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Manual XGB Hardware XBM-S XBC-H

○○○○○○ XGT Series Series
XGB Hardware
XBM-DR16S
XBM-DN16S
XBM-DN32S
XBC-DR32H
XBC-DN32H
XBC-DR64H
XBC-DN64H
XBC-DR32HL
XBC-DN32H/DC
XBC-DN64H/DC
XBC-DR32H/DC
XBC-DR64H/DC
Programmable Logic Controller
Safety Instruction
Before using the product …
For your safety and effective operation, please read the safety instructions
thoroughly before using the product.
Safety Instructions should always be observed in order to prevent accident
or risk with the safe and proper use the product.
Instructions are separated into “Warning” and “Caution”, and the meaning of
the terms is as follows;

This symbol indicates the possibility of serious injury
or death if some applicable instruction is violated
Warning

This symbol indicates the possibility of slight injury

or damage to products if some applicable instruction
is violated
Caution

The marks displayed on the product and in the user’s manual have the
following meanings
.
Be careful! Danger may be expected.
Be careful! Electric shock may occur.
The user’s manual even after read shall be kept available and accessible to
any user of the product
.

Safety Instruction
Safety Instructions when designing
Please, install protection circuit on the exterior of PLC to protect
the whole control system from any error in external power or PLC
module.
Any abnormal output or operation may cause serious problem
in safety of the whole system.
- Install applicable protection unit on the exterior of PLC to protect
the system from physical damage such as emergent stop switch,
protection circuit, the upper/lowest limit switch, forward/reverse
operation interlock circuit, etc.
- If any system error (watch-dog timer error, module installation error,
etc.) is detected during CPU operation in PLC, the whole output is
designed to be turned off and stopped for system safety. However,
in case CPU error if caused on output device itself such as relay or
TR can not be detected, the output may be kept on, which may
cause serious problems. Thus, you are recommended to install an
addition circuit to monitor the output status.
Never connect the overload than rated to the output module nor
allow the output circuit to have a short circuit
, which may cause a
fire.
Never let the external power of the output circuit be designed to
be On earlier than PLC power
, which may cause abnormal output or
operation.
In case of data exchange between computer or other external
equipment and PLC through communication or any operation of
PLC (e.g. operation mode change), please install interlock in the
sequence program to protect the system from any error
. If not, it
may cause abnormal output or operation.
Warning
Safety Instruction
Safety Instructions when designing
Safety Instructions when designing
I/O signal or communication line shall be wired at least 100mm
away from a high-voltage cable or power line.
If not, it may cause
abnormal output or operation.
Caution
Use PLC only in the environment specified in PLC manual or
general standard of data sheet.
If not, electric shock, fire, abnormal
operation of the product or flames may be caused.
Before installing the module, be sure PLC power is off. If not,
electric shock or damage on the product may be caused.
Be sure that each module of PLC is correctly secured. If the
product is installed loosely or incorrectly, abnormal operation, error or
dropping may be caused.
Be sure that I/O or extension connecter is correctly secured. If
not, electric shock, fire or abnormal operation may be caused.
If lots of vibration is expected in the installation environment,
don’t let PLC directly vibrated.
Electric shock, fire or abnormal
operation may be caