall be applied only to judge whether the module
type installed in the system corresponds, but not applied to point allocation.
For example of point allocation, please refer to “2.3 Basic System”.
6.11.2 Variable I/O No. Allocation
By releasing “Assign fixed points to I/O slot” from basic parameter, the variable type that the point allocation is
changed per slot shall be set.
If setting I/O parameter, the point related to the setting module shall be given to the assigned slot. For the next
slot, the number following I/O no. occupied by the previous slot shall be allocated.
For example of point allocation, please refer to “2.3 Basic System”.
Chapter 6 Function of CPU Module
6 -19
6.11.3 Module Reservation Function
This function is used for the variable I/O number allocation method to reserve modules to be mounted. If this
function is used, the program modification is not necessary to change the I/O number.
It can be set in the I/O Parameters window of XG5000.
6.12 Program Modification during Operation
It is available to modify program or some parameter without stopping the control operation during PLC operation.
For further information, please refer to XG5000 user’s manual.
The items available to modify during operation are as below.
• Program modification
• Communication parameter modification

Notes

1) If a module greater than 16-point is mounted on without reservation, the I/O number will become
different and an abnormal operation will occur.
2) Only reserved points are available although larger point modules are mounted. The remainder are
ignored.
3) Program modification is not necessary because all slots are assigned as 64points in Fixed Allocation.

Chapter 6 Function of CPU Module
6 -20
6.13 Local Ethernet function(XGK-CPUUN/CPUHN/CPUSN)
XGK-CPUUN/CPUHN/CPUSN can carry out the functions of Ethernet server using internal local Ethernet
function without extra Enet I/F module.(Note, The internal local Ethernet doesn’t offer remote connections.
Only used for local connection.)
6.13.1 Local Ethernet Parameter Settings.
Make a new project. Then user can see Local Ethernet Parameters as shown below figure.
If user selects Local Ethernet Parameter item, Local Ethernet Parameter setting window will be displayed.
Chapter 6 Function of CPU Module
6 -21
To use the Local Ethernet function, user should set the parameters.
(1) TCP/IP Setting

Classification	Description
IP address	Specify the IP Address of the applicable CPU module. * Note : There can be a communications disruption if you set more than 2 servers as a same IP
Subnet mask	Value necessary to check if destination station is on the same network of the applicable station.
Gateway	IP address of Gateway or Router to transmit/receive data through the public network or a network different from the network where the applicable FEnet module is included.
Reception waiting time	If there is no request during the specified time from the host PC or MMI connected for dedicated communication, it will end the dedicated service connection regardless of normal ending procedures supposing that the higher level system is with error. This time is used in dedicated service to reset the channel when any error occurs on the destination station or the cable is disconnected. Reception waiting time can be set as a unit of 1 sec (available range is 2s to 255s)
Retransmission time-out (10 ㎳)	It is the time it takes CPU to send a data to the destination station if the destination station does not answer the data sent by applicable station during setting time. (Applicable station considers it as a data missing.) (available range is 10 ㎳ ~ 6000 ㎳) * Note : Retransmission time-out should be set depending on the network situation. If the setting time is too long, it takes a long time to resend a data in case of data missing. This will deteriorate the network performance. But if the setting time is too short, there is a chance to make a frequent disconnection or increase the load to the network.
Number of dedicated connections	Number of TCP dedicated services accessible at a time. (Max.4)

(2) Driver(Server) setting

Classification	Description
XGT server	Set when operated as dedicated communication server (slave)
Modbus TCP/IP server	Set when operated as Modbus server driver (slave)

(3) Host table setting

Classification	Description
Enable host table	Access allowed to applicable module of IP address registered in host table (unregistered client(IP address) is prohibited from connection when enabled)

Chapter 6 Function of CPU Module
6 -22
6.13.2 Local Ethernet connection with XG5000
After finishing Local Ethernet Parameter settings, download the settings to the CPU, then user can connect to
XG5000.
Select Online Settings and set the options as shown below figure.
Click the setting button to specify Ethernet IP. Click OK after specify the Ethernet IP set before.
User can find the IP information available now.
Chapter 6 Function of CPU Module
6 -23
6.13.3 Local Ethernet connection with XGT Server.
Set the Local Ethernet Parameters as shown below figure. User can use it as a XGT Server (LSIS dedicated
Protocol Communication).
6.13.4 Local Ethernet connection with TCP/IP Server.
Set the Local Ethernet Parameters as shown below figure. User can use it as a Modbus server
Chapter 6 Function of CPU Module
6 -24
Below figure is about Modbus settings. .

Note

1) Modbus TCP/IP server connection function allows RST packet transmission depending on the network
condition.(TCP/IP protocol)
So the user devices connecting to CPU module should have RST packet process.
2) Connection to user devices can be disconnected for retransmission time-out.
Retransmission time-out = retransmission time-out value(set in the Local Ethernet Parameter window) x
30ms
3) Too much Network loads can affect a scan time. So user should consider appropriate network loads for
CPU scan time.

Chapter 7 I/O Module
7-1
Chapter 7 I/O Module
7.1 Notice in Selecting Module
Here describes the notices when selecting digital I/O module used for XG series.
1) For the type of digital input, there are two types such as current sink input and
current source input.
For DC input module, as the wiring method of external input power varies according to
such input type, consider the specification of input connecting device when selecting.
2) Max. simultaneous input point depends on the module type. It is subject to input volt
age, ambient temperature. Review the specification of input module to apply before using.
3) In case that open/close frequency is high or it is used for conductive load open/close,
use Transistor output module or triac output module as the durability of Relay
Output Module shall be reduced.
4) For output module to run the conductive (L) load, max. open/close frequency should
be used by 1second On, 1 second Off.
5) For output module, in case that counter timer using DC/DC Converter as a load was
used, Inrush current may flow in a certain cycle when it is ON or during operation.
In this case, if average current is selected, it may cause the failure. Accordingly,
if the previous load was used, it is recommended to connect resistor or inductor to
the load in serial in order to reduce the impact of Inrush current or use the large
module having a max. load current value.
6) For output module, fuse is not possible to change. This is to prevent of burnout of
external wiring in case of short circuit of module output. This may not protect output
module. In case that output module is destroyed in error mode except short circuit,
fuse may not work.

Output
module

Resistor Load

Output
module

Inductor Load
Chapter 7 I/O Module
7-2
7) Relay life of Relay output module is shown as below.
Max. life of Relay used in Relay output module is shown as below.
8) XGK terminal block is not allowed to use the compressed terminal attached with sleeve.
The proper compressed terminal to connect to terminal blocks is as below.
(JOR 1.25-3: DAEDONG Electronic Ltd.)
9) The cable size connected to terminal block should be twisted pair 0.3~0.75 ㎟,
thickness less
than 2.8 ㎜. As cable varies the allowable current by insulation thickness,
cares should be taken.
10) The attachment torque of fixed screw of module and the screw of terminal block should be within the range
as below.

Attachment part	Attachment Torque range
I/O module terminal block screw (M3 screw)	42 ~ 58 N·㎝
I/O module terminal block fixed screw (M3 screw)	66 ~ 89 N·㎝

11) Transistor output module (XGQ-TR4A, XGQ-TR8A) has Thermal Protector Function.
Thermal Protector Function is the protection function for overload and overheats.
Open/close times (×10000 )
100
50
30
20
10
0.5 1 2 3 5 10 100
Open/close current (A)

Resist

ive

loa

DC 30VResistive load
AC 125VResistive load
Chapter 7 I/O Module
7-3
7.2 Digital Input Module Specification
7.2.1 8 point DC24V Input Module (Source/Sink Type)

Model Specification	DC input module
XGI-D21A
Input point	8 point
Insulation method	Photo coupler insulation
Rated input voltage	DC24V
Rated input current	About 4 ㎃
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)
Input Derating	None
On Voltage/Current	DC19V or higher / 3 mA or higher
Off Voltage/Current	DC11V or lower / 1.7 mA or lower
Input resistance	About 5.6 kΩ
Response time	Off → On	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
Insulation pressure	AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	8 point / COM
Proper cable size	Twisted pair 0.3~0.75 ㎟ (external diameter 2.8mm or less)
Proper compressed terminal	R1.25-3 (not allowed to use a sleeve attached compressed terminal.)
Current consumption (㎃)	20mA
Operation indicator	Input On LED On
External connection method	9 point terminal block connector (M3 X 6 screw)
Weight	0.1 kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	COM

00
COM
01
02
03
04
05
06
07

DC24V
0 7
* COM : TB9

Internal
circuit
R
TB1
COM
Photocoupler
TB8
R
DC5V
LED
Chapter 7 I/O Module
7-4
7.2.2 16 point DC24V Input Module (Source/Sink Type)

Model Specification	DC input module
XGI-D22A
Input point	16 point
Insulation method	Photo coupler insulation
Rated input voltage	DC24V
Rated input current	About 4 ㎃
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)
Input Derating	None
On Voltage/Current	DC19V or higher / 3 mA or higher
Off Voltage/Current	DC11V or lower / 1.7 mA or lower
Input resistance	About 5.6 kΩ
Response time	Off → On	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
Insulation pressure	AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	16 point / COM
Proper cable size	Twisted pair 0.3~0.75 ㎟ (external diameter 2.8mm or less)
Proper compressed terminal	R1.25-3 (not allowed to use a sleeve attached compressed terminal.)
Current consumption (㎃)	30mA
Operation indicator	Input On, LED On
External connection method	18 point terminal block connector (M3 X 6 screw)
Weight	0.12 kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	COM
TB18	NC

00
06
0D
COM
01
02
03
04
05
0A
0B
0C
0F
0E
08
07
09

DC24V
0 F
* COM : TB17

Internal
circuit
R
TB1
COM
Photocoupler
TB16
R
DC5V
LED
Chapter 7 I/O Module
7-5
7.2.3 16 point DC24V Input Module (Source Type)

Model Specification	DC input module
XGI-D22B
Input point	16 point
Insulation method	Photo coupler insulation
Rated input voltage	DC24V
Rated input current	About 4 ㎃
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)
Input Derating	None
On Voltage/Current	DC19V or higher / 3 mA or higher
Off Voltage/Current	DC11V or lower / 1.7 mA or lower
Input resistance	About 5.6 kΩ
Response time	Off → On	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
Insulation pressure	AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	16 point / COM
Proper cable size	Twisted pair 0.3~0.75 ㎟ (external diameter 2.8mm or less)
Proper compressed terminal	R1.25-3 (not allowed to use a sleeve attached compressed terminal.)
Current consumption (㎃)	30mA
Operation indicator	Input On, LED On
External connection method	18 point terminal block connector (M3 X 6screw)
Weight	0.12 kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	COM
TB18	NC

00
06
0D
COM
01
02
03
04
05
0A
0B
0C
0F
0E
08
07
09

DC24V
0 F
* COM : TB17

Internal
circuit
R
TB1
COM
Photocoupler
TB16
R
DC5V
LED
Chapter 7 I/O Module
7-6
7.2.4 32 point DC24V Input Module (Source/Sink Type)

Model Specification	DC input module
XGI-D24A
Input point	32 point
Insulation method	Photo coupler insulation
Rated input voltage	DC24V
Rated input current	About 4 ㎃
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)
Input Derating	Refer to the below Derating diagram.
On Voltage/Current	DC19V or higher / 3 mA or higher
Off Voltage/Current	DC11V or lower / 1.7 mA or lower
Input resistance	About 5.6 kΩ
Response time	Off → On	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
Insulation pressure	AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	32 point / COM
Proper cable size	0.3 ㎟
Current consumption (㎃)	50mA
Operation indicator	Input On, LED On
External connection method	40 point connector
Weight	0.1 kg
Circuit configuration	No	Cont act	No	Cact ont
B20	P00	A20	P10
B19	P01	A19	P11
B18	P02	A18	P12
B17	P03	A17	P13
B16	P04	A16	P14
B15	P05	A15	P15
B14	P06	A14	P16
B13	P07	A13	P17
B12	P08	A12	P18
B11	P09	A11	P19
B10	P0A	A10	P1A
B09	P0B	A09	P1B
B08	P0C	A08	P1C
B07	P0D	A07	P1D
B06	P0E	A06	P1E
B05	P0F	A05	P1F
B04	NC	A04	NC
B03	NC	A03	NC
B02	COM	A02	COM
B01	COM	A01	COM

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

DC24V
1F
0
* COM : B02, B01, A02, A01
DC28.8V
80
60
40
0 10 20 30 40 50 55
On rate
(%)
Ambient temp(℃ )
Derating level
90
70
50

Internal
Circuit
R
B20
COM
Photocoupler
A05
R
DC5V
LED

Chapter 7 I/O Module
7-7
7.2.5 32 point DC24V Input Module (Source Type)

Model Specification	DC input module
XGI-D24B
Input point	32 point
Insulation method	Photo coupler insulation
Rated input voltage	DC24V
Rated input current	About 4 ㎃
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)
Input Derating	Refer to the below Derating diagram.
On Voltage/Current	DC19V or higher / 3 mA or higher
Off Voltage/Current	DC11V or lower / 1.7 mA or lower
Input resistance	About 5.6 kΩ
Response time	Off → On	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
Insulation pressure	AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	32 point / COM
Proper cable size	0.3 ㎟
Current consumption (㎃)	50mA
Operation indicator	Input On, LED On
External connection method	40 point connector
Weight	0.1 kg
Circuit configuration	No	Contact	No	Contact
B20	P00	A20	P10
B19	P01	A19	P11
B18	P02	A18	P12
B17	P03	A17	P13
B16	P04	A16	P14
B15	P05	A15	P15
B14	P06	A14	P16
B13	P07	A13	P17
B12	P08	A12	P18
B11	P09	A11	P19
B10	P0A	A10	P1A
B09	P0B	A09	P1B
B08	P0C	A08	P1C
B07	P0D	A07	P1D
B06	P0E	A06	P1E
B05	P0F	A05	P1F
B04	NC	A04	NC
B03	NC	A03	NC
B02	COM	A02	COM
B01	COM	A01	COM

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

* COM : B02, B01, A02, A01
DC2
1F
0
A05
DC28.8V
80
60
40
0 10 20 30 40 50 55
On rate
(%)
Ambient temp(℃ )
Derating level
90
70
50

4V
R
B20
COM
R
Photocoupler
Internal
Circuit
DC5V
LED

Chapter 7 I/O Module
7-8
7.2.6 64 point DC24V Input Module (Source/Sink Type)

Model Specification	DC input module
XGI-D28A
Input point	64 point
Insulation method	Photo coupler insulation
Rated input voltage	DC24V
Rated input current	About 4 ㎃
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)
Input Derating	Refer to the below Derating diagram.
On Voltage/Current	DC19V or higher / 3 mA or higher
Off Voltage/Current	DC11V or lower / 1.7 mA or lower
Input resistance	About 5.6 kΩ
Response time	Off → On	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
Insulation pressure	AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	32 point / COM
Proper cable size	0.3 ㎟
Current consumption (㎃)	60mA
Operation indicator	Input On, LED On (32 point LED On by switch operation)
External connection method	40 point connector×2ea
Weight	0.15 kg
Circuit configuration	No	Cont act	No	Cact ont	No	Cact ont	No	Cact ont
1B20	P00	1A20	P10	2B20	P20	2A20	P30
1B19	P01	1A19	P11	2B19	P21	2A19	P31
1B18	P02	1A18	P12	2B18	P22	2A18	P32
1B17	P03	1A17	P13	2B17	P23	2A17	P33
1B16	P04	1A16	P14	2B16	P24	2A16	P34
1B15	P05	1A15	P15	2B15	P25	2A15	P35
1B14	P06	1A14	P16	2B14	P26	2A14	P36
1B13	P07	1A13	P17	2B13	P27	2A13	P37
1B12	P08	1A12	P18	2B12	P28	2A12	P38
1B11	P09	1A11	P19	2B11	P29	2A11	P39
1B10	P0A	1A10	P1A	2B10	P2A	2A10	P3A
1B09	P0B	1A09	P1B	2B09	P2B	2A09	P3B
1B08	P0C	1A08	P1C	2B08	P2C	2A08	P3C
1B07	P0D	1A07	P1D	2B07	P2D	2A07	P3D
1B06	P0E	1A06	P1E	2B06	P2E	2A06	P3E
1B05	P0F	1A05	P1F	2B05	P2F	2A05	P3F
1B04	NC	1A04	NC	2B04	NC	2A04	NC
1B03	NC	1A03	NC	2B03	NC	2A03	NC
1B02	COM	1A02	NC	2B02	COM	2A02	NC
1B01	COM	1A01	NC	2B01	COM	2A01	NC

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

A: P00~P1F indication
B: P20~P3F indication
DC24V
3F
0
* COM : /1B02, 1B01
/2B02, 2B01
DC28.8V
20
30
40
50
60
70
80
90
0 10 20 30 40 50 55
On rate
(%)
Ambient temp(℃ )
Derating level

Internal
Circuit
R
1B20
2A05
R
Switching
Circuit
A B
COM
Photocouple
DC5V
LED

Chapter 7 I/O Module
7-9
7.2.7 64 point DC24V Input Module (Source type)

Model Specification	DC input module
XGI-D28B
Input point	64 point
Insulation method	Photo coupler insulation
Rated input voltage	DC24V
Rated input current	About 4 ㎃
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)
Input Derating	Refer to the below Derating diagram.
On Voltage/Current	DC19V or higher / 3 mA or higher
Off Voltage/Current	DC11V or lower / 1.7 mA or lower
Input resistance	About 5.6 kΩ
Response time	Off → On	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/100ms (set by CPU parameter) Default:3ms
Insulation pressure	AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	32 point / COM
Proper cable size	0.3 ㎟
Current consumption (㎃)	60mA
Operation indicator	Input On, LED On (32 point LED On by switch operation)
External connection method	40 point connector×2ea
Weight	0.15 kg
Circuit configuration	No	Cont act	No	Cact ont	No	Cact ont	No	Cact ont
1B20	P00	1A20	P10	2B20	P20	2A20	P30
1B19	P01	1A19	P11	2B19	P21	2A19	P31
1B18	P02	1A18	P12	2B18	P22	2A18	P32
1B17	P03	1A17	P13	2B17	P23	2A17	P33
1B16	P04	1A16	P14	2B16	P24	2A16	P34
1B15	P05	1A15	P15	2B15	P25	2A15	P35
1B14	P06	1A14	P16	2B14	P26	2A14	P36
1B13	P07	1A13	P17	2B13	P27	2A13	P37
1B12	P08	1A12	P18	2B12	P28	2A12	P38
1B11	P09	1A11	P19	2B11	P29	2A11	P39
1B10	P0A	1A10	P1A	2B10	P2A	2A10	P3A
1B09	P0B	1A09	P1B	2B09	P2B	2A09	P3B
1B08	P0C	1A08	P1C	2B08	P2C	2A08	P3C
1B07	P0D	1A07	P1D	2B07	P2D	2A07	P3D
1B06	P0E	1A06	P1E	2B06	P2E	2A06	P3E
1B05	P0F	1A05	P1F	2B05	P2F	2A05	P3F
1B04	NC	1A04	NC	2B04	NC	2A04	NC
1B03	NC	1A03	NC	2B03	NC	2A03	NC
1B02	COM	1A02	NC	2B02	COM	2A02	NC
1B01	COM	1A01	NC	2B01	COM	2A01	NC

B20 B19 B18 B17 B16 B15 B14 B13 B12 B11 B10 B09 B08 B07 B06 B05 B04 B03 B02 B01 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A09 A08 A07 A06 A05 A04 A03 A02 A01
DC28.8V 20 30 40 50 60 70 80 90 0 10 20 30 40 50 55 Ambient temp(℃ ) Derating level e A: P00~P1F indication B: P20~P3F indication M : 1B02, 1B01 / 2B02, 2B01	n r (% * C	at ) O
DC	2	4V
R Photocoupler DC5V	0 1B20
3F COM 2A05
A B	Switching Circuit

R
Internal
Circuit
LED
Chapter 7 I/O Module
7-10
7.2.8 16 point AC110V Input Module

Model Specification	AC input module
XGI-A12A
Input point	16 point
Insulation method	Photo coupler insulation
Rated input voltage	AC100-120V(+10/-15%) 50/60 ㎐(±3 ㎐) (distortion rate < 5%)
Rated input current	About 8 ㎃ (AC100,60 ㎐), About 7 ㎃ (AC100, 50 ㎐)
Inrush current	Max. 200 ㎃ 1 ㎳ (AC132V)
Input Derating	Refer to the below Derating diagram.
On Voltage/Current	AC80V or higher / 5 mA or higher (50 ㎐, 60 ㎐)
Off Voltage/Current	AC30V or lower / 1 mA or lower (50 ㎐, 60 ㎐)
Input resistance	About 12 kΩ(60 ㎐), About 15 kΩ(50 ㎐)
Response time	Off → On	15 ms or less (AC100V 50 ㎐, 60 ㎐)
On → Off	25 ms or less (AC100V 50 ㎐, 60 ㎐)
Insulation pressure	AC1780V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	16 point / COM
Proper cable size	Twisted pair 0.3~0.75 ㎟ (external diameter 2.8mm or less)
Proper compressed terminal	R1.25-3 (not allowed to use a sleeve attached compressed terminal.)
Current consumption (㎃)	30mA
Operation indicator	Input On, LED On
External connection method	18 point terminal block connector (M3 X 6screw)
Weight	0.13 kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	COM
TB18	NC

00
06
0D
COM
01
02
03
04
05
0A
0B
0C
0F
0E
08
07
09

AC110V
0 F
* COM : TB17
AC120V
80
60
40
0 10 20 30 40 50 55
90
70
50 AC132V
On rate
(%)
Ambient temp(℃ )
Derating level

R
TB1
COM
R
TB16
R
DC5V
LED
Photocoupler
Internal
Circuit
A

Chapter 7 I/O Module
7-11
7.2.9 8 point AC220V input module

Model Specification	AC input module
XGI-A21A
Input point	8 point
Insulation method	Photo coupler insulation
Rated input voltage	AC100-240V(+10/-15%) 50/60 ㎐(±3 ㎐) (distortion rate 5%)
Rated input current	About 17 ㎃ (AC200,60 ㎐), About 14 ㎃ (AC200, 50 ㎐)
Inrush current	Max.500 ㎃ 1 ㎳ below (AC264V)
Input Derating	Refer to the below Derating diagram.
On Voltage/Current	AC80V or higher / 5 mA or higher (50 ㎐, 60 ㎐)
Off Voltage/Current	AC30V or lower / 1 mA or lower (50 ㎐, 60 ㎐)
Input resistance	About 12 kΩ(60 ㎐), About 15 kΩ(50 ㎐)
Response time	Off → On	15 ms or less (AC200V 50 ㎐, 60 ㎐)
On → Off	25 ms or less (AC200V 50㎐, 60㎐)
Insulation pressure	AC2830V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ or more by megger
Common Method	8 point / COM
Proper cable size	Twisted pair 0.3~0.75 ㎟ (external diameter 2.8mm or less)
Proper compressed terminal	R1.25-3 (not allowed to use a sleeve attached compressed terminal.)
Current consumption (㎃)	20mA
Operation indicator	Input On, LED On
External connection method	9 point terminal block connector (M3 X 6screw)
Weight	0.13 kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	COM

LED
DC5V

AC110/220V
0 7
* COM : TB9
80 AC240V
60
40
0 10 20 30 40 50 55
90
70
50 AC264V
37℃ 49℃
On rate
(%)
Ambient temp(℃ )
Derating level

R
TB1
COM
R
R
TB8
Photocoupler
Internal
Circuit 00
COM
01
02
03
04
05
06
07

Chapter 7 I/O Module
7-12
7.2.10 8 point AC220V isolated input module

Module type Spec.	AC input module
XGI-A21C
Input point	8 points
Insulation method	Photo coupler insulation
Rated input voltage	AC100-240V(+10/-15%) 50/60 ㎐(±3 ㎐) (5% and lower distortion)
Rated input current	Approx. 17 ㎃ (AC200,60 ㎐) , approx. 14 ㎃ (AC200,50 ㎐)
Inrush current	Max. 500 ㎃ 1 ㎳ and lower(AC264V)
Input derating	Refer to the below derating level
On voltage / On current	AC80V and higher / 5 mA and higher(50 ㎐,60 ㎐)
Off voltage / Off current	AC30V and higher / 1 mA and lower (50 ㎐,60 ㎐)
Input resistance	Approx. 12 kΩ(60 ㎐), approx. 15 kΩ(50 ㎐)
Response time	Off → On	15 ms and lower(AC200V 50 ㎐,60 ㎐)
On → Off	25 ms and lower(AC200V 50 ㎐,60 ㎐)
Insulation withstand voltage	AC2830V rms/3 Cycle (altitude 2000m)
Insulation resistance	10 ㏁ and higher by Insulation ohmmeter
Common method	1 point / COM
Suitable cable size	Stranded cable between 0.3~0.75 ㎟ (2.8mm and smaller outer dia.)
Suitable clamped terminal	R1.25-3 (Sleeve built-in clamped terminal is not available)
Current consumption(㎃)	20mA
Operation display	LED On with Input On
External connection method	18 point Terminal strip connector (M3 X 6 screws)
Weight	0.13 kg
Circuit diagram	Terminal block	Contact
TB1	P0
TB2	COM0
TB3	P1
TB4	COM1
TB5	P2
TB6	COM2
TB7	P3
TB8	COM3
TB9	P4
TB10	COM4
TB11	P5
TB12	COM5
TB13	P6
TB14	COM6
TB15	P7
TB16	COM7
TB17	NC
TB18	NC

Internal
circuit
R
Photocoupler
R

0
AC110/220V
80
60
40
0 10 20 30 40 50 55
90
70
50 AC264V
37℃ 49℃
Ambient temp(℃ )
Derating level
On rate
(%)
AC240V

TB1
TB2
DC5V
LED
COM0
P0
R

Chapter 7 I/O Module
7-13
7.3 Digital Output Module Specification
7.3.1 8 point Relay Output Module

Model Specification	Relay Output Module
XGQ-RY1A
Output point	8 point
Insulation method	Relay insulation
Rated load voltage/current	DC24V 2A(resistive load) / AC220V 2A(COSΨ = 1)
Min. load voltage/current	DC5V / 1mA
Max. load voltage/current	AC250V, DC125V
Off leakage current	0.1mA (AC220V, 60Hz)
Max. on/off frequency	3,600 times/hr
Surge absorber	None
Service life	Mechanical	20 millions times or more
Electrical	Rated load voltage/current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7ms) 100,000 times or more
Response time	Off → On	10 ms or less
On → Off	12 ms or less
Common method	1 point / 1COM (independent contact)
Current consumption	260mA (when all point On)
Operation indicator	Output On, LED On
External connection method	18 point terminal block connector (M3 X 6screw)
Weight	0.13kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	COM
TB3	P1
TB4	COM
TB5	P2
TB6	COM
TB7	P3
TB8	COM
TB9	P4
TB10	COM
TB11	P5
TB12	COM
TB13	P6
TB14	COM
TB15	P7
TB16	COM
TB17	NC
TB18	NC

00
05
07
01
02
03
04
06
L L L L L L L
COM0
RY
Internal
circuit
DC5V
LED
AC220V
TB1 L
TB2
P0
Chapter 7 I/O Module
7-14
7.3.2 16 point Relay Output Module

Model Specification	Relay Output Module
XGQ-RY2A
Output point	16 point
Insulation method	Relay insulation
Rated load voltage/current	DC24V 2A(resistive load) / AC220V 2A(COSΨ = 1)
Min. load voltage/current	DC5V / 1mA
Max. load voltage/current	AC250V, DC125V
Off leakage current	0.1mA (AC220V, 60Hz)
Max. on/off frequency	3,600times/hr
Surge absorber	None
Service life	Mechanical	20 million times or more
Electrical	Rated load voltage/current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7ms) 100,000 times or more
Response time	Off → On	10 ms or less
On → Off	12 ms or less
Common method	16 point / 1COM
Current consumption	500mA (when all points On)
Operation indicator	Output On, LED On
External connection method	18 point terminal block connector (M3 X 6screw)
Weight	0.17kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	COM
TB18	NC

00
0A
0E
02
04
06
08
0C
L L L L L L L L L L L L L L L L
01
03
05
07
09
0B
0D
0F
COM
LED
RY
Internal
circuit
TB1
COM
L L
DC5V
AC220V

* COM : TB17

TB16
Chapter 7 I/O Module
7-15
7.3.3 16 point Relay Output Module (Surge Absorber Type)

Model Specification	Relay Output Module
XGQ-RY2B
Output point	16 point
Insulation method	Relay insulation
Rated load voltage/current	DC24V 2A(resistive load) / AC220V 2A(COSΨ = 1)
Min. load voltage/current	DC5V / 1mA
Max. load voltage/current	AC250V, DC125V
Off leakage current	0.1mA (AC220V, 60Hz)
Max. on/off frequency	3,600times/hr
Surge absorber	Varistor (387 ~ 473V), C.R Absorber
Service life	Mechanical	20 million times or more
Electrical	Rated load voltage/current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7ms) 100,000 times or more
Response time	Off → On	10 ms or less
On → Off	12 ms or less
Common method	16 point / 1COM
Current consumption	500mA (when all points On)
Operation indicator	Output On, LED On
External connection method	18 point terminal block connector (M3 X 6screw)
Weight	0.19kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	COM
TB18	NC

00
0A
0E
02
04
06
08
0C
L L L L L L L L L L L L L L L L
01
03
05
07
09
0B
0D
0F
COM
RY
Internal
circuit
TB1
COM
TB16
L L
LED
DC5V

* COM : TB17

AC220V
Chapter 7 I/O Module
7-16
7.3.4 16 point Triac Output Module

Model Specification	Triac Output Module
XGQ-SS2A
Output point	16 point
Insulation method	Photo coupler insulation
Rated load voltage	AC 100-240V (50 / 60 Hz)
Max. load voltage	AC 264V
Max. load current	0.6A / 1 point 4A / 1COM
Min. load current	20 mA
Off leakage current	2.5 mA (AC 220V 60 Hz)
Max. inrush current	20A / Cycle or less
Max. voltage drop (On)	AC 1.5V or less (2A)
Surge absorber	Varistor (387 ~ 473V), C.R Absorber
Response time	Off → On	1 ms or less
On → Off	0.5 Cycle + 1 ms or less
Common method	16 point / 1 COM
Current consumption	300 mA (when all points On)
Operation indicator	Output On, LED On
External connection method	18 point terminal block connector (M3 X 6screw)
Weight	0.2 kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	COM
TB18	NC

00
0A
0E
02
04
06
08
0C
L L L L L L L L L L L L L L L L
01
03
05
07
09
0B
0D
0F
COM
R
Internal
circuit
TB1
COM

TB16
*COM : TB17

ZC
Triac
L L
DC5V
LED
AC110/220V

Chapter 7 I/O Module
7-17
7.3.5 16 point Transistor Output Module (Sink Type)

Model Specification	Transistor Output Module
XGQ-TR2A
Output point	16 point
Insulation method	Photo coupler insulation
Rated load voltage	DC 12 / 24V
Load voltage range	DC 10.2 ~ 26.4V
Max. load current	0.5A / 1 point, 4A / 1COM
Off leakage current	0.1mA or less
Max. inrush current	4A / 10 ms or less
Max. voltage drop (On)	DC 0.3V or less
Surge absorber	Zener diode
Fuse	4A×2ea(no change) (fuse shutdown capacity:50A)
Fuse cutoff indication	Yes (fuse cutoff, LED On, transmit the signal to CPU) External power supply Off, not detected Fuse cutoff
Response time	Off → On	1 ms or less
On → Off	1 ms or less (Rated load, resistive load)
Common method	16 point / 1COM
Current consumption	70mA (when all points On)
External power supply	Voltage	DC12/24V ± 10% (ripple voltage 4 Vp-p or less )
Current	10mAor less (DC24V connection)
Operation indicator	Output On, LED On
External connection method	18 point terminal block connector
Weight	0.11kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	DC24V
TB18	COM

DC12/24V
R
Internal
circuit
TB1
TB17
TB16
Fuse
TB18
R R
L L
LED
DC5V

*COM : TB18

00
0A
0E
02
04
06
08
0C
L L L L L L L L L L L L L L L L
01
03
05
07
09
0B
0D
0F
COM
Chapter 7 I/O Module
7-18
7.3.6 32 point Transistor Output Module (Sink Type)

Model Specification	Transistor Output Module
XGQ-TR4A
Output point	32 point
Insulation method	Photo coupler insulation
Rated load voltage	DC 12 / 24V
Load voltage range	DC 10.2 ~ 26.4V
Max. load current	0.1A / 1 point, 2A / 1COM
Off leakage current	0.1mA or less
Max. inrush current	0.7A / 10 ms or less
Max. voltage drop (On)	DC 0.2V or less
Surge absorber	Zener diode
Response time	Off → On	1 ms or less
On → Off	1 ms or less (rated load, resistive load)
Common method	32 point / 1COM
Current consumption	130mA (when all points On)
External power supply	Voltage	DC12/24V ± 10% (ripple voltage 4 Vp-p or less )
Current	10mA or less (DC24V connection)
Operation indicator	Input On, LED On
External connection method	40 Pin Connector
Proper cable size	0.3 ㎟
Weight	0.1 kg
Circuit configuration	No	Cont act	No	Cact ont
B20	P00	A20	P10
B19	P01	A19	P11
B18	P02	A18	P12
B17	P03	A17	P13
B16	P04	A16	P14
B15	P05	A15	P15
B14	P06	A14	P16
B13	P07	A13	P17
B12	P08	A12	P18
B11	P09	A11	P19
B10	P0A	A10	P1A
B09	P0B	A09	P1B
B08	P0C	A08	P1C
B07	P0D	A07	P1D
B06	P0E	A06	P1E
B05	P0F	A05	P1F
B04	NC	A04	NC
B03	NC	A03	NC
B02	DC12 /24V	A02	COM
B01	A01	COM

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

* COM : A02, A01

DC12/24V
R
Internal
circuit
B20
B01,B02
A05
COM
LED
DC5V
L L

Chapter 7 I/O Module
7-19
7.3.7 64 point Transistor Output Module (Sink Type)

Model Specification	Transistor Output Module
XGQ-TR8A
Output point	64 point
Insulation method	Photo coupler insulation
Rated load voltage	DC 12 / 24V
Load voltage range	DC 10.2 ~ 26.4V
Max. load current	0.1A / 1 point, 2A / 1COM
Off leakage current	0.1mA or less
Max. inrush current	0.7A / 10 ms or less
Max. voltage drop (On)	DC 0.2V or less
Surge absorber	Zener diode
Response time	Off → On	1 ms or less
On → Off	1 ms or less (rated load, resistive load)
Common method	16 point / 1COM
Current consumption	230mA (when all points On)
Common method	32 point / COM
External power supply	Voltage	DC12/24V ± 10% (ripple voltage 4 Vp-p or less )
Current	10mA or less (DC24V connection)
Operation indicator	Input On, LED On (32 point LED On by switch operation)
External connection method	40 Pin Connector×2ea
Proper cable size	0.3 ㎟
Weight	0.15 kg
Circuit configuration	No	Cont act	No	Cact ont	No	Ctact on	No	Cact ont
1B20	P00	1A20	P10	2B20	P20	2A20	P30
1B19	P01	1A19	P11	2B19	P21	2A19	P31
1B18	P02	1A18	P12	2B18	P22	2A18	P32
1B17	P03	1A17	P13	2B17	P23	2A17	P33
1B16	P04	1A16	P14	2B16	P24	2A16	P34
1B15	P05	1A15	P15	2B15	P25	2A15	P35
1B14	P06	1A14	P16	2B14	P26	2A14	P36
1B13	P07	1A13	P17	2B13	P27	2A13	P37
1B12	P08	1A12	P18	2B12	P28	2A12	P38
1B11	P09	1A11	P19	2B11	P29	2A11	P39
1B10	P0A	1A10	P1A	2B10	P2A	2A10	P3A
1B09	P0B	1A09	P1B	2B09	P2B	2A09	P3B
1B08	P0C	1A08	P1C	2B08	P2C	2A08	P3C
1B07	P0D	1A07	P1D	2B07	P2D	2A07	P3D
1B06	P0E	1A06	P1E	2B06	P2E	2A06	P3E
1B05	P0F	1A05	P1F	2B05	P2F	2A05	P3F
1B04	NC	1A04	NC	2B04	NC	2A04	NC
1B03	NC	1A03	NC	2B03	NC	2A03	NC
1B02	12/ 24 VDC	1A02	COM1	2B02	12/ 24V DC	2A02	COM2
1B01	1A01	2B01	2A01

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

A: P00~P1F indication
B: P20~P3F indication
*COM : 1A02, 1A01
/ /2A02, 2A01

DC12/24V
Internal
circuit
B20
A05
Switching COM
circuit
A B
LED
DC5V
L L
1B02,1B01
2B02, 2B01
R
R
Chapter 7 I/O Module
7-20
7.3.8 16 point Transistor Output Module (Source Type)

Model Specification	Transistor Output Module
XGQ-TR2B
Output point	16 point
Insulation method	Photo coupler insulation
Rated load voltage	DC 12 / 24V
Load voltage range	DC 10.2 ~ 26.4V
Max. load current	0.5A / 1 point, 4A / 1COM
Off leakage current	0.1mA or less
Max. inrush current	4A / 10 ms or less
Max. voltage drop (On)	DC 0.3V or less
Surge absorber	Zener diode
Fuse	4A×2ea (no change) (fuse shutdown capacity:50A)
Fuse cutoff indication	Yes (fuse cutoff, LED On, transmit the signal to CPU)
Response time	Off → On	1 ms or less
On → Off	1 ms or less (rated load, resistive load)
Common method	16 point / 1COM
Current consumption	70mA (when all points On)
External power supply	Voltage	DC12/24V ± 10% (ripple voltage 4 Vp-p or less )
Current	10mA or less (DC24V connection)
Operation indicator	Output On, LED On
External connection method	18 point terminal block connector
Weight	0.12kg
Circuit configuration	Terminal block	Contact
TB1	P0
TB2	P1
TB3	P2
TB4	P3
TB5	P4
TB6	P5
TB7	P6
TB8	P7
TB9	P8
TB10	P9
TB11	PA
TB12	PB
TB13	PC
TB14	PD
TB15	PE
TB16	PF
TB17	COM
TB18	0V

DC12/24V
R
Internal
circuit
TB1
COM
TB16
Fuse
TB18
R R
L L
LED
DC5V

*COM : TB17

00
0A
0E
02
04
06
08
0C
L L L L L L L L L L L L L L L L
01
03
05
07
09
0B
0D
0F
COM
Chapter 7 I/O Module
7-21
7.3.9 32 point Transistor Output Module (Source Type)

Model Specification	Transistor Output Module
XGQ-TR4B
Output point	32 point
Insulation method	Photo coupler insulation
Rated load voltage	DC 12 / 24V
Load voltage range	DC 10.2 ~ 26.4V
Max. load current	0.1A / 1 point, 2A / 1COM
Off leakage current	0.1mA or less
Max. inrush current	4A / 10 ms or less
Max. voltage drop (On)	DC 0.3V or less
Surge absorber	Zener diode
Response time	Off → On	1 ms or less
On → Off	1 ms or less (rated load, resistive load)
Common method	32 point / 1COM
Current consumption	130mA (when all points On)
External power supply	Voltage	DC12/24V ± 10% (ripple voltage 4 Vp-p or less )
Current	10mA or less (DC24V connection)
Operation indicator	Input On, LED On
External connection method	40 Pin Connector
Proper cable size	0.3 ㎟
Weight	0.1 kg
Circuit configuration	No	Cont act	No	Cact ont
B20	P00	A20	P10
B19	P01	A19	P11
B18	P02	A18	P12
B17	P03	A17	P13
B16	P04	A16	P14
B15	P05	A15	P15
B14	P06	A14	P16
B13	P07	A13	P17
B12	P08	A12	P18
B11	P09	A11	P19
B10	P0A	A10	P1A
B09	P0B	A09	P1B
B08	P0C	A08	P1C
B07	P0D	A07	P1D
B06	P0E	A06	P1E
B05	P0F	A05	P1F
B04	NC	A04	NC
B03	NC	A03	NC
B02	COM	A02	0V
B01	A01

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

* COM : B02, B01
L

DC12/24V
R
Internal
circuit
LED B20
COM
A05 L
A02, A01
DC5V

Chapter 7 I/O Module
7-22
7.3.10 64 point Transistor Output Module (Source Type)

Model Specification	Transistor Output Module
XGQ-TR8B
Output point	64 point
Insulation method	Photo coupler insulation
Rated load voltage	DC 12 / 24V
Load voltage range	DC 10.2 ~ 26.4V
Max. load current	0.1A / 1 point, 2A / 1COM
Off leakage current	0.1mA or less
Max. inrush current	4A / 10 ms or less
Max. voltage drop (On)	DC 0.3V or less
Surge absorber	Zener diode
Response time	Off → On	1 ms or less
On → Off	1 ms or less (rated load, resistive load)
Common method	32 point / 1COM
Current consumption	230mA (when all points On)
Common method	32 point / COM
External power supply	Voltage	DC12/24V ± 10% (ripple voltage 4 Vp-p or less )
Current	10mA or less (DC24V connection)
Operation indicator	Input On, LED On (32 point LED On by switch operation)
External connection method	40 Pin Connector×2ea
Proper cable size	0.3 ㎟
Weight	0.15 kg
Circuit configuration	No	Con tact	No	Cact ont	No	Ctact on	No	Cact ont
1B20	P00	1A20	P10	2B20	P20	2A20	P30
1B19	P01	1A19	P11	2B19	P21	2A19	P31
1B18	P02	1A18	P12	2B18	P22	2A18	P32
1B17	P03	1A17	P13	2B17	P23	2A17	P33
1B16	P04	1A16	P14	2B16	P24	2A16	P34
1B15	P05	1A15	P15	2B15	P25	2A15	P35
1B14	P06	1A14	P16	2B14	P26	2A14	P36
1B13	P07	1A13	P17	2B13	P27	2A13	P37
1B12	P08	1A12	P18	2B12	P28	2A12	P38
1B11	P09	1A11	P19	2B11	P29	2A11	P39
1B10	P0A	1A10	P1A	2B10	P2A	2A10	P3A
1B09	P0B	1A09	P1B	2B09	P2B	2A09	P3B
1B08	P0C	1A08	P1C	2B08	P2C	2A08	P3C
1B07	P0D	1A07	P1D	2B07	P2D	2A07	P3D
1B06	P0E	1A06	P1E	2B06	P2E	2A06	P3E
1B05	P0F	1A05	P1F	2B05	P2F	2A05	P3F
1B04	NC	1A04	NC	2B04	NC	2A04	NC
1B03	NC	1A03	NC	2B03	NC	2A03	NC
1B02	COM	1A02	0V	2B02	COM	2A02	0V
1B01	1A01	2B01	2A01

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

*COM : 1B02, 1B01
/ / 2B02, 2B01

A: P00~P1F indication
B: P20~P3F indication
R
Internal
circuit
LED
R
Switching
circuit
A B
DC5V

1B20 L
2A05
DC12/24V
COM
1A02, 1A01
2A02, 2A01
L

Chapter 7 I/O Module
7-23
7.3.11 8 point transistor isolated output module

Module Specification	Transistor output module
XGQ-TR1C
Output point	8 points
Insulation method	Photo coupler insulation
Rated load voltage	DC 12 / 24V
Operating load voltage range	DC 10.2 ~ 26.4V
Max. load current	2A / 1 point
Leakage current at Off	0.1mA and lower
Max. inrush current	4A / 10 ms and lower
Max. voltage drop at On	DC 0.3V and lower
Surge killer	Zener diode
Response time	Off → On	3 ms and shorter
On → Off	10 ms and shorter (Rated load, resistance load)
Common method	1 point/ 1COM
Current consumption	100mA (when every points On)
External power supply	Voltage	DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
Current	10mA and lower (if connected to DC24V)
Operation display	LED On with output On
External connection method	18point Terminal strip connector
Weight	0.11kg
Circuit diagram	Terminal block	Contact
TB1	P0
TB2	COM0
TB3	P1
TB4	COM1
TB5	P2
TB6	COM2
TB7	P3
TB8	COM3
TB9	P4
TB10	COM4
TB11	P5
TB12	COM5
TB13	P6
TB14	COM6
TB15	P7
TB16	COM7
TB17	NC
TB18	NC

Internal
circuit
R R
DC5V

Chapter 7 I/O Module
7-24
7.4 Digital I/O Module
32 point I/O (DC Input · Transistor Output) Module

XGH-DT4A
Input	Output
Input point	16point	Output point	16 points
Insulation	Photo coupler insulation	Insulation method	Photo coupler insulation
Rated input voltage	DC 24V	Rated load voltage	DC 12 / 24V
Rated input current	About 4 ㎃	Load voltage range	DC 10.2 ~ 26.4V
Operation voltage range	DC20.4~28.8V (ripple rate < 5%)	Max. load current	0.1A / 1 point, 1.6A / 1COM
Insulation pressure	AC560Vrms/3Cycle (altitude: 2000m)	Off leakage current	0.1mA or less
On Voltage/Current	DC19V or higher / 3 mA or higher	Max. inrush current	0.7A / 10 ms or less
Off Voltage/Current	DC11V or lower / 1.7 mA or lower	Surge absorber	Zener diode
Input resistance	About 5.6 kΩ	Max. voltage drop (On)	DC 0.2V or less
Response time	Off→ On	1ms/3ms/5ms/10ms/20ms/70ms/ 100ms (set by CPU parameter) Default:3ms	Response time	Off→ On	1 ms or less
On → Off	1ms/3ms/5ms/10ms/20ms/70ms/ 100ms (set by CPU parameter) Default:3ms	On → Off	1 ms or less (rated load, resistive load)
Common	16 point / 1 COM	Common method	16 points / 1 COM
Operation indicator	Input On, LED On	Operation indicator	Output On, LED On
Current consumption (㎃)	110mA (when all points On)
External connection	40-pin Connector × 1
Weight	0.1 kg
No	Cont act	No	Cont ac
B20	P00	A20	P10
B19	P01	A19	P11
B18	P02	A18	P12
B17	P03	A17	P13
B16	P04	A16	P14
B15	P05	A15	P15
B14	P06	A14	P16
B13	P07	A13	P17
B12	P08	A12	P18
B11	P09	A11	P19
B10	P0A	A10	P1A
B09	P0B	A09	P1B
B08	P0C	A08	P1C
B07	P0D	A07	P1D
B06	P0E	A06	P1E
B05	P0F	A05	P1F
B04	NC	A04	DC12 /24V
B03	NC	A03
B02	CO M	A02	0V
B01	A01

Circuit configuration	External Connection
Output
B20 B19 B18 B17 B16 B15 B14 B13 B12 B11 B10 B09 B08 B07 B06 B05 B04 B03 B02 B01 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A09 A08 A07 A06 A05 A04 A03 A02 A01	Input DC24V * COM : B02, B01

Internal
circuit
R
0 F
Photocoupler
COM
R
LED
DC5V
B20
B05
DC12/24V
Photocoupler
R
Internal
circuit
A20
A04,A03
A05
A02,A01
L L
DC5V
LED
Chapter 7 I/O Module
7-25
7.5 Event Input Module
7.5.1 Event Input Module (Source/Sink type)

Specification	XGF-SOEA
Input point	32 point
Insulation method	Photo coupler insulation
Memory size	Records 1Mbit event information (300 event information per XGF-SOEA module)
Precision	1 ms (±2ms : error between modules)
Rated input voltage	DC24V
Rated input current	About 4mA
Used voltage range	DC20.4 ~ 28.8V (within ripple rate 5%)
On voltage/On current	DC19V or above / 3 mA or above
Off voltage/ Off current	DC11V or less / 1.7 mA or less
Input resistance	About 5.6 kΩ
Response time	Off → On	H/W delay (10㎲: Normal) + input filter time (user setting: 0~100ms) + CPU scan time delay (50㎲)
On → Off	H/W delay (84㎲: Normal) + input filter time (user setting: 0~100ms) + CPU scan time delay (50㎲)
Working voltage	AC560V rms/3 Cycle (Altitude 2000m)
Insulation resistance	Insulation resistance 10 ㏁ or above (DC500V)
COMM method	32 point / COM
Current consumption (A)	0.7(MAX)
Operation indicator	LED is on when input is on
External connection method	40 pin connector
Size	27x98x90
Weight	0.2 kg
Circuit configuration	No	Cont act	No	Cont act
B20	0	A20	16
B19	1	A19	17
B18	2	A18	18
B17	3	A17	19
B16	4	A16	20
B15	5	A15	21
B14	6	A14	22
B13	7	A13	23
B12	8	A12	24
B11	9	A11	25
B10	10	A10	26
B09	11	A09	27
B08	12	A08	28
B07	13	A07	29
B06	14	A06	30
B05	15	A05	31
B04	RX+	A04	SG
B03	RX-	A03	SG
B02	COM	A02	COM
B01	COM	A01	COM

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

* COM : B02, B01
DC24V
31
0
90
DC28.8V
80
60
40
0 10 20 30 40 50 55
On rate
(%)
Ambient temp (℃)
70
50
Derating diagram

Internal
circuit
R
B20
COM
Photo coupler
A05
R
DC5V
LED

Chapter 7 I/O Module
7-26
7.6 Smart Link
7.6.1 Smart Link Connectable Module
The connectable digital modules used for XGK series to Smart Link are as follows.

Model	Specification	No. of Pins
XGI-D24A/B	32-point DC input module	40-pin Connector×1
XGI-D28A/B	64-point DC input module	40-pin Connector×2
XGQ-TR4A	32-point TR output module (sink type)	40-pin Connector×1
XGQ-TR4B	32-point TR output module (source type)	40-pin Connector×1
XGQ-TR8A	64-point TR output module (sink type)	40-pin Connector×2
XGQ-TR8B	64-point TR output module (source type)	40-pin Connector×2
XGH-DT4A	16-point DC input / 16-point TR output combination module	40-pin Connector×1

Some models are ready for Smart Link. For details, refer to the attached data sheet that comes wit
h the Smart Link module.

Classification	Model	Specification
Terminal board	TG7-1H40S	40-pin terminal
Relay board	R32C-NS5A-40P	32-point relay (Sink Type)
R32C-PS5A-40P	32-point relay (Source Type)
Cable	C40HF-10PB-1B	1m cable
C40HF-20PB-1B	2m cable
C40HF-30PB-1B	3m cable

7.6.2 Smart Link Connection
Extension cable (C40HF-10PB-1B)
Terminal board (TG7-1H40S)
Relay board (R32C-N(P)S5A-40P)
Chapter 7 I/O Module
7-27
7.6.3 Smart Link Wiring Diagram
- Wiring Diagram with TG7-1H40S - Wiring Diagram with R32C-N(P)S5A-40P

TG7-1H40S terminal block No.	I/O module connector No.	TG7-1H40S terminal block No.
B1	B20	A20	A1
B2	B19	A19	A2
B3	B18	A18	A3
B4	B17	A17	A4
B5	B16	A16	A5
B6	B15	A15	A6
B7	B14	A14	A7
B8	B13	A13	A8
B9	B12	A12	A9
B10	B11	A11	A10
B11	B10	A10	A11
B12	B09	A09	A12
B13	B08	A08	A13
B14	B07	A07	A14
B15	B06	A06	A15
B16	B05	A05	A16
B17	B04	A04	A17
B18	B03	A03	A18
B19	B02	A02	A19
B20	B01	A01	A20

R32C N(P)S5A-40P terminal block No.	I/O module connector No.	R32C N(P)S5A-40P terminal block No.
P0	B20	A20	P10
P1	B19	A19	P11
P2	B18	A18	P12
P3	B17	A17	P13
P4	B16	A16	P14
P5	B15	A15	P15
P6	B14	A14	P16
P7	B13	A13	P17
P8	B12	A12	P18
P9	B11	A11	P19
P0A	B10	A10	P1A
P0B	B09	A09	P1B
P0C	B08	A08	P1C
P0D	B07	A07	P1D
P0E	B06	A06	P1E
P0F	B05	A05	P1F
NC	B04	A04	NC
NC	B03	A03	NC
+24V	B02	A02	-24G
+24V	B01	A01	-24G

Chapter 8 Power Module
8-1
Chapter 8 Power Module
Here describes the selection method, type and specification of power module.
8.1 Selection Method
The selection of power module is determined by the current that voltage and power module of input power
supply to the system, that is, the sum of current consumption of digital I/O module, special module and
communication module which are installed on the same base as power module.
If exceeded the rated output capacity of power module, the system does not operate normally.
In case of system configuration, consider the current consumption of each module before selecting the power
module.
- For consumption current of each module, refer to user manual or data sheet of each module.
1) Current consumption per module (DC 5V)
(unit : mA)

Item	Model	Consumpti on current	Item	Model	ion current Consumpt
CPU module	XGK-CPUA, H, U, SN, HN, UN	960	Analog input module	XGF-AV8A	420
XGF-AC8A	420
XGF-AD4S	200
Analog output module	XGF-DV4A	190 (250)
XGKCPUE,S	940	XGF-DC4A	190 (400)
DC12/24V input module	XGI-D21A	20	XGF-DC4S	200 (200)
XGI-D22A	30	XGF-DV8A	190 (250)
XGI-D22B	30	XGF-DC8A	190 (400)
XGI-D24A	50	XGF-DV4S	200 (500)
XGI-D24B	50	High speed counter module	XGF-HO2A	270
XGI-D28A	60	XGF-HD2A	330
XGI-D28B	60	Positioning module	XGF-PO3A	400
AC110V input module	XGI-A12A	30	XGF-PO2A	360
AC220V input module	XGI-A21A	20	XGF-PO1A	336
Relay output module	XGQ-RY1A	250	XGF-PD3A	860
XGQ-RY2A	500	XGF-PD2A	790
XGQ-RY2B	500	XGF-PD1A	510
Transistor output module	XGQ-TR2A	70	Thermocouple input module	XGF-TC4S	610
XGQ-TR2B	70	RTD input module	XGF-RD4A	490
XGQ-TR4A	130	Motion control module	XGF-M16M	640
XGQ-TR4B	130	Insulation type conversion module	XGF-AD4S	200
XGQ-TR8A	230	Rnet I/F module	XGL-RMEA	410
XGQ-TR8B	230	Pnet I/F module	XGL-PMEA	560
Triac output module	XGQ-SS2A	300	Dnet I/F module	XGL-DMEA	440
I/O mixed module	XGH-DT4A	110	Cnet I/F module	XGL-C22A	330
FEnet I/F module (Optical/electrical)	XGL-EFMF	650	XGL-C42A	300
XGL-EFMT	420	XGL-CH2A	340
FDEnet I/F module (Master)	XGL-EDMF	650	-	-	-
XGL-EDMT	420	-	-	-

Value in ( ) means consumption current for external DC24V
Chapter 8 Power Module
8-2
Power CPU

Constant
voltage
transformer

AC power
100V~240V
COM. COM. OUT IN SPE
DC5
DC24
Load
I out I in
I 5V
I 24V
AC power
100V~240V
DC
power
24V
Chapter 8 Power Module
8-3
8.2 Specifications

Items	XGP-ACF1	XGP-ACF2	XGP-AC23	XGP-DC42
Input	Rated input voltage	AC110V/220V	AC220V	DC24V
Input voltage range	AC85V ~ AC264V	AC170V ~ AC264V	-
Input frequency	50 / 60 Hz (47 ~ 63 Hz)	-
Inrush current	20APeak or less	80APeak or less
Efficiency	65% or more	60% or more
Input fuse	Built-in (user no change), UL standard (Slow Blow Type)
Allowable moment shutdown	within 10 ms
Output 1	Output voltage	DC5V (±2%)	DC5V (±2%)
Output current	3 A	6 A	8.5 A	6A
Overcurrent protect	3.2A or more	6.6 A or more	9A or more	6.6 A or more
Overvoltage protect	5.5V ~ 6.5V
Output 2	Output voltage	DC24V (±10%)	-	-
Output current	0.6 A
Overcurrent protect	0.7 A or more
Overvoltage protect	None
Relay Output	Application	RUN contact (Refer to the section 8.3)
Rated switching voltage/current	DC24V, 0.5A
Minimum switching load	DC5V,1 ㎃
Response time	Off→On/ On→Off: 10 ㎳ or less/12 ㎳ or less
Life	Mechanical: More than 20,000,000 times Electrical: More than 100,000 times at rated switching voltage/current
RUN signal output	Relay output, Rating: DC24V, 0.5A
Voltage indicator	Output voltage normal, LED On
Cable specification	0.75 ~ 2 mm2
Compressed terminal	RAV1.25-3.5,RAV2-3.5
Weight	0.4 kg	0.6 kg	0.5 kg

Notes

1) Allowable Momentary Power Failure Time
The time that input voltage keeps normal output voltage (normal operation) in the state that AC110/220V
voltage is below rated value (AC85 / 170V).
2) Over current protection
(1) If the current over the standard flows in DC5V, DC24V circuit, the over current protection device
shutdowns the circuit to stop the system.
(2) In case of over current, remove the causes such as lack of current capacity or short circuits etc. and
then restart the system.
3) Over voltage protection
If the voltage over the standard is applied in DC5V circuit, the over voltage protection device shutdowns
the circuit to stop the system.

Chapter 8 Power Module
8-4
8.3 Part Names
Here describes the names of each part and its purpose of power module.

NO.	Names	Purpose
1	Power LED	DC5V power indication LED
2	DC24V, 24G terminal	Power supply to the module required for DC24V in output module. ▶ XGP-ACF2, XGP-ACF3 does not print out DC24V.
3	RUN terminal	Indicates RUN state of system. ▶ Off when CPU STOP error occurs. ▶ Off when CPU mode is changed to STOP mode.
4	PE terminal	Ground terminal for electric shock prevention
5	LG terminal	Ground terminal of power filter
6	Power input terminal	Power input terminal ▶ XGP-ACF1, XGP-ACF2, XGP-ACF3:AC100~240V connection ▶ XGP-DC42:DC24V connection
7	Terminal cover	Terminal block protection cover

① ② ③ ④ ⑤ ⑥ ⑦

Chapter 8 Power Module
8-5
8.4 Current Consumption/Power Calculation Example
Here describes which power module should be used in case of XGK system that the following module is
mounted.

Type	Model	Number of setup	Voltage system
5V	24V
CPU module	XGK-CPUH	1	0.96A	-
12 Slot main base	XGB-B12M	-	-	-
Input module	XGI-D24A	4	0.2A	-
Output module	XGQ-RY2A	4	2.0A	-
FDEnet module	XGL-EDMF	2	1.3A	-
Profibus-DP	XGL-PMEA	2	1.12A	-
Current consumption	Calculation	0.96+0.2+2+1.3+1.12	-
Result	5.58A	-
Energy consumption	Calculation	5.58×5V	-
Result	27.9W	-

As the value of 5V current consumption is 5.58A, use XGP-ACF2(5V:6A) or XGP-AC23(5V:8.5A). If used XGPACF1(5V:3A), the system does not operate.
Chapter 9 Base and Extended Cable
9 -1
Chapter 9 Base and Extended Cable
9.1 Specification
9.1.1 Main Base
Main base installs Power Module, CPU Module, I/O Module and Special Communication Module.

Model Items	XGB-M12A	XGB-M08A	XGB-M06A	XGB-M04A
I/O module setup	12 module	8 module	6 module	4 module
Dimension (mm)	426 X 98 X 19	318 X 98 X 19	264 X 98 X 19	210 X 98 X 19
Hole distance for panel attachment	406 X 75	298 X 75	244 X 75	190 X 75
Hole spec. for panel attachment	φ 4.5 (M4 screw)
Screw spec. for PE connection	(+)PHM 3 X 6 washer(φ 5)
Weight (kg)	0.54	0.42	0.34	0.28

9.1.2 Expansion Base
Expansion base installs Power Module, I/O Module and Special Communication Module.

Model Items	XGB-E12A	XGB-E08A	XGB-E06A	XGB-E04A
I/O module setup	12 module	8 module	6 module	4 module
Dimension (mm)	426 X 98 X 19	318 X 98 X 19	264 X 98 X 19	210 X 98 X 19
Hole distance for panel attachment	406 X 75	298 X 75	244 X 75	190 X 75
Hole spec. for panel attachment	φ 4.5 (M4 screw)
Screw spec. for PE connection	(+)PHM 3 X 6 washer(φ 5)
Weight (kg)	0.59	0.47	0.39	0.33

9.1.3 Extended Cable

Model Items	XGC E041	XGC E061	XGC E121	XGC E301	XGC E501	XGC E102	XGC E152
Length (m)	0.4	0.6	1.2	3	5	10	15
Weight (kg)	0.15	0.16	0.22	0.39	0.62	1.2	1.8

Notes

In case of combination of extended cable, do not exceed 15m.

Chapter 9 Base and Extended Cable
9 -2
9.2 Part Names
9.2.1 Main Base
9.2.2 Expansion Base

Base attached guide hole

Hole to attach the main base
to the panel in control panel

Module built-in connector

I/O module built-in connector

Extended cable connector
Connects the extended cable
by send/receive connector with
extended base.
PE terminal
Ground terminal
connected to the
shielded pattern of
PCB board

Power module connector

I/O module built-in
connecto

CPU module connector
I/O module built-in connector

Base attached guide hole
Hole to attach the main base
to the panel in control panel

Power module connector
I/O module built-in
connector
Module built-in connector
I/O module built-in connector
PE terminal
Ground terminal
connected to the
shielded pattern of
PCB
Extended cable connector
Connects the extended cable
by send/receive connector with
extended base.
Chapter 10 Built-in PID Functions
10-1
Chapter 10 Built-in PID Functions
This chapter describes the XGK Series CPU built-in PID function.
Sections 10.2 and 10.3 cover the principles and structure of PID control; the subsequent sections are dedicated
to the PID function built into XGK Series.
10.1 Features
The features of the PID function built into XGK Series (XGK-CPUH, XGK-CPUA, XGK-CPUS, XGK-CPUE,
XGK-CPUU) are as follows.
(1) Enables high-precision control operation.
(2) Supports a high-speed operation cycle of 0.6 ms.
(3) Provides a symbol function for easy setting and monitoring.
(4) Supports the forward and reverse processes.
(5) Effectively prevents over/undershoot by means of powerful dual anti-windup.
(6) Allows operation by external equipment(HMI).
(7) Protects the system by limiting the maximum variation of PV.
(8) Protects the driver by limiting the maximum variation, maximum value and minimum value of MV.
(9) Enables PID control by the Auto-tuning function.
(10) Enables the cascade PID control.
10.2 PID Control
PID control is a control method to keep the state of the control object at the Set Value. In case there exists an
error between the preset Set Value and the value measured by the detector (current value), the controller
operates to adjust the output (control signal) so that the current value can reach the Set Value.

User

PID
operation
module

CPU
User	MV_manual

Sensor

AD
Conversion
module

DA
Conversion
module

Control
object

PV
Auto
mode
Manual
mode
revirAs illustrated in the figure above, the PLC functions as a controller for the whole control system. The sensor and
driver are used respectively for the state detection and driving of the control object.
The sensor detects the current states of the control object and transmits them to the controller, the PLC transfers
the proper output to the driver, the driver drives the control object according to the controller output, then again
the sensor detects the changed states and transmits them to the PLC (Closed Loop Control). The process of
going around the control loop once is repeated at intervals ranging from a few seconds to hundreds of
microseconds.The time taken is called the control cycle.
Chapter 10 Built-in PID Functions
10-2
10.3 PID Control Operation
10.3.1 Terms
Below are the terms used to describe the PID control operation.

SV T_s (Ts) K_p (Kp) T_i (Ti) T_d (Td) PV	: The target state the control object should reach : Sampling time (Control cycle) : Proportional coefficient : Integral time constant : Differntial time constant : Current state of the control object, which is detected by the sensor
ERR	: Current error of the control object, which is represented by (SV – PV)
MV	: Control input or controller output

MV_p (MVp): Proportaional componentof MV
MV_i (MVi) : Integral component of MV
MV_d (MVd): Derivative component of MV
10.3.2 PID expressions
PID expressions are as follows.
(10.3.5)
(10.3.4)
(10.3.3)
(10.3.2)
(10.3.1)
p i d
d p d
p i
i
p p
MV MV MV MV
dt
dE
MV K T
E dt
K T
MV
MV K E
E SV PV
= + +
= = =
= -
∫
An error is a mathematical expression that tells about how far the current system is from the state desired by
the user.
Here is an example; a user wants the water in a electric pot to be kept at 50 ℃ and the current water
temperature is 35 ℃. Then, SV is 50 ℃, PV is 35 ℃. The error (E) is 15 ℃, the difference between SV and PV.
Upon detection of the error, the controller performs PID operation.
Note that, as shown in (10.3.5), MV is the sum of the P, I and D compoents (MV_p, MV_i, and MV_d).
Therefore, if the D component is excluded from the PID control expression, then the PI control results and, if
the I and D components are excluded, then P control results.
Chapter 10 Built-in PID Functions
10-3
10.3.3 P control
As shown in the following expression (10.3.7), MV in P control is composed of the proportional term operation
MV_p only. The proportional term operates in the form of the multiplication of the error by the proportional
coefficient. The user must set the proportional coefficient properly according to the system. The greater the
proportional coefficient is set, the more sensitive the system becomes to the error.

(10.3.7)
(10.3.6)

p
p
MV
K E

p
MV
MV

= =
The development of P control of any virtual system has the following characteristics.
The virtual system below is designed for better understanding by the user, but may be different from an actual
temperature system.
In the simulation above, SV is 50.0. the K_p value is properly adjusted to obtain the PV development above.
Four seconds after the operation starts at the initial temperature of 20 ℃, the system settles into the stable
state and thereafter remains constant at 46.2 ℃. The offset is 3.8 ℃ (around 7.6%). The reason there exists a
permanent offset in P control is that, as PV approaches SV, the E gets smaller and also MV gets smaller and

comes into equilibrium at the equilibrium point with K_pat the equilibrium point (46.2
inherent in the P controller can be compensated by using PI control.

℃ e). The offset abov

0.0
10.0
20.0
30.0
40.0
50.0
60.0
0 2 4 6 8 10 12 14 16
Second
Temperature
Chapter 10 Built-in PID Functions
10-4
10.3.4 PI control
As shown in the following expression (10.3.10), PI (Proportional-Integral) control is calculated as the sum of
the proportional and integral terms. To reduce the offset, the shortcoming of the proportional term, PI control
uses the integrated error.
(10.3.10)
(10.3.9)
(10.3.8)
p i
p i
i
p p
MV MV MV
E dt
K T
MV
MV K E
= +
= =
∫
If the error, though constant, is integrated until it is reduced to zero, the integral amount is accumulated over
time. Therefore the PI controller can be used to compensate for the offset characteristic of P control. It should
be noted that the integral time constant (Ti) is the denominator of the integral term, therefore, the smaller the
Ti value, the larger the integral effect. The following graph shows the result of PI control of the previously
described P controlled system.

As a result of adding the integral effect, the offset disappears and the system converges exactly to 50
the initial control, however, there occurs an overshoot in which the temperature rises to 61.2

℃. At
℃ and then fa

An excessive overshoot imposes a burden on the system or, in some cases, unstabilizes the system,
therefore, it should be reduced through proper coefficient tuning or can be improved through PID control using
the integral effect.
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
0 2 4 6 8 10 12 14 16
Second
Temperature
Chapter 10 Built-in PID Functions
10-5
10.3.5 PID control
As shown by (10.3.1) ~ (10.3.5), PID control reduces vibration during PI control by adding the derivative effect to
PI control. The derivative effect operates only when the system state changes, regardless of the system error
value. When the PV measurement signal at the system sensor is not clean or mixed with noise, however, an
undesired derivative effect is created and causes an unstable operation of the heater or pump. To be sure that the
derivative effect is not caused by such trivial changes as noise in the system, it is required to install a filter at the
sensor input and set the derivative coefficient to a low value: in case of an actual system, it is common to set the
derivative coefficient between 0.001 ~ 0.1.
0.0
10.0
20.0
30.0
40.0
50.0
60.0
0 2 4 6 8 10 12 14 16
Temperature
Second
Chapter 10 Built-in PID Functions
10-6
10.4 PID Instructions
10.4.1 PID loop states
A PID loop has 5 states: PIDSTOP, AT (Auto-tuning), PIDRUN, PIDCAS, and PIDPAUSE.
(1) PIDSTOP is a state in which the output (MV) is represented by MV_min, the internal states are
initialized, and user settings are maintained. Under this condition, it is impossible to enter into PIDPAUSE.
(2) AT can be entered into by, in PIDSTOP only, setting the PIDxx_AT_EN bit to On and then executing
the PIDRUN instruction. Once the AT operation is completed, the system automatically enters into
PIDRUN. Tasks in AT include monitoring the system’s response to a series of inputs and determining the
PID coefficients (K_p, T_i, T_d) and operation cycle (T_s). Upon completion of AT, those values are
updated and the previous coefficients are lost.
(3) PIDRUN is a state in which the PID loop executes a normal control operation. MV by PID operation is
output and the changed settings are all applied since each scan operation is executed independently. If the
contact in front of the PIDRUN instruction is set to On or if the PIDRUN instruction exists on the ladder
program and PIDxx_REM_RUN is set to On, then it is possible to enter into PIDRUN.
(4) PIDCAS is a state in which twoo loops (master and slave loops) execute a control operation. Setting
the two loops in the same way as with PIDRUN and then using the PIDCAS instruction enables to enter
into PIDCAS, and the internal connection necessary for the interworking between the two loops is
automatically generated allowing data exchange between the loops. Loops operated in cascade are
displayed in the state flag PIDxx_STATE, under which state the remote operation PIDxx_REM_RUM bit
does not operate.
(5) PIDPAUSE is a state in which output, internal states and user settings are all maintained and the
control operation is paused. Setting PIDxx_PAUSE bit to On or using the PIDPAUSE instruction enables to
enter into PIDPAUSE. But, this is only possible when the previous state is PIDRUN.
PIDRUN
PIDPAUSE
PIDSTOP
PIDCAS
AT
Chapter 10 Built-in PID Functions
10-7
10.4.2 PID instruction group
The PID instruction group includes 5 instructions: PIDRUN, PIDCAS, PIDINIT, PIDPRMT, and PIDPAUSE. In
fact, all operations of the PID function are performed by the PIDRUN or PIDCAS instruction. The three other
additional instructions (PIDINIT, PIDPRMT, PIDPAUSE) operate normally when the PIDRUN or PIDCAS
instruction also exists on the ladder program. They are for the convenience in using the PIDRUN or PIDCAS
instruction.
(1) PIDRUN
PIDRUN is the most basic PID control instruction that is responsible for single PID loop control.

PIDRUN S

Instruction
Operand S has the range 0 ~ 31 (constants) and means the loop number.
(2) PIDCAS
PIDCAS is a instruction to implement a cascade control using two loops.

PIDCAS M S

Instruction
Operand M is the master loop with the range 0 ~ 31 (constants) and means the loop number.
Operand S is the slave loop with the range 0 ~ 31 (constants) and means the loop number.

Note

Operands M and S in PIDCAS cannot be the same.
Operand M means the number of the master loop during cascade PID operation, while
operand S means the number of the slave loop.
Basically, the master loop inputs its MV into SV of the slave loop during operation, while the
slave loop executes its operation using the SV value input thorugh the master loop.
In addition, the two loops observe each other’s operation information (wind-up, manual
mode, auto mode shift, etc).

Chapter 10 Built-in PID Functions
10-8
(3) PIDINIT
PIDINIT is used to initialize the settings and states of the current PID loop. All the setting values of the
corresponding loop are initialized as 0 (Off in case of bit).

PIDINIT S

Instruction
Operand S has the range 0 ~ 31 (constants) and means the loop number.
(4) PIDPRMT
PIDPRMT facilitates parameter changes in the loop memory configuration.
As soon as the contact is On, the main setting values of the PIDRUN instruction (SV, T_s, K_p, T_i, T_d)
are simultaneously changed to the values set by the user. Make sure that each of the 5 setting values
holds its respective data type as shown the table below.

PIDPRMT S D

Instruction

Device	Parameter	Data Type	Setting Ex.	Actual Unit
S+0	SV	[WORD]	5000
S+1	Ts	[WORD]	1000	0.1 msec
S+2	Kp	[REAL]	3.32	sec
S+4	Ti	[REAL]	9.3	sec
S+6	Td	[REAL]	0.001	sec

Operand S represents the first word address of the place the parameter to be changed is stored.
Operand D has the range 0 ~ 31 (constants) and means the loop number.
(5) PIDPAUSE
PIDPAUSE is used to switch the corresponding loop from the PIDRUN state to the PIDPAUSE state.

PIDPAUSE S

Instruction
Operand S has the range 0 ~ 31 (constants) and means the loop number.
Chapter 10 Built-in PID Functions
10-9
10.5 PID Flag Configuration
The table below shows the PID flag configuration for use of the built-in PID function.

KDevice Zone	Symbol	Data Type	Content
K10000+m	_PIDn_MAN	Bit	PID Output Select (0:Auto, 1:Manual)
K10020+m	_PIDn_PAUSE	Bit	PID Pause (0: STOP/RUN 1:PAUSE)
K10040+m	_PIDn_REV	Bit	PID Operation Select (0:Fwd, 1:Rev)
K10060+m	_PIDn_AW2D	Bit	PID Anti Wind-up2 Prohibited (0:Operated, 1:Prohibited)
K10080+m	_PIDn_REM_RUN	Bit	PID Remote (HMI) Run bit (0:STOP, 1:RUN)
K10100+m	_PIDn_P_on_PV	Bit	PID Proportional Calculation Source Select (0:ERR, 1:PV)
K10120+m	_PIDn_D_on_ERR	Bit	PID Derivative Calculation Source Select (0:PV, 1:ERR)
K10140+m	_PIDn_AT_EN	Bit	PID Auto-tuning Setting (0:Disable, 1:Enable)
K10160+m	_PIDn_MV_BMPL	Bit	MV Non-impact Conversion for PID Mode Conversion (A/M) (0:Disable, 1:Enable)
K1024+32n	_PIDn_SV	INT	PID Set Value (SV) - Loop n
K1025+32n	_PIDn_T_s	WORD	PID Operation Cycle (T_s)[0.1msec] - Loop n
K1026+32n	_PIDn_K_p	REAL	PID P - Constant (K_p) - Loop n
K1028+32n	_PIDn_T_i	REAL	PID I - Constant (T_i)[sec] - Loop n
K1030+32n	_PIDn_T_d	REAL	PID D - Constant (T_d)[sec] - Loop n
K1032+32n	_PIDn_d_PV_max	WORD	PID PV Variation Limit - Loop n
K1033+32n	_PIDn_d_MV_max	WORD	PID MV Variation Limit - Loop n
K1034+32n	_PIDn_MV_max	INT	PID MV Maximum Value Limit - Loop n
K1035+32n	_PIDn_MV_min	INT	PID MV Minimum Value Limit - Loop n
K1036+32n	_PIDn_MV_man	INT	PID Manual Output (MV_man) – Loop n
K1037+32n	_PIDn_STATE	WORD	PID State - Loop n
K10370+320n	_PIDn_ALARM0	Bit	PID Alarm 0 (1:T_s The setting is low) - Loop n
K10371+320n	_PIDn_ALARM1	Bit	PID Alarm 1 (1:K_p is 0) - Loop n
K10372+320n	_PIDn_ALARM2	Bit	PID Alarm 2 (1:PV Variation Limited) - Loop n
K10373+320n	_PIDn_ALARM3	Bit	PID Alarm 3 (1:MV Variation Limited) - Loop n
K10374+320n	_PIDn_ALARM4	Bit	PID Alarm 4 (1:MV Maximum Value Limited) - Loop n
K10375+320n	_PIDn_ALARM5	Bit	PID Alarm 5 (1:MV Manimum Value Limited) - Loop n
K10376+320n	_PIDn_ALARM6	Bit	PID Alarm 6 (1:AT Abnormal Cancel)- Loop n
K10377+320n	_PIDn_ALARM7	Bit	PID Alarm 7 - Loop n
K10378+320n	_PIDn_STATE0	Bit	PID State 0 (0:PID_STOP, 1:PID_RUN) - Loop n
K10379+320n	_PIDn_STATE1	Bit	PID State 1 (0:AT_STOP, 1:AT_RUN) - Loop n
K1037A+320n	_PIDn_STATE2	Bit	PID State 2 (0:AT_UNDONE, 1:DONE) - Loop n
K1037B+320n	_PIDn_STATE3	Bit	PID State 3 (0:REM_STOP, 1:REM_RUN) - Loop n
K1037C+320n	_PIDn_STATE4	Bit	PID State 4 (0:AUTO_OUT, 1:MAN_OUT) - Loop n
K1037D+320n	_PIDn_STATE5	Bit	PID State 5 (0:CAS_STOP, CAS_RUN) - Loop n
K1037E+320n	_PIDn_STATE6	Bit	PID State 6 (0:SLV/SINGLE, 1:CAS_MST) - Loop n
K1037F+320n	_PIDn_STATE7	Bit	PID State 7 (0:AW_STOP, 1:AW_ACT) - Loop n
K1038+32n	_PIDn_PV	INT	PID Current Value (PV) - Loop n
K1039+32n	_PIDn_PV_old	INT	PID Previoius Current Value (PV_old) - Loop n
K1040+32n	_PIDn_MV	INT	PID Output Value (MV) - Loop n
K1041+32n	_PIDn_MV_BMPL_val	WORD	PID Non-impact Operation Memory - Loop n
K1042+32n	_PIDn_ERR	DINT	PID Control Error Value - Loop n
K1044+32n	_PIDn_MV_p	REAL	PID Output Value P Component - Loop n
K1046+32n	_PIDn_MV_i	REAL	PID Output Value I Component - Loop n
K1048+32n	_PIDn_MV_d	REAL	PID Output Value D Component - Loop n
K1050+32n	_PIDn_DB_W	WORD	PID Dead Band Setting (Operation after Stabilization) – Loop n
K1051+32n	_PIDn_Td_lag	WORD	PID Differention Function Lag Filter – Loop n
K1052+32n	_PIDn_AT_HYS_val	WORD	PID Auto-tuning Hysteresis Setting - Loop n
K1053+32n	_PIDn_AT_SV	INT	PID SV Setting for Auto-tuning - Loop n
K1054+32n	_PIDn_AT_step	WORD	PID Auto-tuning Display (User Setting Prohibited) - Loop n
K1055+32n	_PIDn_INT_MEM	WORD	PID Internal Memory (User Setting Prohibited) – Loop n

: User setting prohibited

* n : PID loop number in decimal form
* m : PID loop number in hexadecimal form
Chapter 10 Built-in PID Functions
10-10
The PID instruction uses part of the K device to perform operation. When the PID function is not used, the K
device can be used as a general Keep Relay.
The area of K0000 ~ K0999 is not used by the PID function so as to guarantee compatability with previous PLC
models and secure the user’s area.
K10000 ~ K1023F is the common bit area for all PID loops. The bit states and settings of the loops are
collectively arranged in the front part of the PID area. Thirty two - the maximum number of loops that can be
used by the PID function - bits comprise a double word and the states and settings of each loop are stored in
each bit order. But the loop number is represented in hexadecimal form.
K1024 ~ K1055 is the individual data area for PID Loop 0, where the settings and states of Loop 0 are stored. In
this area are stored the settings for PID Loop 0 (SV, dPV_max, MV_man, T_s, Kp, Ti, Td, MV_max, MV_min,
dMV_max) and, while the PID function is performed, the states for PID Loop 0 (PV, ETC, MV, MV_rvs, ERR,
MVp, Mvi, MVd, PV). By writing data into the set memory area, the user can change the PID setting at any time
even during operation and obtain the corresponding results in the next cycle.
K1056 ~ K2047 is the memory part of Loops 1 ~ 31 that are in the same form as Loop 0. Each loop operates
independently. If the user wants a dependent operation such as application of cascade, then he must do some
work to connect the states and settings of the loop.
In addition, please refer to the K device memory configuration in the latter part of this manual for an
understanding of the accurate memory location of PID.
For performance improvement of the product, the location and order of the memory area is subject to change
without prior notice.

Note

1) PID Memory Description Format
_PIDn_MAN n : Loop number
Ex) _PID10_MAN : Means MAN of Loop 10.
2) Common Bit Area
Ex) K10040+ (25) = K10040+ (19h) = K10059 : PID25_REV bit of Loop 25
3) Individual Data Area
Ex) K1024+ (32*1) = K1056 : SV of Loop 1

Chapter 10 Built-in PID Functions
10-11
10.5.1 Common bit area
The common bit area is the part that contain all bit data for the 32 loops. All information 32 loops have for a
signel item is combined to take the form of 32 bit double word; the nth bit provides information on the nth loop;
m is the hexadecimal value of loop number n.
(1) _PIDn_MAN (PID MANual operation enable) - Setting Area
K Device Area : K10000+m
Unit : Bit
This allows you to determine whether the PID function of the nth loop will operate in AUTO or in Manual.
In AUTO, the result of performing a normal PID operation is output; In MANUAL, a random Set Value
desired by the user (_PIDn_MV_man) is output without performing the PID operation.
If the corresponding bit is Off, then it is set to [Default] AUTO.
(2) _PIDn_PAUSE (PID PAUSE mode) - Setting Area
K DEVICE AREA : K10020+m
Unit : Bit
This allows the nth PID Loop to enter into PAUSE
Even when switching from PAUSE to RUN again, the control continues to operate. If the system state is
changed in PAUSE, the control system may produce an unexpected result. So, be very careful when using
the the PAUSE function.
If the corresponding bit is Off, [Default] PAUSE is cleared.
(3) _PIDn_REV (PID REVerse operation) - Setting Area
K DEVICE AREA : K10040+m
Unit : Bit
This allows you to set the control system as Forward system or Reverse system.
If the system state rises as the system input value rises, it is defined as Forward system; If the system
states falls as the system input value rises, it is Reverse system.
A boiler is a Forward system because the temperature rises as the system input rises; a cooler is a
Reverse system because the temperature falls as the system input rises.
If the corresponding bit is Off, it is set to [Default] Forward system.

Note

_PIDn_PAUSE
(1) Putting the PID loop into PAUSE by using PIDn_PAUSE and PIDPAUSE brings all
operations to a stop and outputs the last calculation values before PAUSE. If the system
state is changed but proper control is not exercised, the control system may produce an
unexpected result. So, be very careful when using the the PAUSE function.
(2) In the first PLC scan, PIDRUN performs initialization to turn the PAUSE bit to Off. If PLC is
turned on in PAUSE, it quits the PAUSE mode and enters into the STOP or Run mode.

Chapter 10 Built-in PID Functions
10-12
(4) _PIDn_AW2D (PID Anti Wind-up 2 Disable) - Setting Area
K DEVICE AREA : K10060+m
Unit : Bit
If this bit is turned OFF at the user’s will, The Anti Wind-up2 function is inactivated.
The Anti Wind-up function is described in detail in 10.6.
If the corresponding bit is Off, [Default] Anti Wind-up2 is enabled.
(5) _PIDn_REM_RUN (PID REMote RUN) - Setting Area
K DEVICE AREA : K10080+m
Unit : Bit
This is the external operation instruction of PIDRUN and has the same effect as when the contact of
PIDRUN is turned On/Off. In fact, PIDRUN performs an OR operation of the “PIDRUN input oondition”
contact and the corresponding bit in order to decide whether to perform the operation. Using this function
enables you to assign the operation contact of PIDRUN to a fixed address, facilitating easier use of
external input/output devices such as HMI.
If the corresponding bit is Off, [Default](the contact is Off) PIDRUN comes to STOP.
(6) _PIDn_P_ov_PV (PID P on PV) - Setting Area
K DEVICE AREA: K10100+m
Unit : Bit
This sets the P operation source of the corresponding PID loop to PV. P operation is performed on ERR or
PV. P operation moves relatively slowly to a stable state when using PV than when using ERR under the
unstable instantaneous control due to initial response or disturbance. This implies that the change in output
is slow and a heavy load is not imposed on the driver. But, with the change in the range of the internal
operation value, the Anti Wind-up function does not operate.
If the corresponding bit is Off, PID performs P operation on the ERR value and, if it is On, P operation is
performed on the PV value.
(7) _PIDn_D_on_ERR (PID D on ERRor) - Setting Area
K DEVICE AREA : K10120+m
Unit : Bit
This sets the D operation source of the corresponding PID loop to ERR. D operation is performed on ERR
or PV. In case of D operation using ERR, D response shows a dramatic change at the moment SV is
changed by the user and an excessive input may be applied to the driver. To prevent this, the method of
using PV for D operation is used and the [Default] value is also set to support D operation using PV. Using
ERR without this algorithm turns the corresponding bit On.
If the corresponding bit is Off, PID performs D operation on the PV value and, if it is On, D operation is
performed on the ERR value.

Note

_PIDn_REM_RUN
This bit is stored in the K device even though the PLC stops. If the PLC is stopped and
restarted with this bit On (eg. power outage), the system is initialized at the first scan and then
PIDRUN operates.

Chapter 10 Built-in PID Functions
10-13
(8) _PIDn_AT_EN (PID Auto-Tuning ENable) - Setting Area
K DEVICE AREA : K10140+m
Unit : Bit
This performs AT (Auto-tuning) of the corresponding PID loop. The approximate T_s (operation cycle) and
PID coefficients (K_p, T_i, T_d) of the systemare are determined through AT. Do not forget to set the
PIDn_HYS_val item before starting AT. The AT function is described in detail in 10.6.
If the corresponding bit is Off, the [Default] AT function is Disabled and AT is performed in the rising edge.
(9) _PIDn_MV_BMPL (PID MV BuMPLess changeover) - Setting Area
K DEVICE AREA : K10160+m
Unit : Bit
This allows to not only determine an appropriate MV value through operation so that MV can continue
smoothly when the corresponding PID loop changes from manual to auto output mode, but also reflect the
MV value to the internal state so as to stabilize MV. This function shows an algorithm difference between
single operation and cascade operation, but both operations are performed by this bit.
If the corresponding bit (in cascade operation, the corresponding bit of the master loop) is On, Bumpless
changeover is performed. If it is Off, The [Default] Bumpless changeover function is Disabled.

Note

_PIDn_AT_EN
This bit is initialized as Off when the PLC changes to Run mode. If the PLC is stopped and
restarted with this bit On (eg. power outage), the system is initialized at the first scan but does
not enter into AT mode again. Since there is no change in the PID settings, the system
operates in the state before the PLC stops.
_PIDn_MV_BMPL
Assuming that the manual output value is 1000 and the auto output of 2000 is required, the
driver receives the value of 1000 for system operation and instantly receives 2000 at the time
of mode conversion. If the corresponding bit is On, the corresponding PID loop outputs 1000 at
the time of mode conversion and performs an operation in order that the output gradually
increases to 2000.

Chapter 10 Built-in PID Functions
10-14
10.5.2 Individual data area
The individual data area is in the range of K1024 ~ K2047 and a 32 word length is assigned for each of 32
loops. So, the individual data area of the nth loop is K (1024+32n) ~ K (1055+32n).
(1) _PIDn_SV (PID Set-point Value) - Setting Area
K DEVICE AREA : K1024+32n
Unit : INT [ -32768 ~ 32767 ]
This is the SV setting part of the corresponding loop.
As described in the previous section, this is used to set the system state as desired by the user. The
system state is displayed in numeral and must be input after converted to PV according to the system gain.
In case of a system in which PV is sensed as 5000 at the temperature of 50 ℃, if the temperature
controlled at 50 ℃, SV is set to 5000.
(2) _PIDn_T_s (PID Sampling Time) - Setting Area
K DEVICE AREA : K1025+32n
Unit : WORD [ 0 ~ 65535 ]
This sets the sampling time of the corresponding loop.
The sampling time is a time cycle in which a control operation is performed. This can be set in the range of
0.1msec to 6553.5 msec in the unit of 0.1msec; an integer value of 1 is assigned for each 0.1ms. If 100ms
of sampling time is required, 1000 is input to _PIDn_T_s.
If the user sets the sampling time to 0, the scan cycle control mode is also set. In this case, as a control
operation occurs in each scan, a full speed control operation is performed in the current environment.
When the current scan speed is exceeeded due to the too short sampling time, The ALARM bit of
_PIDn_STATE is displayed.
(3) _PIDn_K_p (PID Propotional Gain) - Setting Area
K DEVICE AREA : K1026+32n
Unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
This sets the proportional constant for the corresponding loop. As K_p is multiplied into the P, I, D
(Proportional, Integral, Derivative) terms, the larger K_p is, the larger the proportional and derivative effects
are and the smaller the integral effect is.
If _PIDn_K_p is set to 0, P control is not performed. For more details, refer to 10.6.
K_p can be set in the short/long real number (REAL) range.

Note

_PIDn_SV
PID changes the output (MV) through several times of operations until SV equals PV. So,
when SV is 0, PIDRUN may be seen as inoperable.
If SV of a simple heater with the current temperature of 20℃ and PV of 2000 (20 ℃
PID will output 0 as MV and will not output until PV goes below 0 (0 ℃).

Chapter 10 Built-in PID Functions
10-15
(4) _PIDn_T_i (PID integral Time gain) - Setting Area
K DEVICE AREA : K1028+32n
Unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
This sets the integral time constant (T_i) of the corresponding loop. As T_i divides the I (integral) term, the
larger T_i, the smaller the integral effect.
If _PIDn_T_i is set to 0, I control is not performed. For more details, refer to 10.6.
T_i can be set in the short/long real number (REAL) range.

(5) _PIDn_T_d (PID derivative Time gain)
K DEVICE AREA : K1030+32n

- Setting Area

Unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
This sets the derivative time constant (T_d) of the corresponding loop. As T_d is multiplied into the D
(derivative) term, the larger T_d, the larger the derivative effect.
If _PIDn_T_d is set to 0, D control is not performed. For more details, refer to 10.6.
T_d can be set in the short/long real number (REAL) range.
(6) _PIDn_dPV_max(PID delta PV MAXimum limit) - Setting Area
K DEVICE AREA : K1032+32n
Unit : WORD [ 0 ~ 65535 ]
This limits the PV variation of the corresponding loop.
In actual control, PV does not always reflect the exact system state. Unwanted signals caused by sensor
malfunction, noise or disturbance can be mixed and reflected in PV. Like this, PV often undergoes a
sudden change and causes a large change in PID output. It is a priority to prevent a PV change greater
than the value set in _PIDn_dPV_max. Meanwhile, if _PIDn_dPV_max is set too small, the system change
is slowly reflected and the convergence time takes longer. Therefore, setting should be made according to
the system features.
If this is set to 0, the function does not operate.

(7) _PIDn_dMV_max (PID delta MV MAXimum limit)
K DEVICE AREA : K1033+32n

- Setting Area

Unit : WORD [ 0 ~ 65535 ]
This limits the MV variation of the corresponding loop. A sudden change in the output of the control system
may cause a system instability or impose a heavy load on the driver resulting in failure or unstable
operation. To prevent this, this item limits the controller output variation. If this is set to 0, the function does
not operate.
Chapter 10 Built-in PID Functions
10-16
(8) _PIDn_MV_max (PID MV MAXimum limit) - Setting Area
K DEVICE AREA : K1034+32n
Unit : INT [ -32768 ~ 32767 ]
This limits the maximum MV value of the corresponding loop.
This prevents overload and system errors by limiting the maximum value of the controller output
transferred to the output equipment. This also prevents the transfer of an unwanted value by overflow.
If PIDn_MV_max and PIDn_MV_min are both set to 0, this function does not operate.
(9) _PIDn_MV_min (PID MV MINimum limit) - Setting Area
K DEVICE AREA : K1035+32n
Unit : INT [ -32768 ~ 32767 ]
This limits the minimum MV value of the corresponding loop.
This prevents system errors by limiting the minimum value of the controller output transferred to the output
equipment. This also prevents the transfer of an unwanted value by overflow.
(10) _PIDn_MV_man (PID MANual MV variable) - Setting Area
K DEVICE AREA : K1036+32n
Unit : INT [ -32768 ~ 32767 ]
When the corresponding loop is set to manual operation, this designates MV.
If _PIDn_MAN in the common bit area is ON, the PIDn_MV_man value is output as the MV value of the
corresponding loop.
(11) _PIDn_STATE (PID STATE) - Setting Prohibited
K DEVICE AREA : K1037+32n or K10370+320n ~ K1037F+320n
Unit : WORD [ h00 ~ hff ] or BIT
This displays the state or abnomalities of the corresponding loop.
This is located at the address K1037+32n and each of the 16 bits has its own meaning. Only some of the
16 bits are currently in use.
STATE turns On when the corresponding operation occurs and returns Off when it is cleared.
The upper 8 bits of STATE (_PIDn_ALARM 0~_PIDn_ALARM 7) display abnormalities of the loop.
The lower 8 bits of STATE (_PIDn_STATE 0~_PIDn_STATE 7) displays the control state of the loop.
Each bit is assigned as follows.
_PIDn_ALARM 0 (K10370+32n): Indicates the operation is skipped because T_s is set too small set.
_PIDn_ALARM 1 (K10371+32n): Indicates the K_p value is 0.
_PIDn_ALARM 2 (K10372+32n): Indicates the PV variation is limited.
_PIDn_ALARM 3 (K10373+32n): Indicates the MV variation is limited.
_PIDn_ALARM 4 (K10374+32n): Indicates the maximum MV value is limited.
_PIDn_ALARM 5 (K10375+32n): Indicates the minimum MV value is limited.
_PIDn_ALARM 6 (K10376+32n): Indicates AT has been canceled abnormally.
_PIDn_STATE 0 (K10378+32n): Indicates PID operation is performed. (valid in case of PLC Run)
_PIDn_STATE 1 (K10379+32n): Indicates PID AT is being performed.
_PIDn_STATE 2 (K1037A+32n): Idicates PID AT has been completed.
_PIDn_STATE 3 (K1037B+32n): Indicates PID is in remode operation by _PIDn_REM_RUM bit.
_PIDn_STATE 4 (K1037C+32n): Indicates PID is in manual output mode.
_PIDn_STATE 5 (K1037D+32n): Indicates the PID loop belongs to cascade.
_PIDn_STATE 6 (K1037E+32n): Indicates the PID loop is the cascade master loop.
_PIDn_STATE 7 (K1037F+32n): Indicates Aniti Wind-up is in operation during PID operation.
Chapter 10 Built-in PID Functions
10-17
(12) _PIDn_PV (PID Process Variable) - Input/Output Area
K DEVICE AREA : K1038+32n
Unit : INT [ -32768 ~ 32767 ]
This displays the PV of the corresponding loop.
PV is an indicator of the current state of the system. In general, the input from the sensor is stored on the U
device of the CPU via an input device such as A/D conversion module: At each scan, this value should be
transferred to _PIDn_PV using a instruction such as MOV. Please refer to the program examples in the
latter part of this manual.
(13) _PIDn_PV_old (PID previous PV) - Setting Prohibited
K DEVICE AREA : K1039+32n
Unit : INT [ -32768 ~ 32767 ]
This is used internally for derivative and integral operations at a step prior to the PV state of the
corresponding loop. This can be referred to when necessary. Input of a random value will lead to a
malfunction.
(14) _PIDn_MV (PID Manipulated output Variable) - Input/Output Area
K DEVICE AREA : K1040+32n
Unit : INT [ -32768 ~ 32767 ]
This displays the MV of the corresponding loop.
MV is a signal source for system startup. Contrary to the description of _PID_PV in (12), this values is
transferred at each scan to the U device using a instruction such as MOV and then used as a system
startup input via an output device such as D/A conversion module. Please refer to the program examples
in the latter part of this manual.

(15) _PIDn_MV_BMPL_val (PID MV BuMPLess changeover VALue)
K DEVICE AREA : K1041+32n

- Setting Prohibited

Unit : WORD [ 0 ~ 65535 ]
This stores the information necessary for the Bumpless changeover operation of the corresponding loop.
The corresponding memory is automatically set and input by PID-internal operation and this value should
not be set by the user.

Note

Bumpless Change Over
When the PID controller is converted to manual output mode and back again to auto output
mode, the output is increased again from 0 as in a freshly started control system. This causes
a mode conversion impact to the system. To avoid this, the MV_BMPL function is used;
when the current system is converted to auto mode with the corresponding bit authorized, this
senses the system’s last state in manual mode and lets the control output continue smoothly
from that point. Furthermore, with the master loop MV_BMPL in cascade control authorized,
the master loop senses the state of the slave loop and generates a smoothly continuing control
output.

Chapter 10 Built-in PID Functions
10-18
(16) _PIDn_ERR (PID ERRor value) - Setting Prohibited
K DEVICE AREA : K1042+32n
Unit : DINT [ -2747483648 ~ 2747483647 ]
This is the current error value of the corresponding loop.
An error value in PID is defined as SV – PV. This is used as an indicator of how far the current state is from
the desired state. If the error is 0, it means the control system reaches its desired state. The control system
can be considered ideal if, when a control starts, the error rapidly decreases in the transient state and,
when it reaches the normal state, vibration is minimized and the offset(the error in the stable state) is kept
at 0.

(17) _PIDn_MV_p (PID MV Propotional component)
K DEVICE AREA : K1044+32n

- Setting Prohibited

Unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
This displays the proportional control value of the corresponding loop. If the error of the current system is
known, its integral and derivative control output values can also be calculated independently. Comparing
the 3 output values enables to determine the exact operational state of the control system and PID control.
MV is the sum of MV_p, MV_i, and MV_d.

(18) _PIDn_MV_i (PID MV Integral component)
K DEVICE AREA : K1046+32n ~ K1047+32n

- Setting Prohibited

Unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
This displays the integral control value of the corresponding loop.

(19) _PIDn_MV_d (PID MV Derivative component)
K DEVICE AREA : K1048+32n ~ K1049+32n

- Setting Prohibited

Unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
This displays the derivative control value of the corresponding loop.

(20) _PIDn_DB_W (PID DeadBand Width)
K DEVICE AREA : K1050+32n

- Setting Area

Unit : WORD [ 0 ~ 65535 ]
This sets the deadband of the corresponding loop. The deadband is set to a positive value and operates in
the range from [SV – DB_W] ~ [SV + DB_W]. If PV enters the area, SV is assigned to the PV value. If this
value is set to 0, the corresponding function does not operate.

Note

Deadband
This is used to let PV fully approach SV during system control so as to eliminate fine output
viariations due to fine state changes. Input of a value to DB_W during PID control forms a
deadband from [SV – DB_W] ~ [SV + DB_W]. If PV follows SV into the deadband during control,
ERR is forcibly calculated as 0 and, as far as PV remains in this area, the MV variation stops. This
has the same effect as stopping the controller for a while in the stabilization area and helps
avoiding a heavy load on the driver during stabilization operation. It is recommended to fully
stabilize the system before use in the area to be set as the deadband. Otherwise, when entering
the deadband, the controller experiences a temporary output excess.

Chapter 10 Built-in PID Functions
10-19

(21) _PIDn_Td_lag (PID Td lag filter)
K DEVICE AREA : K1051+32n

- Setting Area

Unit : WORD [ 0 ~ 65535 ]
This sets the primary delay filter for the corresponding loop so as to allow the derivative effect acting as an
instantaneous impact to act more slowly and continuously. If the corresponding value is set high, the
derivative effect becomes smoother and, if it set to 0, the corresponding function does not operate. The
derivateive value leads the system output to low vibration and helps avoid a heavy load on the driver.

(22) _PIDn_AT_HYS_val (PID Auto-Tuning HYSteresis value)
K DEVICE AREA : K1052+32n

- Setting Area

Unit : INT [ -32768 ~ 32767 ]
This sets a directional deadband appropriate for AT. The _PIDn_AT_HYS_val value operates differently as
a upper deadband when PV increases and as a lower deadband when PV decreases. Proper setting of
this value is critical for successful AT. Setting _PIDn_AT_HYS_val is described in 10.7.4.

(23) _PIDn_AT_SV (PID Auto-Tuning SV)
K DEVICE AREA : K1053+32n

- Setting Area

Unit : INT [ -32768 ~ 32767 ]
This separately sets AT_SV to be used as SV for AT of the corresponding loop. AT enables PV to vibrate 3
times up and down around AT_SV.

(24) _PIDn_AT_step (PID Auto-Tuning step)
K DEVICE AREA : K1054+32n

- Setting Prohibited

Unit : INT [ -32768 ~ 32767 ]
This displays the AT operation state of the corresponding loop. _PIDn_AT_step has values from 0 to 7; 0
indicates “before AT operation” and 7 indicates “AT operation completed”. 1, 3 and 5 indicate the PVincreasing areas and 2, 4 and 6 indicate the PV-decreasing area.

Caution

1) Setting Prohibited : The items marked with – Setting Prohibited are prohibited from being
set by the user. The corresponding area not only provides the user with
operational information but also stores information necessary for operations. A
random setting of the corresponding area causes the malfunction of the control
system.
2) Input/Output Area : _PIDn_PV and _PIDn_MV belong to - Input/Output Area, so use
them in a way they are connected to external equipment (AD, DA device).

Chapter 10 Built-in PID Functions
10-20

Note

Transient and Normal States
1) Transien State : A state during which the control system starts its control operatoin and
reaches the desired control state; there often occurs an instantaneous output
variation and, while the integral value approaches stability, there may occur a
vibration or overshoot.
2) Normal State : A state during which the control system reaches the desired state after
passing through the transient state; vibration is eliminated, there may occur
an offset and there is little change in the output value.
Upper / Lower Deadbands
When the analog output of the sensor is converted into a digital signal by means of an AD
device, much of the signal is mixed with noise. The PID control instruction executes Auto
tuning using this converted value; it enables PV to increase and dedcrease 3 times up and
down at SV. In the course of this process, if noise is input at the time when SV equals PV, a
single up and down conversion is incorrectly perceived as multiple conversions. This is the
same effect as the chattering of the digital switch. To overcome this, the PID controller uses a
unidirectional deadband (Hysteresis); when the PV value of the system increases toward SV,
the set deadband value operates in the upper part of SV and when the PV value passes SV
and decreases, the set deadband value operates only in the lower part of SV.
Time
SV
PV
Mode
Transition
Mode
Transition
Upper
Deadband
Lower
Deadband
Upper
Deadband

Chapter 10 Built-in PID Functions
10-21
10.6 Convenient Additional Functions of PID Instructions
This section describes additional functions that can be conveniently used in combination with the PID instructions.
10.6.1 Various PID-based control methods
Commonly used among PID controls are P control, PI control, PD control and PID control. When a certain
feature (mostly stabilization) is required, ID control, I control or D control is often used though they are
somehow more complicated. To implement these various controls, PIDRUN includes functions that allow or
prevent controls by P, I, and D, respectively. In case of P control, the P controller can be configured by
setting _PIDn_Ti and _PIDn_Td to 0. Similary, the ID controller can be obtained by setting _PIDn_Kp to 0
and assigning ID control coefficients to _PIDn_Ti and _PIDn_Td.
One special thing about the PIDRUN instructions is that, in case of ID control, setting _PIDn_Kp to 0
theoretically results in the controller output of 0. (Refer to Expressions 10.3.2 ~ 10.3.5) Actually, however,
PIDRUN, if 0 is input to _PIDn_Kp, internally calculates as MVp = 0 and K_p = 1, thus enabling ID, I control
and D control.
For example, when PI control is required, only _PIDn_Kp and _PIDn_Ti are set and 0 is input to _PIDn_Td.
When ID control is required, _PIDn_Kp is set to 0 and only _PIDn_Ti and _PIDn_Td are set.
10.6.2 Operation and function of anti wind – up
PIDRUN provides 2 Wind-up prevention functions: Anti Wind-up 1 and Anti Wind-up 2. The more basic of
the two, Anti Wind-up 1 operates for all I-related controls - I control, PI control, ID control and PID control -
and cannot be cleared. This operates by limiting Mvi (the integral term results) using _PIDn_MV_max,
_PIDn_MV_min.
Aniti Wind-up 2 is organically connected to MVp (the proportional term results). In case MV reaches 土
(_PIDn_MV_max) on MVp only, regardless of the MVi and MVd values, due to a large system error, Mvi
does not perform a calculation but keeps the previous value. In case the error is large, PV is brought near
SV (operating point) by MVp, not by Mvi or MVd, and then I control is resumed to prevent and excessive
value from being entered into Mvi. The operation of Anti Wind-up 2 can be cleared by the user by setting the
_PIDn_AW2D bit on the common bit area to On. This operates only during PI control or during a control
combining P control and I control, e.g. PID control.
10.6.3 Operation and function of Auto-tuning (AT)
PIDRUN has an AT function that enables to test operate the system though several basic settings and
calculate _PIDn_T_s, _PIDn_K_p, _PIDn_T_i and _PIDn_T_d appropriate for the system. The values of
_PIDn_MV_min, _PIDn_MV_max, _PIDn_AT_HYS_val, and _PIDn_AT_SV should be set before AT.
Based on these values, the AT function sets and operates MV over 3 different times in order, examines the
repeated system state (PV) reaction, measures the time taken for the system state (PV) to reach the AT Set
Value ( (AT_SV) and the vibration level, and accordingly calculates _PIDn_T_s, _PIDn_K_p, _PIDn_T_i and
_PIDn_T_d. To calculate the exact tuning value, please refer to “AT Setting” in1.7.4 for proper AT operation.

Note

Deletion of Previious Data upon Completionof Auto-tuning (AT)
When the AT operation described in 10.6.3 is completed, the new values of _PIDn_T_s, _PIDn_K_p,
_PIDn_T_i and _PIDn_T_d are automatically substituted for the existing values. Note, therefore, that
the previous value of _PIDn_T_s, _PIDn_K_p, _PIDn_T_i and _PIDn_T_d are deleted.

Chapter 10 Built-in PID Functions
10-22
10.6.4 Operation and function of cascade (CAS)
PDCAS performs cascade PID control through sequential operation of two PID loops. Generally, cascade
PID control is used for temperature control through chemical process or fuel control; The two loops used
here are called master loop and slave loop. As an example of temperature control through fuel flow, in case
of a single loop PID control, the fuel valve is opened and closed to control the fuel flow and consequenctly
control the temperature of the heating furnace. This is, therefore, a system in which a single PID loop
indirectly controls temperature through fuel flow control. In this case, equipping the system with a fuel flow
meter enables cascade PID control that consists of flow control and temperature control: the slave loop
controls the flow using the valve and the master loop controls temperature using the flow. The master loop
transfers the desired flow to the slave loop, while the slave loop monitors the flow meter and adjusts the flow
using the valve so that fuel corresponding to the flow desired by the master loop is injected. The slave loop
operates on the flow Set Value set by the master loop, regardless of temperature.
In terms of the internal cascade operation, the master loop measures the temperature (PV_mst) in a more
delayed manner than the slave loop and transfers the flow value (MV_mst) computed for the user’s desired
temperature (MV_mst) to the slave loop. The slave loop sets the flow value (MV_mst) transferred from the
master loop as the Set Value (SV_slv) and measures the fuel injection amount (PV_slv) in a more frequent
manner than the master loop in order to control the valve opening and closing (MV_slv).
Cascade, therefore, functions to transfer MV (MV_mst) of the master loop to SV (SV _slv) of the slave loop
when two loops are in operation.
If the slave loop is converted to manual output mode, the master output is not used and the master loop is
also converted to manual output mode. The manual mode _PIDn_MAN bit is not turned ON in the master
loop. If the slave loop is converted to auto output mode again, the master loop is also turned to auto output
mode. If _PIDn_MV_BMPL is set to On, state data is exchanged between the two loops to ensure a smooth
conversion.
If the slave loop is in Anti Wind-up mode, the master loop operates in PIDPAUSE mode. When there is a
need to increase or descrease the slave Set Value (SV_mst) despite the occurrence of anti wind-up, this
function prevents the occurrence of 2nd wind-up for the whole cascade loop. This function always operates
according to the corresponding conditions and the _PIDn_PAUSE bit is not turned On.
Master
Loop
Slave
Loop

Valve

Flowmeter
Heater
Heating
Furnace
Thermometer

Fuel

PV_mst
User
SV_mst
SV_slv = MV_mst
MV_slv PV_slv
Cascade loop

Note

Auto-tuning (AT) of Cascade System
In case of AT of a cascade system, AT of the slave loop precedes AT of the master loop. For AT of
the slave loop, it is required to predict how much SV the slave loop receives from the master loop
and setting AT_SV to this value enables the slave loop to operate as an independent loop. AT
performance may differ according to the predicted value. Upon completion of AT of the slave loop,
AT of the master loop starts.

Chapter 10 Built-in PID Functions
10-23
10.7 How to Use PID Instructions
This section describes how to use PID instructions.
For detailed description of the functions of the CPU, specific modules and XG5000, refer to the corresponding
manuals.
10.7.1 Hardware configuration
The example system has a configuration as shown below.

User
SV	PID operation module	DA Conversion module Auto mode mode MV MV
AD Conversion ’mode
PV

CPU
User	MV_manual

Sensor

Control
object

Manual
revir(1) CPU (XGK-CPUH)
The CPU is where PID operation occurs and so can be called “PID controller”. The controller receives data
sensed from the input module, calculates a proper output through operation, and then transfers it to the
output module. What the user should do is to connect input and output and design the interior of the PID
controller (tuning). Generally, analog input module and analog output modules are used for input and
output, respectively.
(2) Analog Input Module (XGF-AV8A)
This functions to receive the state of the control object from the sensor and transfer it to the CPU. The
analog input module channel 0 enables to receive a voltage of 0 V ~ 5 V as input and transfer its digital
value to the PLC as output. There are 8 channels (CH 0 ~ CH 7) in XGF-AV8A. The setting for XGXGFAV8A can be changed through the I/O parameter setting window that appears when selecting I/O
Parameter from the parameter items in the project window. Channel 0 is changed to “Operation” mode and
the input range is set to 0 ~ 5 V (according to the sensor). The output data type is the PV value of the PID
controller. For PID control, the range of its value is set to 0 ~ 10000.
The 0 ~ 5 V signal detected from the sensor during analog input module operation is converted 2,000
times to a digital value of 0 ~ 10000 and then transferred to the PLC.
Chapter 10 Built-in PID Functions
10-24
The following figure shows the screen of XGF-AV8A setting in XG5000.
(3) Analog output Module (XGF-DV4A)
The analog output module converts a controller output digital value generated through control operation in
the PLC to 4mA ~ 20mA and transfers it to the driver of the control object. The XGF-DV4A model has 4
channels and its setting can be changed through the I/O parameter setting window, as in XGXGF-AV8A.
Channel 0 is changed to “Operation” mode and the input range is set to 0 ~ 5 V (according to the driver).
The 0 ~ 10000 MV digital output generated through PID control operation is reduced to 1/2000 and then
transferred to the signal of the driver. The following figure shows the screen of XGF-DV4A setting in
XG5000.
(4) Sensor and Driver
Along with the analog output module and analog input module, the sensor and driver respectively function
as the media to transfer the state of the control object to the controller and transfer the controller output to
the control object. The output generated from the sensor should be able to be used as the input of the
analog input module and the output generated from the analog output module should be able to be used
as the input of the driver. For an easy example, if the sensor’s current mode is 4mA ~ 20mA, the analog
input module’s current mode should be 4mA ~ 20mA; if the driver’s voltage mode is 0V ~ 5V, the analog
output module’s voltage mode should be 0V ~ 5V. The output of the analog output module used as the
driving signal of the driver. Using it as the power of the driver may cause malfunction of the PLC due to
power loss.
Chapter 10 Built-in PID Functions
10-25
(5) Control Object
The current system uses a water level control system as the control object. A water level control system is
a stem to maintain a desired water level by pumping water into a water tank whose lower part has a small
opening for outflow of water. The water in the tank flows out at a constant rate. The decision to increase or
decrease the water level is based on the water inflow. The structure of a water level control system is
shown below.

Pump

Driver

Inflow

Outflow
Water
level

Water level
sensor

Water
tank

10.7.2 Program example 1
The following figure shows a program example of performing PID control using analog modules.
(In this program, the PID constant value and SV value are set in the Variable Monitor window.)
Chapter 10 Built-in PID Functions
10-26
Step 1: Each channel 0 of the analog input and output modules is enabled using the regular On contact.
Step 7: The analog input module input data are transferred to PIDRUN Loop 0 PV using the regular On
contact.
Step 12: If the user turns the M00000 bit On, control operation of PIDRUN Loop 0 is performed.
Step 17: MV output of PIDRUN Loop 0 is transferred to analog output module output data.
Step 21: The scan is completed.
10.7.3 PID controlling
(1) Variable Registration
Control settings is performed by registering PID variables in the Variable Monitor” window.
Clicking the right button of the mouse and then selecting “Register in Variable/Description” in the Variable
Monitor window allows you to see the “Variable/Device Select” window. Selecting PID in the “List” box and
deselecting “All” and then entering 0 (loop number) in “Parameter Number” allows you to see the variables
to store all the settings and states for Loop 0. Selecting all variables and then clicking “Confirm” enables
you to monitor the variables or change their values even when the program is in “RUN” mode.
Chapter 10 Built-in PID Functions
10-27
(2) Determination of SV
In order to set SV, the PV value of the system desired by the user should be determined. To put it easily, in
order to maintain the water level at 250mm, the PV value for 250mm should be determined. This value can
be determined through numerical analysis of the system but it will be more exactly determined by
experimenting with the reaction of the control object. Analysis with the current system suggests that, with
the water level of 250mm, PV outputs the value of 8333, but an actual operation showed that, with the
water level of 250mm, the sensor output value was 3250. The reasons for such an error are the inaccurary
of the sensor, the error of the measuring base point, etc. So, the actually measured value of 8250 should
be used as the state value when the water level is 250mm. This value will be used as the SV value for
control of 250mm.
(3) Control Setting
After the previously developed program is downloaded to the PLC, then monitoring begins. The next step
is to set the variables registered in the Variable Monitor window. The following figure shows the screen of
settings in the Variable Monitor window of the example program.
Settings were made for SV, K_p, and MV_max.
The actually measured value of 8250 was set for SV and 5 was randomly selected for Kp.
MV_max, an item to limit the maximum value of MV, was set to 10000 according to the analog module.
Chapter 10 Built-in PID Functions
10-28
(4) Observation of Control States Using the Trend Monitor
You can enable the trend monitor, one of the monitor functions of XG5000.
The trend monitor can be properly arranged by allowing its docking.
Data to be observed are registered through the trend setting.
Chapter 10 Built-in PID Functions
10-29
The monitoring cycle is set to 200m and, after the trend graph tap in the lower part is selected, SV and PV
of Loop 0 are registered as INT.
(5) Program Run (Here an example is given to show how to find a parameter manually. For auto tuing,
refer to the method below.)
When the contact (M00000) is turned On, the system starts up.
After increasing K_p to 100, the system is started again.
Because K_p is set too large, the system vibrates in a permanent and regular manner.
Settings are made as follows: K_p = 20, T_i = 100
Chapter 10 Built-in PID Functions
10-30
Because the T_i value is too large, the normal state offset lasts long and there occurs a slight overshoot.
Settings are mede as follows: K_p = 10, T_i = 1.
Because T_i is too small, PV fluctuates slowly.
Settings are made as follows: K_p = 10, T_i = 5
This is a satisfactory result.
After changing T_d to 0.1, the system is started again.
Chapter 10 Built-in PID Functions
10-31
The system rocks and the error increases.
Since the current system is a slow system that can be fully controlled by PI, only PI control is required.
Therefore, the tuning results are as follows: K_p = 10, T_i = 5, T_d = 0
Chapter 10 Built-in PID Functions
10-32
10.7.4 How to start up using AT (Auto-tuning)
This section explains the correct AT setting method through operating the system described in 10.7.3
using the AT function. The basic AT function properly operates when the system is not started yet or when
the system has PV at least smaller (larger in case of reverse operation) than the _PIDn_AT_SV value.
Basically, AT performs different operations in different steps. The step increases from 0 to 7 and the step
of the current loop can be known by _PIDn_AT_step. In PIDSTOP mode, the AT step is 0 and increases
(automatically) as AT starts. When it reaches 7, AT is completed. The user’s random manipulation of the
step may cause malfunction.
To avoid redundant descriptions, the procedures from 10.7.3 (1) to (4) are first implemented and then the
present settings are applied. First, _PIDn_AT_SV is set. Though the _PIDn_SV value has been already
set above, the system is vibrated during Auto-tuning so that PV is more than the _PIDn_SV value. To
prevent any harm to the system in the course, an appropriate SV value should be set in _PIDn_AT_SV.
For other cases, _PIDn_AT_SV should be set the same with _PIDn_SV. The _PIDn_AT_SV value is
used only during AT and, upon completion of AT, the system is automatically started based on _PIDn_SV.
Next, _PIDn_MV_min and _PIDn_MV_max are set. During AT, the _PIDn_MV_min and _PIDn_MV_max
values are respectively considered as the minimum/maximum output of the system. During AT, the two
values differ each other in 3 cycles depending on the system speed (how fast PV reaches around SV). For
example, with _PIDn_MV_min = 0, _PIDn_MV_max = 10000, the system driving signal (MV) transferred to
the motor or heater repeats the “0 →10000 → 0” output 3 times. If there is a possibility that such a radical
change may put a heavy load on the system, _PIDn_dMV should be set.
Next, the PIDn_HYS_val value is set. _PIDn_HYS_val is used only during AT. This is a deadband that
occurs when PV reaches around SV. When PV increases, it occurs above the baseline and, when PV
decreases, it occurs below the baseline. If SV is 5000 and _PIDn_HYS_val is 100, AT increases PV until
5100 ( SV + _PIDn_HYS_val ) while maintaining MV at _PIDn_MV_max. Afterward, it decreases PV until
4900 ( SV - _PIDn_HYS_val ) while maintaining MV at _PIDn_MV_min.
The above graph shows a water level waveform obtained by setting an appropriate _PIDn_HYS_val value
(50 in the figure). A rectangular waveform should appear in MV 3 times.
Chapter 10 Built-in PID Functions
10-33
The above graph shows a water level waveform obtained by setting _PIDn_HYS_val too small (10 in
the figure). If a rectangular waveform does not appear 3 times in MV, a correct AT operation cannot be
guranteed. Setting _PIDn_HYS_val too large may cause system slowdown.
10.7.5 Program example 2
The following figure shows the screen of the PID constant value and SV value settings in the 10.7.2
program that performs PID control using the A/D and D/A conversion modules.
Chapter 10 Built-in PID Functions
10-34
10.7.6 Startup using PWM
Input is done using the A/D conversion module as shown in the simulation above and the output signal is
converted to PWM to control the system using a relay module or TR module.
The following figure shows a program example of performing PID control using A/D and D/A conversion
modules.
Step 1 : The A/D conversion module channel 0 is enabled using the regular On contact and the A/D
conversion module input data are transferred to PIDRUN Loop 0 PV.
Step 7 : If the user turns the P00700 bit On, control operation of PIDRUN Loop 0 is performed.
Step 12 : If PIDRUN Loop 0 is in stop mode, the PWM On time is set to 0 and the output to OFF.
Step 17 : PIDRUN Loop 0 MV output ( 0 ~ 10000 ) is divided by 5 into ( 0 ~ 2000 ) using the regular On
contact. D00510 is used as the PWM On time and D00520, the remaining time subtracted from
2000 by D00510, is used as the PWM OFF time.
A PWM signal with a cycle of 20000 (2 sec) can be obtained using D00510 and D00520.
The corresponding output device is driven by controling the P0004A bit using the generated
PWM.
Step 34 : The scan is completed.
Chapter 10 Built-in PID Functions
10-35
10.7.7 Cascade startup
The ladder program above is a cascade startup program based on the block diagram below.
Master loop
(0)
Slave
loop (1)

Valve

Flowmeter
Driver
Heating
furnace
Thermometer

Fuel

K1038
User
K1024
K1066 = K1040 (Auto)
K1070 K1072
Cascade loop
U00.03 U01.03
U01.02
Chapter 11 Installation and Wiring
11-1
Chapter 11 Installation and Wiring
11.1 Installation
11.1.1 Installation Environment
This equipment has a high reliability regardless the installation environment. However, cares should be taken
for the following items in order to secure the reliability and stability.
1) Environment Condition
(1) Install in control panel with water-proof and vibration-proof.
(2) Free from impact or vibration.
(3) Do not expose directly to the sun.
(4) No condensing by sudden temperature change.
(5) Ambient temperature : 0 ~ 55°C.
(6) Incremental Humidity : 5 ~ 95% .
(7) Free from corrosive gas or inflammable gas
2) Installation Construction
(1) In case of processing of screw hole or wiring, do not enter the wiring fragments into PLC.
(2) Select the installation place good for operation.
(3) Do not install the equipment in the same panel with high voltage device.
(4) Keep more than 50mm from wiring duct or surrounding module.
(5) Grounding at the place where surrounding noise environment is good.
3) Heat Protection Design of Control Panel
(1) In case that PLC is installed in the airtight control panel, the heat protection design shall be carried out
considering radiation of other equipment as well as the heat of PLC itself. In case of air circulation using
the vent or general fan, PLC system may be influenced by the flow of dust or gas etc.
(2) It is recommended to install a filter or use the airtight heat exchanger.
Chapter 11 Installation and Wiring
11-2
The following shows the method to calculate the current consumption of PLC system itself necessary for heat
protection design.
4) Current Consumption Block Diagram of PLC System
5) Current Consumption of Each Part
(1) Current Consumption of Power Module
Current conversion efficiency of power module is about 70% and 30% is consumed by the
radiation, and 3/7 of output power shall be a current consumption itself. Accordingly, the
calculation formula is as below.
• Wpw = 3/7 {(I5V X 5) + (I24V X 24)} (W)
I5V : Current consumption of DC5V circuit of each module
(internal current consumption)
I24V: Average current consumption of DC24V of output module
(current consumption of simultaneous On point)
Not available in case that DC24V is supplied from outside or power module
without DC24V output is used.
(2) Sum of DC5V circuit current consumption
DC5V output circuit current of power module is the sum of current consumption of each
module.
• W5V = I5V X 5 (W)
(3) DC24V Average current consumption (current consumption of simultaneous On point)
DC24V output circuit average current of power module is the sum of current consumption of
each module.
• W24V = I24V X 24 (W)
(4) Average current consumption by output voltage drop of output module (current consumption of simultaneous On
point)
• Wout = Iout X Vdrop X output point X simultaneous On rate (W)
Iout : output current (current in actual use) (A)
Vdrop: voltage drop of each output module (V)
Power CPU

Constant
voltage
transformer

AC power
100V~240V
COM. COM. OUT IN SPE
DC5
DC24
Load
I out I in
I 5V
I 24V
AC power
100V~240V
DC
power
24V
Chapter 11 Installation and Wiring
11-3
(5) Input average current consumption of input module (current consumption of simultaneous On point)
• Win = lin X E X input point X simultaneous On rate (W)
Iin: Input current (actual value in case of AC) (A)
E : Input voltage (voltage in actual use) (V)
(6) Current consumption of Special module power
• WS = I5V X 5 + I24V X 24 + I100V X 100 (W)
As above, the value that added the current consumption calculated per each block is total current
consumption of PLC system.
• W = WPW + W5V + W24V + Wout + Win + Ws (W)
Calculate the radiation amount according to this total current consumption (W) and review the
temperature rising in control panel.
The calculation formula of temperature rising in control panel is shown as below.
T = W / UA [°C]
W : Total current consumption of PLC system(the value obtained on the above
A : Surface area in control panel [m2]
U : In case of making the temperature in control panel by fan etc. - - 6
In case that the air in control panel is not circulated- - - - - - - - - - 4
Chapter 11 Installation and Wiring
11-4
11.1.2 Handling Precautions
Here describes the notices in handling from the opening of each module to installation.
• Do not fall or apply the deep impact.
• Do not remove PCB from the case. It may cause the failure.
• Cares should be taken so that foreign materials such as wiring fragments are not entered into the upper
part of module. If entered, remove it.
1) Notices in Handling I/O Module
Here describes the notices for the cases of handling or installing I/O module.
(1) Recheck of I/O module specification
For input module, you must consider input voltage and for output module, if the voltage exceeding
max. open/close capacity is applied, it may cause the failure, destroy or fire.
(2) Use cable
Cable shall be selected considering ambient temperature and allowable current and min. spec. of
cable should be more than AWG22(0.3mm2).
(3) Environment
In case of wiring I/O module, if it is too close to the equipment with high heat or the wiring is directly
touched to the oil for a long time, it may cause the short circuit or occur the breakage or abnormal
operation.
(4) Polarity
For the module having the polarity in terminal block, it is required to check the polarity before applying
the power.
(5) Wiring
• In case of wiring that I/O wiring is carried out with high voltage cable or power cable, it may occur the
inductive disturbance which result in abnormal operation or failure.
• Do not allow the cables to pass in front of I/O operation indicator (LED).
(It is not possible to distinguish I/O indicator correctly.)
• In case that the inductive load is connected to output module, connect the surge absorber or diode
to the load in parallel. The cathode of diode shall be connected to (+)pole of power.
OUT
COM
Output Module
Inductive load
Surge absorber
OUT
COM
Output Module
Inductive load
Diode
+ -
Chapter 11 Installation and Wiring
11-5
(6) Terminal Block
Check the compression state of terminal block and pay attention not to enter the fragments of cable
into PLC in case of wiring of terminal block or processing the screw hole. If not, it may cause the
abnormal operation or the failure.
(7) Except the examples above, do not apply deep impact to I/O module or remove PCB board from the case.
2) Notices in Attaching Base
Here describes the notices in case of attaching PLC to the control panel.
(1) Keep the distance enough between the upper part of module and the structures or parts in order to
make a ventilation good and change the module easily.
(2) Avoid the longitudinal connection or horizontal attachment considering a ventilation.
(3) Use the panel different from the vibration sources of large sized electronic contactor or no fuse breaker
etc., or keep the clearance when installing.
(4) Install the wiring duct if necessary. But cares should be taken for the following notices in case the
dimension of the upper or lower part of PLC is smaller than that of Figure 11.1.
• In case of installing on the upper part of PLC, keep the height of wiring duct less than 50mm for
good ventilation. And keep the distance from the upper part of PLC enough to press the hook on the
upper part of Base.
• In case of installing on the lower part of PLC, consider the connection of optical cable or coaxial
cable and minimum radius of cables.
(5) PLC should be installed to the direction as shown on the following Figure for good ventilation against
radiation.
Chapter 11 Installation and Wiring
11-6
(6) Do not install PLC to the direction as below.
(7) When installing PLC or other equipment (Relay, electronic contactor), keep the distance to avoid
radiant noise or heat.
100mm or more
50mm or more
50mm or more
Chapter 11 Installation and Wiring
11-7
11.1.3 Attachment/Detachment of Module
Here describes the method to attach each module to the base or remove it.
1) Attachment of Module
• Insert a fixed projection of the lower part of PLC into the module fixed hole of the base.
• Slide the upper part of module to fix to the base, and then fit it to the base by using the module fixed
screw.
• Pull the upper part of module to check if it is installed to the base completely.

Notes

1) For Module installation, it is required to insert the fixed projection of module into the module
fixing hole and then fix it. If forced to attach it, module may be broken.

Module fixing Hole Module loading lever
Chapter 11 Installation and Wiring
11-8
2) Detachment of Module
• Loosen the fixed screws of the upper part of module from the base.
• Hold the module by both hands and press the fixed hook of module thoroughly.
• By pressing the hook, pull the upper part of module from the axis of the lower part of module.
• By lifting the module upward, remove the fixed projection of module from the fixing hole.

Notes

1) In case of detachment of module, press the hook and remove the module from the base, and
then remove the fixed project of module from the fixed hole of module. In this case, if forced
to detach the module, a hook or the fixed projection of module may be broken.

Module fixing hook
Chapter 11 Installation and Wiring
11-9
11.2 Wiring
Here describes the items to know related to the wiring, in case of using the system.
11.2.1 Power Wiring
1) In case that the power change is larger than the range of standard, connect the voltage regulated
transformer.
2) Connect the power having the small noise between cables or between earths.
(In case of having lots of noise, connect the insulation transformer.)
3) For PLC power, I/O machine and power machine, divide the system as below.
Power CPU

Constant
Voltage
transformer

AC power
AC power
100V~240V
Power CPU
AC220V
Main power
Constant
Voltage
transformer
PLC power
Main circuit equipment
I/O power
Chapter 11 Installation and Wiring
11-10
4) In case of using a DC24V output of Power Module
 Do not connect a DC24V output of several power module in parallel. If connected in parallel, the module
may be broken.
 In case that DC24V output capacity of one power module is not enough, supply the external DC24V
power as below.
5) AC110V, AC220V, DC24V cables should be twisted tightly and connected within the shortest distance.
6) AC110V, AC220V cables use the thick cable (2mm2) to reduce the voltage drop.
AC110V, DC24V cables should not approach to main circuit (high voltage, high current) cable or I/O signal
cable. Keep more than 100mm if possible.
7) Use the surge absorber against lightning as shown in the figure below.
8) Use the shielded insulation trans or noise filter when a noise invasion is expected.
9) The wiring of each input power should be twisted shortly if possible, and the shielded trans or noise filter
wiring should be done without passing the duct.

Notes

1) Separate PLC earth(E2) from the earth(E1) of surge absorber against lightning.
2) Select the surge absorber against lightning not to exceed max. allowable voltage of surge absorber
in case of rising the power voltage at max.

24V
LG
PE
AC
Power

I / O

24V
LG
PE
AC
Power

I/O

Power
Supply

DC 24V

PLC
I/O device

Surge absorber against lightning

24V
LG
PE
AC
Power

I/O

Chapter 11 Installation and Wiring
10-11
11.2.2 I/O Device Wiring
1) The spec. of cable for I/O wiring shall be 0.3~2 mm2 but it is recommend to use the convenient cable
spec.(0.3 mm2)).
2) Separate Input cable and Output cable for wiring.
3) I/O signal cable should be separated more than 100mm from main circuit cable of high voltage/high current.
4) If not possible to separate main circuit cable and power cable, use the shielded cable all and earth a PLC.
5) In case of pipe wiring, check the pipe completely for earth.
6) Separate output cable of DC24V from AC110V cable or AC220V cable.
For the long distance wiring more than 200m, as it is expected to have problem by leakage current caused by
the capacity between cables, please refer to 12.4 Various Cases.
11.2.3 Earth Wiring
1) As this PLC has a sufficient measures against noise, it is possible to use it without earth except the case
having specially lots of noises.
2) Use the dedicated earth if possible.
In case of Earth works, use 3 class earth (earth resistance 100 Ω or less).
3) If not possible to use dedicated earth, use the common earth as shown on the Figure B] as below.
A) Dedicated earth : Best B) Common earth : Good C) Common earth : Poor

Input
Output

PLC Shield cable
DC

PLC

Other

PLC

Other

PLC

Other

3 class earth 3 class earth
Chapter 11 Installation and Wiring
11-12
4) Use more than 2 mm2 cable for earth. Place the earth point near this PLC as possible to have the short
length of earth cable.
5) Separate LG of power module and PE of base board for earth.
A) dedicated earth : Best B) common earth : Good C) common earth: Poor
6) If the abnormal operation is found according to the earth, separate PE of the base from the earth.
11.2.4 Cable Specification for Wiring
The specification of cable used for wiring is as below.

Type of External Connection	Cable specification (mm2)
Low limit	High limit
Digital Input	0.18 (AWG24)	1.5 (AWG16)
Digital Output	0.18 (AWG24)	2.0 (AWG14)
Analog I/O	0.18 (AWG24)	1.5 (AWG16)
Communication	0.18 (AWG24)	1.5 (AWG16)
Main power	1.5 (AWG16)	2.5 (AWG12)
Protection earth	1.5 (AWG16)	2.5 (AWG12)

Power

Chapter 12 Maintenance and Repair
12-1
Chapter 12 Maintenance and Repair
Please carry out Daily Checking and Regular Checking to maintain PLC in best condition.
12.1 Repair and Checking
As I/O module is mainly consisted of semiconductor elements, the life seems to be semi-permanent. But the
error in the elements may occur by surrounding environment and thus the regular checking is needed. For the
items to check 1~2 times every 6 months, please refer to the following table.

Checking items	Judgment basis	Actions
Power Supply	Power change range (within -15% / +10% )	Change the power so that it should be within the allowable voltage range.
I/O power	I/O specifications of each module	Change the power so that it should be within the allowable voltage range of each module
Surrounding environment	Temperature	0 ~ + 55℃	Adjust the ambient temperature and humidity to be in proper range.
Humidity	5 ~ 95%RH
Vibration	No vibration	Use the vibration-proof rubber or take other measures to prevent the vibration.
Shaking of each module	No shaking	All module should not be shaken.
Loosening of terminal screw	No loosening	Tighten the loosened screw.
Spare parts	The possessing amount and preservation state	Fill the lack and improve the preservation state

12.2 Daily Checking
The items to check daily are as follows.

Checking items	Contents	Judgment Basis	Action
Base attachment state	Check the loosening of attached screw.	Complete tightening	Tighten screw
I/O module attachment state	• Check if the attached screw of module is tightened completely. • Check if the upper cover of module is removed.	Complete tightening	Check screw
Connection state of terminal block and extended cable	Loosening of terminal screw	No loosening	Tighten screw
Approach between compressed terminal	Proper interval	Adjust
Connector of extended cable	No connector loosening	Adjust
Indicator LED	Power LED	Check LED ON	LED ON (off is abnormal)	Ref. Cha.13
RUN LED	Check LED ON during Run state	LED ON (off or blink is abnormal)	Ref. Cha.13
STOP LED	Check LED OFF during Run state	Blink is abnormal.	Ref. Cha.13
Input LED	Check LED ON/OFF	Input On, LED ON Input Off, LED OFF	Ref. Cha.13
Output LED	Check LED ON/OFF	Output On, LED ON Output Off, LED OFF	Ref. Cha.13

Chapter 12 Maintenance and Repair
12-2
12.3 Regular Checking
Check the following items 1~2 times every 6 months and take a necessary actions.

Checking items	Contents	Judgment Basis	Action
Surrounding environment	Temperature	Thermometer/humidifier corrosive gas measurement	0 ~ 55 °C	Adjust to meet general specification (environment standard in control panel)
Humidity	5 ~ 95%RH
Pollution degree	No corrosive gas
PLC state	loosening, shaking	Move each module	Complete tightening	Tighten screw
Dust, foreign materials	Macrography	No attachment	-
Connection state	Screw loosening	Tighten by driver	No loosening	Tighten
Approach of compressed terminal	Macrography	Proper interval	Adjust
Connector loosening	Macrography	No loosening	Tighten connector screw
Power voltage checking	Check the power voltage of the power input terminal using a tester.	AC100~240V: AC85~ 264V DC24V:DC19.2 ~ 28.8V	Change the power supply
Battery	Check the battery change period and voltage drop indication.	• Check total shutdown time and warranty • No indication of battery voltage drop	Change the battery if exceeding the warranty without battery capacity indication
Fuse	Macrography	• No cutoff	Change it regularly as deterioration of element may occur by inrush current.

Chapter 13 EMC Directive
13 -1
Chapter 13 EMC Directive
13.1 Requirements for Conformance to EMC Directive
The EMC Directive specifies the products must “be so constructed that they do not cause excessive
electromagnetic interference (emissions) and are not unduly affected by electromagnetic interference (immunity)”.
The applicable products are requested to meet these requirements.
This section summarizes the precautions on conformance to the EMC Directive of the machinery assembled using
PLC XGK series. The details of these precautions are based on the requirements and the applicable standards
control. However, LSIS will not guarantee that the overall machinery manufactured according to the these details
conforms to the below-described directives. The method of conformance to the EMC directive and the judgment on
whether or not the machinery conforms to the EMC Directive must be determined finally by the manufacturer of the
machinery.
13.1.1 EMC Standard
The standards applicable to the EMC Directive are listed below.
Table13-1

Specification	Test item	Test details	Standard value
EN50081-2	EN55011 Radiated noise ＊ 2	Electromagnetic emissions from the product are measured	30~230 ㎒ QP : 50 ㏈㎶/m ＊ 1 230~1000 ㎒ QP : 57 ㏈㎶/m
EN55011 Conducted noise	Electromagnetic emissions from the product to the power line is measured	150~500 ㎑ QP : 79 ㏈ Mean: 66 ㏈ 500~230 ㎒ QP : 73 ㏈ Mean: 60 ㏈
EN61131-2	EN61000-4-2 Electrostatic immunity	Immunity test in which static electricity is applied to the case of the equipment	15 ㎸ Aerial discharge 8 ㎸ Contact discharge
EN61000-4-4 Fast transient burst noise	Immunity test in which burst noise is applied to the power line and signal lines	Power line: 2 ㎸ Digital /O : 1 ㎸ Analog I/O, signal lines: 1 ㎸
EN61000-4-3 Radiated field AM modulation	Immunity test in which field is irradiated to the product	10Vm,26~1000 ㎒ 80%AM modulation@ 1 ㎑
EN61000-4-12 Damped oscillatory wave immunity	Immunity test in which a damped oscillatory wave is superimposed on the power line	Power line: 1 ㎸ Digital I/O (24V or higher): 1 ㎸

＊ 1) QP: Quasi-peak value, Mean: Average value
＊ 2) The PLC is an open type device (device installed to another device) and must be installed in a conductive
control panel. The tests for the corresponding items were performed while the PLC was installed inside a
control panel.
Chapter 13 EMC Directive
13 -2
13.1.2 Control Panel
The PLC is an open type device (device installed to another device) and must be installed in a control panel. This is
needed to prevent electric shock by touching XGK PLC and reduce the PLC-generated noise. Install the XGK PLC
in a metallic panel to reduce PLC-generated EMI (Electro-magnetic interference),
The specifications for the control panel are as follows:
1) Control panel
The PLC control panel must have the following features:
(1) Use SPCC (Cold Rolled Mild Steel) for the control panel.
(2) The steel plate should be thicker than 1.6mm.
(3) Use isolating transformers to protect the power supply from external surge voltage.
(4) The control panel must have a structure which the radio waves does not leak out.
For example, make the door as a box-structure so that the panel body and the door are overlapped each other. This
structure reduces the surge voltage generate by PLC.
(5) To ensure good electrical contact with the control panel or base plate, mask painting and weld so that good
surface contact can be made between the panel and plate.
Panel body
Door
Seal
Chapter 13 EMC Directive
13 -3
2) Connection of power and earth wires
Earthing and power supply wires for the PLC system must be connected as described below.
(1) Earth the control panel with a thick wire so that a low impedance connection to ground can be ensured even at
high frequencies.
(2) The function of LG (Line Ground) and PE (Protective Earth) terminals is to pass the noise generated in the PLC
system to the ground, so an impedance that is as low as possible must be ensured.
(3) The earthing wire itself can generate the noise, so wire as short and thick to prevent from acting as an antenna.
13.1.3 Cables
1) Extension cable connection
The extension cables contain a high frequency noise. Therefore, a ferrite core is attached to the extension cable as
shown in the picture below to meet the CE conformance.

Model	Remarks
CU1330D	E-TECH ELECTRONICS	-
ZCAT3035-1330	TDK	-

Manufacturer

2) Cable connection method for the inside control panel
In the case that the extension cable is connected to the metal panel, a space of at least 1cm is needed from the
panel. The metal board of the control panel has a shielding effect that blocks noise, but it could be served as an
antenna when in contact with a cable which would create a noise source.
Keep all high-speed signal transmission cables at a safe distance from the metal board.

Ferrite core

Chapter 13 EMC Directive
13 -4
13.2 Requirement to Conform to the Low-voltage Directive
The low-voltage directive requires each device that operates with the power supply ranging from 50V to 1000VAC
and 75V to 1500VDC to satisfy the safety requirements. Cautions and installation and wiring of the PLC XGK
series to conform to the low-voltage directive are described in this section.
The described contents in this manual are based on the requirements and the applicable standards control.
However, LSIS will not guarantee that the overall machinery manufactured according to the these details conforms
to the above regulation. The method of conformance to the EMC directive and the judgment on whether or not the
machinery conforms to the EMC Directive must be determined finally by the manufacturer of the machinery.
13.2.1 Standard Applied for XGK Series
The XGK series follow EN6100-1 (safety of devices used in measurement rooms, control rooms, or
laboratories). And the XGK series modules which operate at the rated voltage of AC50V/DC75V or above
are also developed to conform the above standard.
13.2.2 XGK Series PLC Selection
(1) Power module
There are dangerous voltages (voltages higher than 42.4 peak) inside the power supply modules of the
AC110/220V rated I/O voltages. Therefore, the CE mark-compliant models are enhanced in insulation
internally between the primary and secondary.
(2) I/O module
There are dangerous voltages (voltages higher than 42.4V peak) inside the I/O modules of the
AC110/220V rated I/O voltages. Therefore, the CE mark-compliant models are enhanced in insulation
internally between the primary and secondary.
The I/O modules of DC24V or less rating are out of the low-voltage directive application range.
(3)CPU module, Base unit
The above modules are using DC5V and 3.3V circuits inside, so they are out of the low-voltage directive
application range.
(4) Special module, Communication module
The special module and communication modules are DC24V or less in rated voltage, therefore they are
out of the low-voltage directive application range.
Chapter 14 Troubleshooting
14-1
Chapter 14 Troubleshooting
Here describes the contents of various errors to be occurred while operating the system, the methods to find
the causes and the actions.

14.1 Basic Procedure for Troubleshooting

It is important to use the high reliable machine to increase the system reliability but it is important to take
a prompt action when the trouble occurs as well.
To start the system promptly, it is more important to find the trouble occurring cause promptly and take
the necessary action. The basic items to comply when taking this trouble shooting are as follows.
1) Check by the naked eye
Check the following items by the naked eye.
• Machine operation state (STOP, RUN)
• Power supply state
• I/O machine state
• Wiring state (I/O cable, extended and communication cable)
• After checking the indication state of each indicator (Power LED, Run LED, Stop LED, I/O LED
etc.), connect the peripheral device and check PLC operation state and program contents.
2) Trouble Checking
Examine how the trouble is changed by the following action.
• Place the key switch on STOP position and apply the power ON/OFF.
3) Limit range
Estimate what is the trouble cause using the above method.
• Is it from PLC itself ? Or external cause ?
• Is it from I/O module ? Or other cause?
• Is it from PLC program?

14.2 Troubleshooting

Here describes the method to find the trouble, the error code and the actions on the above by dividing
them per phenomenon.
Trouble contents
When Power LED is OFF
When ERR. LED is blinking
When RUN, STOP LED is
OFF
When I/O module operates
abnormally
When PROGRAM WRITE
does not work
Action method when Power LED is OFF.
Action method when ERR LED is blinking
Action method when RUN, STOP LED is OFF
Action method when I/O module operates abnormally
Action method when PROGRAM WRITE does not work
Chapter 14 Troubleshooting
14-2
14.2.1 Action when Power LED is OFF
Here describes the action procedure when Power LED is OFF while supplying the power or during
operation.
Power LED is OFF
Is the power
supplying ?
Is the power voltage within
the allowable voltage rage?
Is the fuse cut off ?
Is the power module
fixed ?
Is the over current
protection operating
After wiring the trouble shooting
questionnaire, contact A/S
center or agent.
Supply the power.
Is Power LED ON?
Meet the power supply with
the regular range.

Change the fuse.

Fix the power module completely.
Is Power LED ON ?
Is Power LED ON?
Is Power LED ON ?

1) Check the current capacity
and reduce the over current.
2) After input power OFF, then
power On.

Is Power LED ON ?
No
No
No
Yes No
No No
No
No
No
Yes Yes
Yes
Yes
Yes
Yes
Yes
Yes
End
Yes
No
No
Chapter 14 Troubleshooting
13-3
14.2.2 Action when ERR LED is blinking
Here describes the action procedure when ERROR LED is blinking in case of power supply, or when
operation starts, or during operation.

1) In case of light error, PLC system does not stop but you should check the error contents promptly and
take an action. If not, it may cause the heavy error.

Notes

ERR LED is blinking

Yes	Refer to Appendix 1 Flag and remove the error cause.

No
No

Connect XG5000 and check the
error code contents.

After writing the trouble shooting
questionnaire and contact A/S
center or agent.
End
Yes
Is it light error
(_CNF_WAR) ?
Does ERR. LED
keep on blinking ?
Chapter 14 Troubleshooting
14-4
14.2.3 Action when Run, Stop LED is OFF
Here describes the action procedure when RUN, STOP LED is OFF in case of power supply, when
operation starts or during operation.
RUN, STOP LED is OFF
No
Yes
Contact A/S center or agent
nearest from you
End

Power module OFF → ON

Is RUN, STOP LED OFF ?
Chapter 14 Troubleshooting
13-5
14.2.4 Action when I/O Module does not work normally
Here describes the action procedure when I/O Module does not work normally during operation, as shown
on the program example below.
When I/O module does not work normally

Monitor SOL1 state by
XG5000.

Is output LED of SOL1
ON ?
No

Change the connector of
terminal block.

Measure SOL1 terminal
voltage by the tester.

Make the correct wiring.

Yes
Is the measured
value normal ?
Is the output wiring
correct ?
Is the
contact state of
terminal block connector
good ?
Is it normal ?

After removing the external
wiring, check the transmission
state of module output

Is it normal ?
Check the output device
(SOL1) state.
Change the output module.
Continued
Yes
No
Yes
No
Yes No
Yes
Yes
No
No
Chapter 14 Troubleshooting
14-6
Continued
Is SWITCH 1, 2 LED
ON ?
No

Measure the terminal
voltage of SWITCH 1, 2
by the tester.

Yes
Is the measured
value normal ?

After removing the
external wiring,
check the input state
by forced input.

Is the measured
value normal ?
Check the input
device
(SWITCH 1, 2) state.
Change the input
module.

Measure the terminal
voltage of SWITCH 1, 2
by the tester.

Is the
measured value
normal ?
Is the
tightening state of
terminal good ?
Is input
wiring correct ?

Make the correct
wiring.

Tighten the terminal
screw completely.

Change the
terminal block
connector.

Change the input
module.
Check all from the
beginning again.
Is the
contact state of terminal
block connector
good ?
Yes
No
No

Yes

No
Yes
Yes
No
Yes
No

Chapter 14 Troubleshooting
13 -7
14.2.5 Action when PROGRAM WRITE does not work
Here describes the action procedure when PROGRAM WRITE does not work in CPU Module.
Program Write does not work
Yes
Put the key switch to Remote
STOP mode and run Program
Write.
Is the Run/Stop switch set as
STOP (Remote stop) mode ?
No
Is STOP LED
blinking ?
After releasing PLC connection
Off, read the error code
indicated when connected, and
modify it according to the
contents.
Yes
End
No
After Remote DIP S/W ON, run
Program Write.
Yes
No
Is DIP S/W of CPU
Module ON ?
Chapter 14 Troubleshooting
14-8

14.3 Questionnaire for Troubleshooting

If the trouble occurs when using XGK series, fill in the following questionnaire and then contact customer’s service
center by phone or FAX.
 For the error related to special and communication module, fill in the questionnaire attached to the user’s
manual of the corresponding product.
1. User Contact point: TEL) FAX)
2. Model:
3. Applied Device details
- CPU module details - OS version ( ) - Serial no. of product ( )
- XG5000 version no. used in program compile ( )
4. Brief description of control object machine and system:
5. Using module of CPU module
- Operation by key switch ( ) - Memory module operation ( )
- XG5000 or operation by communication ( )
6. STOP LED of CPU module ON ? Yes( ), No( )
7. Error message content by XG5000:
8. Action trial status for the error code of item 7 on the above:
9. Trouble shooting method for other error action:
10. Error features

 Repeat(	): periodical(	), specific sequence level related(	)
environment related( ): general error interval:	)	 Intermittent (

11. Detailed description for the error phenomena:
12. Configuration diagram of applied system:
Chapter 14 Troubleshooting
13-9

~ device External device	~ device
~ External device Leakage current	~ C AC input
~ Leakage current
External device Leakage current
E	E1

14.4 Cases

Here describes the trouble type and measures for each circuit.
14.4.1 Input Circuit Error Type and Corrective Actions
Here describes the trouble examples of input circuit and its measures.

Phenomena	Causes	Measures
Input signal not OFF	Leakage current of external device (In case of running by approach switch)	 Connect the proper resistance and capacity so that the voltage between terminals of input module is below return voltage.  CR value is determined by leakage current. - Recommended C : 0.1 ~ 0.47Uf R : 47 ~ 120 Ω (1/2W) or make the circuit independently and install a separate circuit.
Input signal not OFF (sometimes neon lamp ON)	Leakage current of external device (run by limit switch with neon lamp)
Input signal not OFF	Leakage current by capacity between wiring cables	 Install the power on the external device as below.
Input signal not OFF	Leakage current of external device (run by switch with LED indicator)	 Connect the proper resistance as below so that the voltage between input module terminal and common terminal exceeds OFF voltage.
Input signal not OFF	 Circulated current by double power  In case of E1 > E2, circulated.	 Double power --> single power.  Connect purified current prevent diode. (as below)

External
AC input
Leakage
current
DC input
R
DC input
L
E
C
AC input
R
C
AC input
R
R
AC input
External
DC input
R
DC input
L
E
Chapter 14 Troubleshooting
14-10

~	C
~	~ X T Timer Output
~	~ ← ↑
E1	E

14.4.2 Output Circuit Error Types and Corrective Actions
Here describes the trouble examples of output circuit and its measures.

Phenomena	Causes	Measures
Over voltage applied to the load if case of output contact OFF	 In case that the load is semi-sine inside, (solenoid valve)  If power polarity is ←, C is charged, if polarity is ↑, voltage charged to C +power voltage is applied to both sides of diode(D). Max. voltage is about 2√2 . Note) If used as above, output element does not make trouble but the function of diode(D) built-in the load becomes low which causes the trouble.	 Connect several dozens kΩ ~ hundreds kΩ resistance to the load in parallel.
The load is not OFF	 Leakage current by surge absorption circuit connected with output element in parallel	 Connect CR with several dozens kΩ or equivalent impedance to the load in parallel. Note) If wiring length is long from output module to the load, leakage current by capacity between cables.
Time trouble in case the load is C-R type timer.	 Leakage current by surge absorption circuit connected with output elements in parallel	 Run C-R type timer by Relay.  Use the timer except C-R type timer. Note) There is the timer that internal circuit is semi-sine.
load is not OFF (AC)	 Circulation current by two different powers  If E1< E2, circulated  If E1 is Off(E2 On), circulated	 Double power --> single power.  Connect purified current prevention diode.(as below) Note) If load is Relay, it is required to connect reverse voltage absorption diode as dot line on the above figure..

C
R
Load
Leakage current
Output
C
R
Load
Leakage
current
Output
C
R Load
R
D
R
Load
R
Load
Load
E
Output
Output
Load
E
C
R
Load
D
Chapter 14 Troubleshooting
13-11

Phenomena	Causes	Measures
Off Response time of load is long abnormally.	 Over current when Off [In case of running the inductive load of current such as solenoid (time constant L/R is large) directly by transistor output.  As the current flows through diode when transistor output OFF, more than 1 second may be delayed according to the load.	 Insert the magnetic contactor that time constant is small and run the load by the contact as below.
Output transistoris destroyed.	Inrush current of incandescent light When light ON, more than 10 times of inrush current may flow.	 To control the inrush current, it need to flow 1/3 ~ 1/5 dark current of rated current of incandescent light.

Output
Load

E Current when off
E1	E E Sink type transistor output Source type transistor output

Output
Output
Load
Output
R Output
R

Chapter 14 Troubleshooting
14-12

14.5 Error Code List

14.5.1 Error Code during CPU Operation

Error code	Error cause	(restart mode after taking an act Action ion)	Operatio n status	status LED	Diagnosi s point
2	Data Bus error	If it occurs repeatedly when power reinput, request service center.	Fail	Blink by the order of total LED.	Power input
3	Data RAM error	If it occurs repeatedly when power reinput, request service center.	Fail	Blink by the order of total LED.	Power input
4	Clock IC(RTC) error	If it occurs repeatedly when power reinput, request service center.	Fail	ERR: On	Power input
6	Program memory error	If it occurs repeatedly when power reinput, request service center.	Fail	ERR: On	Power input
10	USB IC error	If it occurs repeatedly when power reinput, request service center.	Fail	ERR: On	Power input
11	Backup RAM error	If it occurs repeatedly when power reinput, request service center.	Fail	ERR: On	Power input
12	Backup Flash error	If it occurs repeatedly when power reinput, request service center.	Fail	ERR: On	Power input
13	Base information error	If it occurs repeatedly when power reinput, request service center.	Stop	ERR : ON	Power input RUN mode switching
22	Poor Backup Flash program	Reoperate after modifying the backup flash program.	Fail	ERR: On	Reset RUN mode switching
23	Program to execute is abnormal	Start after reloading the program, Change battery if it has a problem. Check the preservation status after program reloading and if error occurs, change the CPU module.	Stop	ERR: On	Reset RUN mode switching
24	I/O parameter error	Start after reloading I/O parameter, Battery change if battery has a problem. Check the preservation status after I/O parameter reloading and if error occurs, change the CPU module.	Stop	ERR: On	Reset RUN mode switching
25	Basic parameter error	Start after reloading Basic parameter, Change battery if it has a problem. Check the preservation status after Basic parameter reloading and if error occurs, change the CPU module.	Stop	ERR: On	Reset RUN mode switching
26	Exceed execution range error	Start after reloading program. If it occurs repeatedly, request service center	Stop	ERR : ON	Reset RUN mode switching
27	Compile error	Start after reloading program. If it occurs repeatedly, request service center	Stop	ERR : ON	Reset RUN mode switching

Chapter 14 Troubleshooting
14-13

Error code	Error cause	(restart mode after taking an act Action ion)	Operatio n status	status LED	Diagnosi s point
30	Module set in parameter and the installed module does not match	After checking the wrong position of slot by XG5000, modify the module or parameter and then restart. Reference flag: module type discord error flag	Stop (Run)	ERR: On (P.S.: On)	RUN mode switching
31	Module falling during operation or additional setup	After checking the position of falling/adding slot by XG5000, modify the installation status of module and then restart (according to parameter). Reference flag: module removable Reference flag: module removable error	Stop (Run)	ERR: On (P.S.: On)	Scan end
32	Fuse cutoff of fuse built-in module during operation	After checking the position of slot where the fuse cutoff occurs by XG5000, change the fuse and then restart (according to parameter Reference flag: fuse cutoff error flag	Stop (Run)	ERR: On (P.S.: On)	Scan end
33	Data of I/O module does not access normally during operation.	After checking the position of slot where the access error occurs by XG5000, change the module and restart (acc.to parameter. Reference flag: I/O module Read/Write error flag	Stop (Run)	ERR: On (P.S.: On)	Scan end
34	Normal access of special/link module data during operation not available.	After checking the position of slot that access error occurred by XG5000, change the module and restart (acc.to parameter). Reference flag: special/link module interface error	Stop (Run)	ERR: On (P.S.: On)	Scan end
39	Abnormal stop of CPU or malfunction	Abnormal system end by noise or hard ware error. 1) If it occurs repeatedly when power reinput, request service center 2) Noise measures	Stop	RUN: On ERR: On	Ordinary time
40	Scan time of program during operation exceeds the scan watchdog time designated by parameter.	After checking the scan watchdog time designated by parameter, modify the parameter or the program and then restart.	Stop	RUN: On ERR: On	In operation
41	Operation error occurs while running the user program.	Remove operation error → reload the program and restart. <Check method> Stop: Check operation error information through XG5000 and modify the program. Run: Refer to F area Error step.	Stop (Run)	ERR : ON (CHK: blink)	While running the program
42	The stack exceeds the normal range while running the program	Restart	Stop	RUN: On ERR: On	While running the program
43	Base double setting error	After checking base setting switch, reset	Stop	ERR: On	Reset RUN mode switching
44	Timer index user error	After reloading a timer index program modification, start	Stop (Run)	RUN: On ERR: On	Scan end
50	Heavy error of	Heavy error detection of external	Stop	ERR: On	Scan end

Chapter 14 Troubleshooting
14-14

Error code	Error cause	(restart mode after taking an act Action ion)	Operatio n status	status LED	Diagnosi s point
external device detected by the user program	device Refer to flag to repeat the device and then restart (according to parameter)	(Run)	(P.S.: On)
55	The number of running standby task exceeds the designated range	If it occurs repeatedly after restart, check the installation environment (if error continues, request service center)	Stop (Run)	ERR: On (P.S.: On)	While running the program
60	E_STOP function executed	After removing error causes which starts E_STOP function in program, power reinput	Stop	RUN: On ERR: On	While running the program
61	Operation error	STOP: after checking the detailed information of operation error by XG5000, modify the program. RUN : refer to error step	Stop (Run)	ERR: On (P.S.: On)	While running the program
500	Data memory backup not possible	If not error in battery, power reinput Remote mode is switched to STOP mode.	Stop	ERR: On	Reset
501	Time data error	If no error in battery, reset the time by XG5000	-	CHK: On	Ordinary time
502	Battery voltage falling	Battery change in the state of power input	-	BAT: On	Ordinary time

14.5.2 Error Code of Program Operation

Code	Error	CPU Status	Causes	Measure
16	Indirect designation/ Index error	According to the Basic Parameter Settings, the CPU will Run or Stop.	Designations are out of range	Designate within the range
17	Group command range setting error	Designations are out of range	Designate within the range
18	0 divider error	Divided by 0 (except RDIV, LDIV)	Don’t divide by 0
19	BCD conversion error	The value of the operand is out of the BCD data range.	Designate within the BCD data range
20	File bank setting error	Bank set value is out of range	Set the value within the range
21	Floating point operation error	Floating point operation error	Correct the data
22	Data type conversion error	Data size is different when converting from real to integer numbers	Correct the data
23	BMOV error	Set value is over than 16	Correct the set value

Notes

1) If error codes 2 to 13 are displayed, check with your local service center.
2) Error code numbers greater than 22 can be checked with XG5000 Error History.

Chapter 14 Troubleshooting
14-15

Code	Error	CPU Status	Causes	Measure
24	DECO/ENCO error	Set value is over than 8	Correct the set value
25	DIS/UNI error	According to the Basic Parameter Settings, the CPU will Run or Stop.	The value of N is over 4	Correct the N value
26	Data control error	Over the range	Correct the range
27	Time data error	Time data error	Correct the time data
28	MUX error	Set value error	Correct the set value
29	Data table error	Set value error	Correct the set value
30	SEG error	Number of conversion data is greater than 4	Correct the set value
31	ASCII code error	ASCII data error	Correct the data
32	Positioning axes setting error	Setting axes greater than 3	Correct the number of axes
33	Character string error	Character string instruction error	Correct the instruction
34	SORT error	SORT/DSORT instruction error	Correct the set value
35	FOR nesting error	The number of nesting number is over 16	Correct the program
36	Task number error	The Task number exceeds 96	Correct the task number
37	Device range check error	Out of the device range	Set within the device range
38	P2P data error	Settings of P2P are out of range	Set within the range
39	Module Configuration error	The module can’t be set properly	Set the module properly

Notes

1) If the basic parameter is set to “Continue running when error occurs,” the program operation error
code can be checked using XG5000 system history.
2) If “Continue running when error occurs” is removed, it can be checked with XG5000 error history.

Appendix 1 Flag List
App. 1-1
Appendix 1 Flag List
App.1.1 Special Relay (F) List

Device1	Device2	Type	Variables	Function	Description
F0000	DWORD	_SYS_STATE	Mode and state	Indicates PLC mode and operation state
F00000	BIT	_RUN	Run	Run state
F00001	BIT	_STOP	Stop	Stop state
F00002	BIT	_ERROR	Error	Error state
F00003	BIT	_DEBUG	Debug	Debug state
F00004	BIT	_LOCAL_CON	Local control	Local control mode
F00005	BIT	_MODBUS_CON	Mode bus mode	Mode bus control mode
F00006	BIT	_REMOTE_CON	Remote mode	Remote control mode
F00008	BIT	_RUN_EDIT_ST	Editing during RUN	Editing program download during RUN
F00009	BIT	_RUN_EDIT_CHK	Editing during RUN	Internal edit processing during RUN
F0000A	BIT	_RUN_EDIT_DONE	Edit done during RUN	Edit is done during RUN
F0000B	BIT	_RUN_EDIT_END	Edit end during RUN	Edit is ended during RUN
F0000C	BIT	_CMOD_KEY	Operation mode	Operation mode changed by key
F0000D	BIT	_CMOD_LPADT	Operation mode	Operation mode changed by local PADT
F0000E	BIT	_CMOD_RPADT	Operation mode	Operation mode changed by Remote PADT
F0000F	BIT	_CMOD_RLINK	Operation mode	Operation mode changed by Remote communication module
F00010	BIT	_FORCE_IN	Forced input	Forced input state
F00011	BIT	_FORCE_OUT	Forced output	Forced output state
F00012	BIT	_SKIP_ON	I/O SKIP	I/O SKIP on execution
F00013	BIT	_EMASK_ON	Error mask	Error mask on execution
F00014	BIT	_MON_ON	monitor	Monitor on execution
F00015	BIT	_USTOP_ON	Stop	Stop by Stop function
F00016	BIT	_ESTOP_ON	EStop	Stop by EStop function
F00017	BIT	_CONPILE_MODE	Compile	Compile on execution
F00018	BIT	_INIT_RUN	Initialize	Iinitialization task on execution
F0001C	BIT	_PB1	Program Code 1	Program Code 1 selected
F0001D	BIT	_PB2	Program Code 2	Program Code 2 selected
F0001E	BIT	_CB1	Compile Code 1	Compile Code 1 selected
F0001F	BIT	_CB2	Compile Code2	Compile Code 2 selected

Appendix 1 Flag List
App. 1-2

Device1	Device2	Type	Variables	Function	Description
F0002	DWORD	_CNF_ER	System error	Reports heavy error state of system
F00020	BIT	_CPU_ER	CPU error	CPU configuration error
F00021	BIT	_IO_TYER	Module Type error	Module Type does not match
F00022	BIT	_IO_DEER	Module detachment error	Module is detached.
F00023	BIT	_FUSE_ER	Fuse error	Fuse is cutoff
F00024	BIT	_IO_RWER	Module I/O error	Module I/O error
F00025	BIT	_IP_IFER	Module interface error	Special/communication module interface error
F00026	BIT	_ANNUM_ER	External device error	Detected heavy error in external device
F00028	BIT	_BPRM_ER	Basic parameter	Basic parameter error
F00029	BIT	_IOPRM_ER	IO parameter	I/O configuration parameter error
F0002A	BIT	_SPPRM_ER	Special module parameter	Special module parameter is abnormal
F0002B	BIT	_CPPRM_ER	Communication module parameter	Communication module parameter is abnormal
F0002C	BIT	_PGM_ER	Program error	Program error
F0002D	BIT	_CODE_ER	Code error	Program Code error
F0002E	BIT	_SWDT_ER	System watchdog	System watchdog operated
F0002F	BIT	_BASE_POWER_ER	Power error	Base power error
F00030	BIT	_WDT_ER	Scan watchdog	Scan watchdog operated
F0004	DWORD	_CNF_WAR	System warning	Reports light error state of system
F00040	BIT	_RTC_ER	RTC error	RTC data error
F00041	BIT	_DBCK_ER	Backup error	Data backup error
F00042	BIT	_HBCK_ER	Restart error	Hot restart not possible
F00043	BIT	_ABSD_ER	Operation shutdown error	Stop by abnormal operation
F00044	BIT	_TASK_ER	Task collision	Task collision
F00045	BIT	_BAT_ER	Battery error	Battery error
F00046	BIT	_ANNUM_WAR	External device error	Detected light error of external device
F00047	BIT	_LOG_FULL	Memory full	Log memory is full.
F00048	BIT	_HS_WAR1	High speed link 1	High speed link – parameter 1 error
F00049	BIT	_HS_WAR2	High speed link 2	High speed link – parameter 2 error
F0004A	BIT	_HS_WAR3	High speed link 3	High speed link – parameter 3 error
F0004B	BIT	_HS_WAR4	High speed link 4	High speed link – parameter 4 error
F0004C	BIT	_HS_WAR5	High speed link 5	High speed link – parameter 5 error
F0004D	BIT	_HS_WAR6	High speed link 6	High speed link – parameter 6 error
F0004E	BIT	_HS_WAR7	High speed link 7	High speed link – parameter 7 error
F0004F	BIT	_HS_WAR8	High speed link 8	High speed link – parameter 8 error
F00050	BIT	_HS_WAR9	High speed link 9	High speed link – parameter 9 error
F00051	BIT	_HS_WAR10	High speed link 10	High speed link – parameter 10 error
F00052	BIT	_HS_WAR11	High speed link 11	High speed link - parameter 11 error

Appendix 1 Flag List
App. 1-3

Device1	Device2	Type	Variables	Function	Description
F00053	BIT	_HS_WAR12	High speed link 12	High speed link - parameter 12 error
F00054	BIT	_P2P_WAR1	P2P parameter 1	P2P – parameter 1 error
F00055	BIT	_P2P_WAR2	P2P parameter 2	P2P – parameter 2 error
F00056	BIT	_P2P_WAR3	P2P parameter 3	P2P – parameter 3 error
F00057	BIT	_P2P_WAR4	P2P parameter 4	P2P – parameter 4 error
F00058	BIT	_P2P_WAR5	P2P parameter 5	P2P – parameter 5 error
F00059	BIT	_P2P_WAR6	P2P parameter 6	P2P – parameter 6 error
F0005A	BIT	_P2P_WAR7	P2P parameter 7	P2P – parameter 7 error
F0005B	BIT	_P2P_WAR8	P2P parameter 8	P2P – parameter 8 error
F0005C	BIT	_CONSTANT_ER	Constant error	Constant error
F0009	WORD	_USER_F	User contact	Timer used by user
F00090	BIT	_T20MS	20ms	20ms cycle Clock
F00091	BIT	_T100MS	100ms	100ms cycle Clock
F00092	BIT	_T200MS	200ms	200ms cycle Clock
F00093	BIT	_T1S	1s	1s cycle Clock
F00094	BIT	_T2S	2s	2s cycle Clock
F00095	BIT	_T10S	10s	10s cycle Clock
F00096	BIT	_T20S	20s	20s cycle Clock
F00097	BIT	_T60S	60s	60s cycle Clock
F00099	BIT	_ON	Ordinary time On	Always On state Bit
F0009A	BIT	_OFF	Ordinary time Off	Always Off state Bit
F0009B	BIT	_1ON	1scan On	First scan ON Bit
F0009C	BIT	_1OFF	1scan Off	First scan OFF bit
F0009D	BIT	_STOG	Reversal	Reversal every scan
F0010	WORD	_USER_CLK	User Clock	Clock available for user setting
F00100	BIT	_USR_CLK0	Setting scan repeat	On/Off as much as set scan Clock 0
F00101	BIT	_USR_CLK1	Setting scan repeat	On/Off as much as set scan Clock 1
F00102	BIT	_USR_CLK2	Setting scan repeat	On/Off as much as set scan Clock 2
F00103	BIT	_USR_CLK3	Setting scan repeat	On/Off as much as set scan Clock 3
F00104	BIT	_USR_CLK4	Setting scan repeat	On/Off as much as set scan Clock 4
F00105	BIT	_USR_CLK5	Setting scan repeat	On/Off as much as set scan Clock 5
F00106	BIT	_USR_CLK6	Setting scan repeat	On/Off as much as set scan Clock 6
F00107	BIT	_USR_CLK7	Setting scan repeat	On/Off as much as set scan Clock 7

Appendix 1 Flag List
App. 1-4

Device1	Device2	Type	Variables	Function	Description
F0011	WORD	_LOGIC_RESULT	Logic result	Indicates logic results
F00110	BIT	_LER	operation error	ON during 1 scan in case of operation error
F00111	BIT	_ZERO	Zero flag	ON when operation result is 0
F00112	BIT	_CARRY	Carry flag	ON when carry occurs during operation
F00113	BIT	_ALL_OFF	All output OFF	ON in case that all output is Off
F00115	BIT	_LER_LATCH	Operation error Latch	Keeps ON during operation error
F0012	WORD	_CMP_RESULT	Comparison result	Indicates the comparison result.
F00120	BIT	_LT	LT flag	ON in case of “less than”
F00121	BIT	_LTE	LTE flag	ON in case of “equal or less than”
F00122	BIT	_EQU	EQU flag	On in case of “equal”
F00123	BIT	_GT	GT flag	ON in case of “greater than”
F00124	BIT	_GTE	GTE flag	ON in case of “equal or greater than”
F00125	BIT	_NEQ	NEQ flag	ON in case of “not equal”
F0013	WORD	_AC_F_CNT	Moment shutdown	Indicates moment shutdown times
F0014	WORD	_FALS_NUM	FALS no.	Indicates FALS no.
F0015	WORD	_PUTGET_ERR0	PUT/GET error 0	Main base Put / Get error
F0016	WORD	_PUTGET_ERR1	PUT/GET error 1	Extended base 1 step Put/Get error
F0017	WORD	_PUTGET_ERR2	PUT/GET error 2	Extended base 2 step Put/Get error
F0018	WORD	_PUTGET_ERR3	PUT/GET error 3	Extended base 3 step Put/Get error
F0019	WORD	_PUTGET_ERR4	PUT/GET error 4	Extended base 4 step Put/Get error
F0020	WORD	_PUTGET_ERR5	PUT/GET error 5	Extended base 5 step Put/Get error
F0021	WORD	_PUTGET_ERR6	PUT/GET error 6	Extended base 6 step Put/Get error
F0022	WORD	_PUTGET_ERR7	PUT/GET error 7	Extended base 7 step Put/Get error
F0023	WORD	_PUTGET_NDR0	PUT/GET end 0	Main base Put/Get end
F0024	WORD	_PUTGET_NDR1	PUT/GET end 1	Extended base 1 step Put/Get end
F0025	WORD	_PUTGET_NDR2	PUT/GET end 2	Extended base 2 step Put/Get end
F0026	WORD	_PUTGET_NDR3	PUT/GET end 3	Extended base 3 step Put/Get end
F0027	WORD	_PUTGET_NDR4	PUT/GET end 4	Extended base 4 step Put/Get end
F0028	WORD	_PUTGET_NDR5	PUT/GET end 5	Extended base 5 step Put/Get end
F0029	WORD	_PUTGET_NDR6	PUT/GET end 6	Extended base 6 step Put/Get end
F0030	WORD	_PUTGET_NDR7	PUT/GET end 7	Extended base 7 step Put/Get end
F0044	WORD	_CPU_TYPE	CPU Type	Indicates information for CPU Type.
F0045	WORD	_CPU_VER	CPU version	Indicates CPU version
F0046	DWORD	_OS_VER	OS version	Indicates OS version
F0048	DWORD	_OS_DATE	OS date	Indicates OS distribution date.
F0050	WORD	_SCAN_MAX	Max. scan time	Indicates max. scan time.
F0051	WORD	_SCAN_MIN	Min. scan time	Indicates min. scan time.
F0052	WORD	_SCAN_CUR	Current scan time	Current scan time

Appendix 1 Flag List
App. 1-5

Device1	Device2	Type	Variables	Function	Description
F0053	WORD	_MON_YEAR	Month/Year	PLC month, year data
F0054	WORD	_TIME_DAY	Time/Day	PLC time, day data
F0055	WORD	_SEC_MIN	Sec/Min	PLC second, minute data
F0056	WORD	_HUND_WK	Hundred year/Weekday	PLC hundred year, weekday data
F0057	WORD	_FPU_INFO	FPU operation result	Fixed decimal operation result
F00570	BIT	_FPU_LFLAG_I	Incorrect error latch	Latch in case of incorrect error
F00571	BIT	_FPU_LFLAG_U	Underflow latch	Latch in case of underflow
F00572	BIT	_FPU_LFLAG_O	Overflow latch	Latch in case of overflow
F00573	BIT	_FPU_LFLAG_Z	Zero(0) divide latch	Latch in case of zero(0) divide
F00574	BIT	_FPU_LFLAG_V	Invalid operation latch	Latch in case of invalid operation
F0057A	BIT	_FPU_FLAG_I	Incorrect error	Reports incorrect error
F0057B	BIT	_FPU_FLAG_U	Underflow	Reports underflow
F0057C	BIT	_FPU_FLAG_O	Overflow	Reports overflow
F0057D	BIT	_FPU_FLAG_Z	Zero divide	Reports in case of zero divide
F0057E	BIT	_FPU_FLAG_V	Invalid operation	Reports in case of invalid operation
F0057F	BIT	_FPU_FLAG_E	Irregular input	Reports in case of irregular input
F0058	DWORD	_ERR_STEP	Error step	Saves error step
F0060	DWORD	_REF_COUNT	Refresh	Increase when module Refresh
F0062	DWORD	_REF_OK_CNT	Refresh OK	Increase when module Refresh is normal
F0064	DWORD	_REF_NG_CNT	Refresh NG	Increase when module Refresh is abnormal
F0066	DWORD	_REF_LIM_CNT	Refresh Limit	Increase when module Refresh is abnormal (Time Out)
F0068	DWORD	_REF_ERR_CNT	Refresh Error	Increase when module Refresh is abnormal
F0070	DWORD	_MOD_RD_ERR_CNT	Module Read Error	Increase when reading module 1 word abnormally
F0072	DWORD	_MOD_WR_ERR_CNT	Module Write Error	Increase when module 1 word abnormally
F0074	DWORD	_CA_CNT	Block service	Increase when module block data service
F0076	DWORD	_CA_LIM_CNT	Block service Limit	Increase when block data service is limited
F0078	DWORD	_CA_ERR_CNT	Block service Error	Increase in case of block data service error
F0080	DWORD	_BUF_FULL_CNT	Buffer Full	Increase when CPU internal buffer is full.
F0082	DWORD	_PUT_CNT	Put count	Increase when Put count
F0084	DWORD	_GET_CNT	Get count	Increase when Get count
F0086	DWORD	_KEY	Current key	indicates the current state of local key.
F0088	DWORD	_KEY_PREV	Previous key	indicates the previous state of local key
F0090	WORD	_IO_TYER_N	Mismatch slot	Module Type mismatched slot no.
F0091	WORD	_IO_DEER_N	Detach slot	Module detached slot no.
F0092	WORD	_FUSE_ER_N	Fuse cutoff slot	Fuse cutoff slot no.

Appendix 1 Flag List
App. 1-6

Device1	Device2	Type	Variables	Function	Description
F0093	WORD	_IO_RWER_N	RW error slot	Module read/write error slot no.
F0094	WORD	_IP_IFER_N	IF error slot	Module interface error slot no.
F0096	WORD	_IO_TYER0	Module Type 0 error	Main base module Type error
F0097	WORD	_IO_TYER1	Module Type 1 error	Extended base 1 step module Type error
F0098	WORD	_IO_TYER2	Module Type 2 error	Extended base 2 step module Type error
F0099	WORD	_IO_TYER3	Module Type 3 error	Extended base 3 step module Type error
F0100	WORD	_IO_TYER4	Module Type 4 error	Extended base 4 step module Type error
F0101	WORD	_IO_TYER5	Module Type 5 error	Extended base 5 step module Type error
F0102	WORD	_IO_TYER6	Module Type 6 error	Extended base 6 step module Type error
F0103	WORD	_IO_TYER7	Module Type 7 error	Extended base 7 step module Type error
F0104	WORD	_IO_DEER0	Module detach 0 error	Main base module detach error
F0105	WORD	_IO_DEER1	Module detach 1 error	Extended base 1 step module detach error
F0106	WORD	_IO_DEER2	Module detach 2 error	Extended base 2 step module detach error
F0107	WORD	_IO_DEER3	Module detach 3 error	Extended base 3 step module detach error
F0108	WORD	_IO_DEER4	Module detach 4 error	Extended base 4 step module detach error
F0109	WORD	_IO_DEER5	Module detach 5 error	Extended base 5 step module detach error
F0110	WORD	_IO_DEER6	Module detach 6 error	Extended base 6 step module detach error
F0111	WORD	_IO_DEER7	Module detach 7 error	Extended base 7 step module detach error
F0112	WORD	_FUSE_ER0	Fuse cutoff 0 error	Main base fuse cutoff error
F0113	WORD	_FUSE_ER1	Fuse cutoff 1 error	Extended base 1 step fuse cutoff error
F0114	WORD	_FUSE_ER2	Fuse cutoff 2 error	Extended base 2 step fuse cutoff error
F0115	WORD	_FUSE_ER3	Fuse cutoff 3 error	Extended base 3 step fuse cutoff error
F0116	WORD	_FUSE_ER4	Fuse cutoff 4 error	Extended base 4 step fuse cutoff error
F0117	WORD	_FUSE_ER5	Fuse cutoff 5 error	Extended base 5 step fuse cutoff error
F0118	WORD	_FUSE_ER6	Fuse cutoff 6 error	Extended base 6 step fuse cutoff error
F0119	WORD	_FUSE_ER7	Fuse cutoff 7 error	Extended base 7 step fuse cutoff error
F0120	WORD	_IO_RWER0	Module RW 0 error	Main base module read/write error
F0121	WORD	_IO_RWER1	Module RW 1 error	Extended base1 step module read/ write error
F0122	WORD	_IO_RWER2	Module RW 2 error	Extended base 2 step module read/ write error
F0123	WORD	_IO_RWER3	Module RW 3 error	Extended base 3 step module read/ write error
F0124	WORD	_IO_RWER4	Module RW 4 error	Extended base 4 step module read/ write error
F0125	WORD	_IO_RWER5	Module RW 5 error	Extended base 5 step module read/ write error
F0126	WORD	_IO_RWER6	Module RW 6 error	Extended base 6 step module read/ write error

Appendix 1 Flag List
App. 1-7

Device1	Device2	Type	Variables	Function	Description
F0127	WORD	_IO_RWER7	Module RW 7 error	Extended base 7 step module read/ write error
F0128	WORD	_IO_IFER_0	Module IF 0 error	Main base module interface error
F0129	WORD	_IO_IFER_1	Module IF 1 error	Extended base 1step module interface error
F0130	WORD	_IO_IFER_2	Module IF 2 error	Extended base 2step module interface error
F0131	WORD	_IO_IFER_3	Module IF 3 error	Extended base 3step module interface error
F0132	WORD	_IO_IFER_4	Module IF 4 error	Extended base 4step module interface error
F0133	WORD	_IO_IFER_5	Module IF 5 error	Extended base 5step module interface error
F0134	WORD	_IO_IFER_6	Module IF 6 error	Extended base 6step module interface error
F0135	WORD	_IO_IFER_7	Module IF 7 error	Extended base 7step module interface error
F0136	WORD	_RTC_DATE	RTC date	RTC current date
F0137	WORD	_RTC_WEEK	RTC weekday	RTC current weekday
F0138	DWORD	_RTC_TOD	RTC time	RTC current time (ms unit)
F0140	DWORD	_AC_FAIL_CNT	Power shutdown times	Saves the times of power shutdown
F0142	DWORD	_ERR_HIS_CNT	Error occur times	Saves the times of error occur
F0144	DWORD	_MOD_HIS_CNT	M times ode conversion	Saves the times of mode conversion
F0146	DWORD	_SYS_HIS_CNT	History occur times	Saves the times of system history
F0148	DWORD	_LOG_ROTATE	Log Rotate	Saves log rotate information
F0150	WORD	_BASE_INFO0	Slot information 0	Main base slot information
F0151	WORD	_BASE_INFO1	Slot information 1	Extended base 1step slot information
F0152	WORD	_BASE_INFO2	Slot information 2	Extended base 2step slot information
F0153	WORD	_BASE_INFO3	Slot information 3	Extended base 3step slot information
F0154	WORD	_BASE_INFO4	Slot information 4	Extended base 4step slot information
F0155	WORD	_BASE_INFO5	Slot information 5	Extended base 5step slot information
F0156	WORD	_BASE_INFO6	Slot information 6	Extended base 6step slot information
F0157	WORD	_BASE_INFO7	Slot information 7	Extended base 7step slot information
F0158	WORD	_RBANK_NUM	Use block no.	Current using block no.
F0159	WORD	_RBLOCK_STATE	Flash state	Flash block state
F0164	DWORD	_RBLOCK_ER_FLAG	Flash error	Error during flash NBlock service
F0160	DWORD	_RBLOCK_RD_FLAG	Flash read	ON when reading flash Nblock data
F0162	DWORD	_RBLOCK_WR_FLAG	Flash write	ON when writing flash Nblock data
F0178	DWORD	_OS_VER_PATCH	OS patch version	Indicates OS version to second decimal places.
F09320	BIT	_FUSE_ER_PMT	Setting in case of fuse error	Ignores fuse error
F09321	BIT	_IO_ER_PMT	Setting in case of I/O error	Ignores I/O module error
F09322	BIT	_SP_ER_PMT	Setting in case of special module error	Ignores special module error

Appendix 1 Flag List
App. 1-8

Device1	Device2	Type	Variables	Function	Description
F09323	BIT	_CP_ER_PMT	Setting in case of communication error	Ignores communication module error
F0934	DWORD	_BASE_EMASK_INFO	Base fault mask	Base fault mask information
F0936	DWORD	_BASE_SKIP_INFO	Base Skip	Base skip information
F0938	WORD	_SLOT_EMASK_INFO_0	Slot fault mask	Slot fault mask information (BASE 0)
F0939	WORD	_SLOT_EMASK_INFO_1	Slot fault mask	Slot fault mask information (BASE 1)
F0940	WORD	_SLOT_EMASK_INFO_2	Slot fault mask	Slot fault mask information (BASE 2)
F0941	WORD	_SLOT_EMASK_INFO_3	Slot fault mask	Slot fault mask information (BASE 3)
F0942	WORD	_SLOT_EMASK_INFO_4	Slot fault mask	Slot fault mask information (BASE 4)
F0943	WORD	_SLOT_EMASK_INFO_5	Slot fault mask	Slot fault mask information (BASE 5)
F0944	WORD	_SLOT_EMASK_INFO_6	Slot fault mask	Slot fault mask information (BASE 6)
F0945	WORD	_SLOT_EMASK_INFO_7	Slot fault mask	Slot fault mask information (BASE 7)
F0946	WORD	_SLOT_SKIP_INFO_0	Slot skip	Slot skip information (BASE 0)
F0947	WORD	_SLOT_SKIP_INFO_1	Slot skip	Slot skip information (BASE 1)
F0948	WORD	_SLOT_SKIP_INFO_2	Slot skip	Slot skip information (BASE 2)
F0949	WORD	_SLOT_SKIP_INFO_3	Slot skip	Slot skip information (BASE 3)
F0950	WORD	_SLOT_SKIP_INFO_4	Slot skip	Slot skip information (BASE 4)
F0951	WORD	_SLOT_SKIP_INFO_5	Slot skip	Slot skip information (BASE 5)
F0952	WORD	_SLOT_SKIP_INFO_6	Slot skip	Slot skip information (BASE 6)
F0953	WORD	_SLOT_SKIP_INFO_7	Slot skip	Slot skip information (BASE 7)
F1024	WORD	_USER_WRITE_F	User contact	User contact from Program
F10240	BIT	_RTC_WR	RTC RW	Write and Read the data to RTC
F10241	BIT	_SCAN_WR	Scan WR	Scan value initialize
F10242	BIT	_CHK_ANC_ERR	External heavy error request	Requests heavy error detection from external device
F10243	BIT	_CHK_ANC_WAR	External light error request	Requests light error detection from external device
F1025	WORD	_USER_STAUS_F	User contact	User contact
F10250	BIT	_INIT_DONE	Initialize end	Initialization task is done
F1026	WORD	_ANC_ERR	External heavy error information	Indicates heavy error information of external device.
F1027	WORD	_ANC_WAR	External light error warning	Indicates light error information of external device
F1034	WORD	_MON_YEAR_DT	Month/year	Clock information data (month/year)
F1035	WORD	_TIME_DAY_DT	Time/day	Clock information data (time/day)
F1036	WORD	_SEC_MIN_DT	Sec/min	Clock information data (sec/min)
F1037	WORD	_HUND_WK_DT	Hundred year / weekday	Clock information data (hundred year / weekday)
F0176	WORD	_SOE_READ_LOG_CNT	Event count	SOE event count read by user
F0177	WORD	_SOE_READ_LOG_ROTATE	Rotate information	Rotate information of SOE event count read by user
F0954	WORD	_SOE_LOG_CNT	Event count occurred	SOE event count occurred
F0955	WORD	_SOE_LOG_ROTATE	Rotate information	SOE event rotate information

Appendix 1 Flag List
App. 1-9

Device1	Device2	Type	Variables	Function	Description
F09600	BIT	_HS1_ENABLE_STATE	High speed link state	High speed link 1 enable/disable current state
~	BIT	_HSx_ENABLE_STATE	High speed link state	High speed link x enable/disable current state
F0960B	BIT	_HS12_ENABLE_STATE	High speed link state	High speed link 12 enable/disable current state
F10300	BIT	_HS1_REQ	High speed link request	High speed link 1 enable/disable request
~	BIT	_HSx_REQ	High speed link request	High speed link x enable/disable request
F1030B	BIT	_HS12_REQ	High speed link request	High speed link 12 enable/disable request
F10310	BIT	_HS1_REQ_NUM	High speed link setting	High speed link 1 enable/disable setting
~	BIT	_HSx_REQ_NUM	High speed link setting	High speed link x enable/disable setting
F1031B	BIT	_HS12_REQ_NUM	High speed link setting	High speed link 12 enable/disable setting
F09620	BIT	_P2P1_ENABLE_STATE	P2P state	P2P 1 enable/disable current state
~	BIT	_P2Px_ENABLE_STATE	P2P state	P2P x enable/disable current state
F09627	BIT	_P2P8_ENABLE_STATE	P2P state	P2P 8 enable/disable current state
F10320	BIT	_P2P1_REQ	P2P request	P2P 1 enable/disable request
~	BIT	_P2Px_REQ	P2P request	P2P x enable/disable request
F10327	BIT	_P2P8_REQ	P2P request	P2P 8 enable/disable request
F10330	BIT	_P2P1_REQ_NUM	P2P setting	P2P 1 enable/disable setting
~	BIT	_P2Px_REQ_NUM	P2P setting	P2P x enable/disable setting
F10337	BIT	_P2P8_REQ_NUM	P2P setting	P2P 8 enable/disable setting
F0190	WORD	_CYCLE_TASK_SCAN0_MAX	Maximum scan time	Fixed cycle task 0 maximum scan time
F0191	WORD	_CYCLE_TASK_SCAN0_MIN	Minimum scan time	Fixed cycle task 0 minimum scan time
F0192	WORD	_CYCLE_TASK_SCAN0_CUR	Current scan time	Fixed cycle task 0 current scan time
~	WORD	_CYCLE_TASK_SCANx_MAX	Maximum scan time	Fixed cycle task x maximum scan time
~	WORD	_CYCLE_TASK_SCANx_MIN	Minimum scan time	Fixed cycle task x minimum scan time
~	WORD	_CYCLE_TASK_SCANx_CUR	Current scan time	Fixed cycle task x current scan time
F0283	WORD	_CYCLE_TASK_SCAN31_MAX	Maximum scan time	Fixed cycle task 31 maximum scan time
F0284	WORD	_CYCLE_TASK_SCAN31_MIN	Minimum scan time	Fixed cycle task 31 minimum scan time
F0285	WORD	_CYCLE_TASK_SCAN31_CUR	Current scan time	Fixed cycle task 31 current scan time
F10248	BIT	_CYCLE_TASK_SCAN_WR	Scan time initialization	Initialize fixed cycle task’s scan time
F996	WORD	_SOCKET_CLOSE_COU NTER[0]	close number each socket	Close number (Socket 0)
F997	WORD	_SOCKET_CLOSE_COU NTER[1]	close number each socket	Close number (Socket 1)
F998	WORD	_SOCKET_CLOSE_COU NTER[2]	close number each socket	Close number (Socket 2)
F999	WORD	_SOCKET_CLOSE_COU NTER[3]	close number each socket	Close number (Socket 3)

Appendix 1 Flag List
App. 1-10
Appendix 1.2 Communication Relay (L) List
Here describes data link communication relay(L).
[Table 1] Communication Flag List according to High speed link no.(High speed link no. 1 ~ 12)

No.	Keyword	Type	Contents	Description
L000000	_HS1_RLINK	Bit	High speed link parameter 1 normal operation of all station	Indicates normal operation of all station according to parameter set in High speed link, and ON under the condition as below. 1. In case that all station set in parameter is RUN mode and no error, 2. All data block set in parameter is communicated normally, and 3. The parameter set in each station itself is communicated normally. Once RUN_LINK is ON, it keeps ON unless stopped by LINK_DISABLE.
L000001	_HS1_LTRBL	Bit	Abnormal state after _HS1RLINK ON	In the state of _HSmRLINK flag ON, if communication state of the station set in the parameter and data block is as follows, this flag shall be ON. 1. In case that the station set in the parameter is not RUN mode, or 2. There is an error in the station set in the parameter, or 3. The communication state of data block set in the parameter is not good. LINK TROUBLE shall be ON if the above 1, 2 & 3 conditions occur, and if the condition return to the normal state, it shall be OFF again.
L000020 ~ L00009F	_HS1_STATE[k] (k=000~127)	Bit Array	High speed link parameter 1, k block general state	Indicates the general state of communication information for each data block of setting parameter. HS1STATE[k]=HS1MOD[k]&_HS1TRX[k]&(~_HSmERR[k])
L000100 ~ L00017F	_HS1_MOD[k] (k=000~127)	Bit Array	High speed link parameter 1, k block station RUN operation mode	Indicates operation mode of station set in k data block of parameter.
L000180 ~ L00025F	_HS1_TRX[k] (k=000~127)	Bit Array	Normal communication with High speed link parameter 1, k block station	Indicates if communication state of k data of parameter is communicated smoothly according to the setting.
L000260 ~ L00033F	_HS1_ERR[k] (k=000~127)	Bit Array	High speed link parameter 1, k block station operation error mode	Indicates if the error occurs in the communication state of k data block of parameter.
L000340 ~ L00041F	_HS1_SETBLOC K[k]	Bit Array	High speed link parameter 1, k block setting	Indicates whether or not to set k data block of parameter.

Appendix 1 Flag List
App. 1-11

Notes

k means block no. and appears 8 words by 16 per 1 word for 128 blocks from 000~127.
For example, mode information (_HS1MOD) appears from block 0 to block 15 for L00010, and block 16~31, 32~47, 48~63,
64~79, 80~95, 96~111, 112~127 information for L00011, L00012, L00013, L00014, L00015, L00016, L00017. Thus, mode
information of block no. 55 appears in L000137.

High speed link no.	L area address	Remarks
2	L000500~L00099F	Comparing with High speed link 1 from [Table 1], the flag address of different high speed link station no. is as follows by a simple calculation formula. ∗ Calculation formula :L area address = L000000 + 500 x (High speed link no. – 1) In case of using high speed line flag for Program and monitoring, you can use the flag map registered in XG5000 conveniently.
3	L001000~L00149F
4	L001500~L00199F
5	L002000~L00249F
6	L002500~L00299F
7	L003000~L00349F
8	L003500~L00399F
9	L004000~L00449F
10	L004500~L00499F
11	L005000~L00549F

Appendix 1 Flag List
App. 1-12
[Table 2] Communication Flag List according to P2P Service Setting
P2P parameter: 1~8, P2P block : 0~63

No.	Keyword	Type	Contents	Description
L006250	_P2P1_NDR00	Bit	P2P parameter 1, 00 Block service normal end	Indicates P2P parameter 1, 0 Block service normal end
L006251	_P2P1_ERR00	Bit	P2P parameter 1, 00 Block service abnormal end	Indicates P2P parameter 1, 0 Block service abnormal end
L00626	_P2P1_STATUS00	Word	P2P parameter 1, 00 Block service abnormal end error Code	Indicates error code in case of P2P parameter 1, 0 Block service abnormal end
L00627	_P2P1_SVCCNT00	Double word	P2P parameter 1, 00 Block service normal count	Indicates P2P parameter 1, 0 Block service normal count
L00629	_P2P1_ERRCNT00	Double word	P2P parameter 1, 00 Block service abnormal count	Indicates P2P parameter 1, 0 Block service abnormal count
L006310	_P2P1_NDR01	Bit	P2P parameter 1, 01 Block service normal end	P2P parameter 1, 1 Block service normal end
L006311	_P2P1_ERR01	Bit	P2P parameter 1, 01 Block service abnormal end	P2P parameter 1, 1 Block service abnormal end
L00632	_P2P1_STATUS01	Word	P2P parameter 1, 01 Block service abnormal end error Code	Indicates error code in case of P2P parameter 1, 1 Block service abnormal end
L00633	_P2P1_SVCCNT01	Double word	P2P parameter 1, 01 Block service normal count	Indicates P2P parameter 1, 1 Block service normal connt
L00635	_P2P1_ERRCNT01	Double word	P2P parameter 1, 01 Block service abnormal count	Indicates P2P parameter 1, 1 Block service abnormal count

Appendix 1 Flag List
App. 1-13
Appendix 1.3 Link Register (N) List
[Table 1] Link Register List according to P2P no. P2P no. : 1~8, P2P block : 0~63

No.	Keyword	Type	Contents	Description
N00000	_P1B00SN	Word	P2P parameter 1, 00 block another station no.	Saves another station no. of P2P parameter 1, 00 block. In case of using another station no. at XG-PD, it is possible to edit during RUN by using P2PSN command.
N00001 ~ N00004	_P1B00RD1	Device structure	Area device 1 to read P2P parameter 1, 00 block	Saves area device 1 to read P2P parameter 1, 00 block.
N00005	_P1B00RS1	word	Area size 1 to read P2P parameter 1, 00 block	Saves area size 1 to read P2P parameter 1, 00 block.
N00006 ~ N00009	_P1B00RD2	Device structure	Area device 2 to read P2P parameter 1, 00 block	Saves area device 2 to read P2P parameter 1, 00 block.
N00010	_P1B00RS2	word	Area size 2 to read P2P parameter 1, 00 block	Saves area size 2 to read P2P parameter 1, 00 block.
N00011 ~ N00014	_P1B00RD3	Device structure	Area device 3 to read P2P parameter 1, 00 block	Saves area device 3 to read P2P parameter 1, 00 block.
N00015	_P1B00RS3	word	Area size 3 to read P2P parameter 1, 00 block	Saves area size 3 to read P2P parameter 1, 00 block.
N00016 ~ N00019	_P1B00RD4	Device structure	Area device 4 to read P2P parameter 1, 00 block	Saves area device 4 to read P2P parameter 1, 00 block.
N00020	_P1B00RS4	Word	Area size 4 to read P2P parameter 1, 00 block	Saves area size 4 to read P2P parameter 1, 00 block.
N00021 ~ N00024	_P1B00WD1	Device structure	Area device 1 to P2P parameter 1, 00 save block	Saves area device 1 to save P2P parameter 1, 00 block.
N00025	_P1B00WS1	Word	Area size 1 to save P2P parameter 1, 00 block	Saves area size 1 to save P2P parameter 1, 00 block.
N00026 ~ N00029	_P1B00WD2	Device structure	Are P2P parameter 1, 00 a device 2 to save block	Saves area device 2 to save P2P parameter 1, 00 block.
N00030	_P1B00WS2	Word	Area size 2 to save P2P parameter 1, 00 block	Saves area size 2 to save P2P parameter 1, 00 block.
N00031 ~ N00034	_P1B00WD3	Device structure	Area device 3 to save P2P parameter 1, 00 block	Saves area device 3 to save P2P parameter 1, 00 block.
N00035	_P1B00WS3	Word	Area size 3 to save P2P parameter 1, 00 block	Saves area size 3 to save P2P parameter 1, 00 block.
N00036 ~ N00039	_P1B00WD4	Device structure	Area device 4 to save P2P parameter 1, 00 block	Saves area device 4 to save P2P parameter 1, 00 block.
N00040	_P1B00WS4	Word	Area size 4 to save P2P parameter 1, 00 block	Saves area size 4 to save P2P parameter 1, 00 block.

Appendix 1 Flag List
App. 1-14

No.	Keyword	Type	Contents	Description
N00041	_P1B01SN	Word	P2P parameter 1, 01 block another station no.	Saves another station no. of P2P parameter 1, 01 block. In case of using another station no. at XG-PD, it is possible to edit during RUN by using P2PSN command.
N00042 ~ N00045	_P1B01RD1	Device structure	Area device 1 to read P2P parameter 1, 01 block	Saves area device 1 to read P2P parameter 1, 01 block.
N00046	_P1B01RS1	Word	Area size 1 to read P2P parameter 1, 01 block	Saves area size 1 to read P2P parameter 1, 01 block.
N00047 ~ N00050	_P1B01RD2	Device structure	Area device 2 to read P2P parameter 1, 01 block	Saves area device 2 to read P2P parameter 1, 01 block.
N00051	_P1B01RS2	Word	Area size 2 to read P2P parameter 1, 01 block	Saves area size 2 to read P2P parameter 1, 01 block.
N00052 ~ N00055	_P1B01RD3	Device structure	Area device 3 to read P2P parameter 1, 01 block	Saves area device 3 to read P2P parameter 1, 01 block.
N00056	_P1B01RS3	Word	Area size 3 to read P2P parameter 1, 01 block	Saves area size 3 to read P2P parameter 1, 01 block.
N00057 ~ N00060	_P1B01RD4	Device structure	Area device 4 to read P2P parameter 1, 01 block	Saves area device 4 to read P2P parameter 1, 01 block.
N00061	_P1B01RS4	Word	Area size 4 to read P2P parameter 1, 01 block	Saves area size 4 to read P2P parameter 1, 01 block.
N00062 ~ N00065	_P1B01WD 1	Device structure	Area device 1 to save P2P parameter 1, 01 block	Saves area device 1 to save P2P parameter 1, 01 block.
N00066	_P1B01WS1	Word	Area size 1 to save P2P parameter 1, 01 block	Saves area size 1 to save P2P parameter 1, 01 block.
N00067 ~ N00070	_P1B01WD 2	Device structure	Area device 2 to save P2P parameter 1, 01 block	Saves area device 2 to save P2P parameter 1, 01 block.
N00071	_P1B01WS2	Word	Area size 2 to save P2P parameter 1, 01 block	Saves area size 2 to save P2P parameter 1, 01 block.
N00072 ~ N00075	_P1B01WD 3	Device structure	Area device 3 to save P2P parameter 1, 01 block	Saves area device 3 to save P2P parameter 1, 01 block.
N00076	_P1B01WS3	Word	Area size 3 to save P2P parameter 1, 01 block	Saves area size 3 to save P2P parameter 1, 01 block.
N00077 ~ N00080	_P1B01WD 4	Device structure	Area device 4 to save P2P parameter 1, 01 block	Saves area device 4 to save P2P parameter 1, 01 block.
N00081	_P1B01WS4	Word	Area size 4 to save P2P parameter 1, 01 block	Saves area size 4 to save P2P parameter 1, 01 block.

Notes

N area shall be set automatically when setting P2P parameter by using XG-PD and available to modify during RUN
by using P2P dedicated command.
N area has a different address classified according to P2P parameter setting no., block index. The area not used
by P2P service as address is divided, can be used by internal device.

Appendix 2 Dimensions
App. 2-1
Appendix 2 Dimensions (Unit: mm)
1) CPU Module

XGK-CPUE/XGK-CPUS/XGK-CPUA/XGK-CPUH/XGK-CPUU

2) I/O Module

I/O Module (Terminal Block type)

I/O Module (Connector type)

Appendix 2 Dimensions
App. 2-2
3) Power Module

Power Module

4) Main/Expansion Base

Main Base

Appendix 2 Dimensions
App. 2-3

Expansion Base

Classification	A	B
XGB-M04A/XGB-E04A	190	210
XGB-M06A/XGB-E06A	244	264
XGB-M08A/XGB-E08A	298	318
XGB-M12A/XGB-E12A	406	426

Appendix 3 Compatibility with MASTER-K
App. 3-1
Appendix 3 Compatibility with MASTER-K
App. 3.1 Special Flag Compatibility
1) F Area Relay

MASTER-K	XGK
Device	Function	Symbol	Device	Function
F0000	RUN mode	_RUN	F0000	RUN Edit mode
F0001	Program mode	_STOP	F0001	Program mode
F0002	Pause mode	_ERROR	F0002	Error mode
F0003	Debug mode	_DEBUG	F0003	Debug mode
F0004	N/A	_LOCAL_CON	F0006	Remote mode
F0005	N/A	_MODBUS_CON	F0006	Remote mode
F0006	Remote mode	_REMOTE_CON	F0006	Remote mode
F0007	User memory setup	-	F0007	N/A
F0008	N/A	_RUN_EDIT_ST	F0008	Editing during RUN
F0009	N/A	_RUN_EDIT_CHK	F0009	Editing during RUN
F000A	User memory operation	_RUN_EDIT_DONE	F000A	Edit done during RUN
F000B	N/A	_RUN_EDIT_END	F000B	Edit end during RUN
F000C	N/A	_CMOD_KEY	F000C	Operation mode change by KEY
F000D	N/A	_CMOD_LPADT	F000D	Operation mode change by PADT
F000E	N/A	_CMOD_RPADT	F000E	Operation mode change by Remote PADT
F000F	STOP command execution	_CMOD_RLINK	F000F	Operation mode change cause by remote communication module
F0010	Ordinary time On	_FORCE_IN	F0010	Forced input
F0011	Ordinary time Off	_FORCE_OUT	F0011	Forced output
F0012	1 Scan On	_SKIP_ON	F0012	I/O Skip execution
F0013	1 Scan Off	_EMASK_ON	F0013	Error mask execution
F0014	Reversal every Scan	_MON_ON	F0014	Monitor execution
_USTOP_ON	F0015	Stop by Stop Function
_ESTOP_ON	F0016	Stop by ESTOP Function
_CONPILE_MODE	F0017	Compile
_INIT_RUN	F0018	Initialize
F0015 ~ F001F	N/A	-	F0019 ~ F001F	N/A
F001C	N/A	_PB1	F001C	Program Code 1
F001D	N/A	_PB2	F001D	Program Code 2
F001E	N/A	_CB1	F001E	Compile code 1
F001F	N/A	_CB2	F001F	Compile code 2

Appendix 3 Compatibility with MASTER-K
App. 3-2

MASTER-K	XGK
Device	Function	Symbol	Device	Function
F0020	1 Step RUN	_CPU_ER	F0020	CPU configuration error
F0021	Break Point RUN	_IO_TYER	F0021	Module type mismatch error
F0022	Scan RUN	_IO_DEER	F0022	Module detach error
F0023	Contact value match RUN	_FUSE_ER	F0023	Fuse cutoff error
F0024	Word value match RUN	_IO_RWER	F0024	I/O module read/write error
_IP_IFER	F0025	Special/communication module interface error
_ANNUM_ER	F0026	Heavy error detection of external equipment error
-	F0027	N/A
_BPRM_ER	F0028	Basic parameter error
_IOPRM_ER	F0029	I/O configuration parameter error
_SPPRM_ER	F002A	Special module parameter error
_CPPRM_ER	F002B	Communication module parameter error
_PGM_ER	F002C	Program error
_CODE_ER	F002D	Program Code error
_SWDT_ER	F002E	System watchdog error
F0025 ~ F002F	N/A	_BASE_POWER _ER	F002F	Base power error
F0030	Heavy error	_WDT_ER	F0030	Scan watchdog
F0031	Light error	F0031
F0032	WDT error	F0032
F0033	I/O combination error	F0033
F0034	Battery voltage error	F0034
F0035	Fuse error	F0035
F0036 ~ F0038	N/A	F0036 ~ F0038
F0039	Backup normal	F0039
F003A	Clock data error	F003A
F003B	Program change	F003B
F003C	Program change error	F003C
F003D ~ F003F	N/A	-	F003D ~ F003F	N/A
_RTC_ER	F0040	RTC data error
_DBCK_ER	F0041	Data backup error
_HBCK_ER	F0042	Hot restart disabled error
_ABSD_ER	F0043	Abnormal operation stop
_TASK_ER	F0044	Task collision
_BAT_ER	F0045	Battery error
_ANNUM_ER	F0046	Light error detection of external equipment

Appendix 3 Compatibility with MASTER-K
App. 3-3

MASTER-K	XGK
Device	Function	Symbol	Device	Function
_LOG_FULL	F0047	Log memory full warning
_HS_WAR1	F0048	High speed link parameter 1 error
_HS_WAR2	F0049	High speed link parameter 2 error
_HS_WAR3	F0049	High speed link parameter 3 error
_HS_WAR4	F0049	High speed link parameter 4 error
_HS_WAR5	F0049	High speed link parameter 5 error
_HS_WAR6	F0049	High speed link parameter 6 error
_HS_WAR7	F0049	High speed link parameter 7 error
_HS_WAR8	F0049	High speed link parameter 8 error
_HS_WAR9	F0050	High speed link parameter 9 error
_HS_WAR10	F0051	High speed link parameter 10 error
_HS_WAR11	F0052	High speed link parameter 11 error
_HS_WAR12	F0053	High speed link parameter 12 error
_P2P_WAR1	F0054	P2P parameter 1 error
_P2P_WAR2	F0055	P2P parameter 2 error
_P2P_WAR3	F0056	P2P parameter 3 error
_P2P_WAR4	F0057	P2P parameter 4 error
_P2P_WAR5	F0058	P2P parameter 5 error
F0040 ~ F005F	N/A	_P2P_WAR6	F0059	P2P parameter 6 error
F0040 ~ F005F	N/A	_P2P_WAR7	F005A	P2P parameter 7 error
F0040 ~ F005F	N/A	_P2P_WAR8	F005B	P2P parameter 8 error
F0040 ~ F005F	N/A	_Constant_ER	F005C	Constant error
F0040 ~ F005F	N/A	-	F005D ~ F005F	N/A
F0060 ~ F006F	Error Code save	-	F0060 ~ F006F	N/A
F0070 ~ F008F	Fuse cutoff save	-	F0070 ~ F008F	N/A
F0090	20ms cycle Clock	_T20MS	F0090	20ms cycle Clock
F0091	100ms cycle Clock	_T100MS	F0091	100ms cycle Clock
F0092	200ms cycle Clock	_T200MS	F0092	200ms cycle Clock
F0093	1s cycle Clock	_T1S	F0093	1s cycle Clock
F0094	2s cycle Clock	_T2S	F0094	2s cycle Clock
F0095	10s cycle Clock	_T10S	F0095	10s cycle Clock
F0096	20s cycle Clock	_T20S	F0096	20s cycle Clock
F0097	60s cycle Clock	_T60S	F0097	60s cycle Clock
-	F0098	N/A
_ON	F0099	Ordinary time On
_OFF	F009A	Ordinary time Off

Appendix 3 Compatibility with MASTER-K
App. 3-4

MASTER-K	XGK
Device	Function	Symbol	Device	Function
_1ON	F009B	1 Scan On
_1OFF	F009C	1 Scan Off
_STOG	F009D	Reversal every Scan
F0098 ~ F009F	-	F009B ~ F009F	N/A
F0100	User Clock 0	F0100	User Clock 0
F0101	User Clock 1	F0101	User Clock 1
F0102	User Clock 2	F0102	User Clock 2
F0103	User Clock 3	F0103	User Clock 3
F0104	User Clock 4	F0104	User Clock 4
F0105	User Clock 5	F0105	User Clock 5
F0106	User Clock 6	F0106	User Clock 6
F0107	User Clock 7	F0107	User Clock 7
F0108 ~ F010F	-	F0108 ~ F010F	N/A
F0110	Operation error flag	_Ler	F0110	Operation error flag
F0111	Zero flag	_Zero	F0111	Zero flag
F0112	Carry flag	_Carry	F0112	Carry flag
F0113	Full output Off	_All_Off	F0113	Full output Off
F0114	Common RAM R/W error	-	F0114	N/A
F0115	Operation error flag (latch)	_Ler_Latch	F0115	Operation error flag(latch)
F0116 ~ F011F	-	F0116 ~ F011F	N/A
F0120	LT flag	_LT	F0120	LT flag
F0121	LTE flag	_LTE	F0121	LTE flag
F0122	EQU flag	_EQU	F0122	EQU flag
F0123	GT flag	_GT	F0123	GT flag
F0124	GTE flag	_GTE	F0124	GTE flag
F0125	NEQ flag	_NEQ	F0125	NEQ flag
F0126 ~ F012F	N/A	-	F0126 ~ F012F	N/A
F0130~ F013F	AC Down Count	_AC_F_CNT	F0130~ F013F	AC Down Count
F0140~ F014F	FALS no.	_FALS_NUM	F0140~ F014F	FALS no.
F0150~ F015F	PUT/GET error flag	_PUTGET_ERR	F0150~ F030F	PUT/GET error flag
CPU TYPE	F0440 ~ F044F	CPU TYPE
CPU VERSION	F0450 ~ F045F	CPU VERSION
O/S version no.	F0460 ~ F047F	System O/S version no.
F0160~ F049F	N/A	O/S date	F0480 ~ F049F	System O/S DATE

Appendix 3 Compatibility with MASTER-K
App. 3-5

MASTER-K	XGK
Device	Function	Symbol	Device	Function
F0500~ F050F	Max. Scan time	_SCAN_MAX	F0500~ F050F	Max. Scan time
F0510~ F051F	Min. Scan time	_SCAN_MIN	F0510~ F051F	Min. Scan time
F0520~ F052F	Current Scan time	_SCAN_CUR	F0520~ F052F	Current Scan time
F0530~ F053F	Clock data (year/month)	_YEAR_MON	F0530~ F053F	Clock data (year/month)
F0540~ F054F	Clock data (day/hr)	_DAY_TIME	F0540~ F054F	Clock data(day/hr)
F0550~ F055F	Clock data (min/sec)	_MIN_SEC	F0550~ F055F	Clock data(min/sec)
F0560~ F056F	Clock data (100year/weekday)	_HUND_WK	F0560~ F056F	Clock data(100year/weekday)
_FPU_LFlag_I	F0570	Incorrect error latch flag
_FPU_LFlag_U	F0571	Underflow error latch flag
_FPU_LFlag_O	F0572	Overflow error latch flag
_FPU_LFlag_Z	F0573	Zero divide error latch flag
_FPU_LFlag_V	F0574	Invalid operation error latch flag
-	F0575 ~ F0579	N/A
_FPU_Flag_I	F057A	Incorrect error flag
_FPU_Flag_U	F057B	Underflow error flag
_FPU_Flag_O	F057C	Overflow error flag
_FPU_Flag_Z	F057D	Zero divide error flag
_FPU_Flag_V	F057E	Invalid operation error flag
_FPU_Flag_E	F057F	Irregular value Input error flag
F0570~ F058F	N/A	_ERR_STEP	F0580~ F058F	Error step save
F0590~ F059F	Error step save	-	F0590~ F059F	N/A
F0600~ F060F	FMM detailed error information	_REF_COUNT	F060~F061	Refresh Count
F0610~ F063F	N/A	_REF_OK_CNT	F062~F063	Refresh OK Count
_REF_NG_CNT	F064~F065	Refresh NG Count
_REF_LIM_CNT	F066~F067	Refresh Limit Count
_REF_ERR_CNT	F068~F069	Refresh Error Count
_MOD_RD_ERR_CNT	F070~F071	MODULE Read Error Count
_MOD_WR_ERR_CNT	F072~F073	MODULE Write Error Count
_CA_CNT	F074~F075	Cmd Access Count
_CA_LIM_CNT	F076~F077	Cmd Access Limit Count
_CA_ERR_CNT	F078~F079	Cmd Access Error Count
_BUF_FULL_CNT	F080~F081	Buffer Full Count

For flag over F0820 added at XGK, refer to Appendix 1.

Notes

Warranty
1. Terms of warranty
LSIS provides an 18-month warranty starting from the date of production.
2. Range of warranty
For problems within the terms of the warranty, LSIS will replace the entire PLC or repair the defective parts free
of charge except for the following cases.
(1) Problems caused by improper conditions, environment or treatment.
(2) Problems caused by external devices.
(3) Problems caused by the user remodeling or repairing the PLC.
(4) Problems caused by improper use of the product.
(5) Problems caused by circumstances where the expectations exceed that of the science and technology level
when LSIS produced the product.
(6) Problems caused by natural disaster.
3. This warranty is limited to the PLC itself only. It is not valid for the whole system which the PLC is attached to.
■ HEAD OFFICE
LS tower, Hogye-dong, Dongan-gu, Anyang-si, Gyeonggi-do 1026-6,
Korea http://eng.lsis.com
Tel : (82-2)2034-4870/Fax : 82-2-2034-4648 e-mail : cshwang@lsis.com
■ LS Industrial Systems Tokyo Office _ Tokyo, Japan
Address: 16FL. Higashi-Kan. Akasaka Twin Tower 17-22,
Akasaka.Monato-ku Tokyo 107-8470. Japan
Tel : 81-3-3582-9128/Fax : 81-3-3582-2667 e-mail : jschuna@lsis.com
■ LS Industrial Systems(ME) FZE _ Dubai, U.A.E.
Address : Jafza View Tower Lob 19, Room 205 Along Sheikh Zayed
Road Jebel Aali Free Zone Dubai, United Arab Emirates
Tel : 971-4-886-5360/Fax : 971-4-886-5361 e-mail : jungyongl@lsis.com
■ LS Industrial Systems Shanghai Office _ Shanghai, China
Address : Room E-G. 12FL Hiamin Empire Plaza. No.726. West.
Yan'an Road Shanghai 200050. P.R. China e-mail : liyong@lsis.com.cn
Tel : 86-21-5237-9977(609)/Fax : 89-21-5237-7189
■ LS Industrial Systems Beijing Office _ Beijing, China
Address : B-Tower 17FL. Beijing Global Trade Center B/D. No. 36.
East BeisanHuan-Road. DongCheng-District. Beijing 100013. P.R. China
Tel : 86-10-5825-6027(666)/Fax : 86-10-5825-6028 e-mail : xunmj@lsis.com.cn
■ LS Industrial Systems Guangzhou Office _ Guangzhou, China
Address : Room 1403.14FL. New Poly Tower.
2 Zhongshan Liu Road.Guangzhou.P.R China
Tel : 86-20-8328-6754/Fax : 86-20-8326-6287 e-mail : chenxs@lsis.com.cn
■ LS Industrial Systems Chengdu Office _ Chengdu, China
Address : 12FL. Guodong Buiding. No.52 Jindun
Road Chengdu.610041. P.R. China
Tel : 86-28-8612-9151(9226)/Fax : 86-28-8612-9236 e-mail : comysb@lsis.biz
■ LS Industrial Systems Qingdao Office _ Qingdao, China
Address : YinHe Bldg. 402 Room No. 2P Shandong Road,
Qingdao-City,Shandong-province 266071, P.R. China
Tel : 86-532-8501-6068/Fax : 86-532-8501-6057 e-mail : wangzy@lsis.com.cn
■ LS Industrial Systems Europe B.V. , Netherlands
Address : 1st. Floor, Tupolevlaan 48, 1119NZ, Schiphol-Rijk, The Netherlands
Tel : +31 (0)20 654 1420/Fax : +31 (0)20 654 1429 e-mail : junshickp@lsis.biz
■ Wuxi LS Industrial Systems Co., Ltd _ Wuxi, China
Address : 102-A. National High & New Tech Industrial Development Area.
Wuxi. Jiangsu. 214028. P.R. China
Tel : 86-510-8534-6666/Fax : 86-510-8534-4078 e-mail : caidx@lsis.com.cn
■ Dalian LS Industrial Systems Co., Ltd. _ Dalian, China
Address : No. 15. Liaohexi 3-Road. Economic and Technical Development zone.
Dalian 116600. China
Tel : 86-411-273-7777/Fax : 86-411-8730-7560 e-mail : cuibx@lsis.com.cn
※ LS Industrial Systems constantly endeavors to improve its product so that
information in this manual is subject to change without notice.
ⓒ LS Industrial Systems Co., Ltd 2013 All Rights Reserved.
10310000508
2015. 2
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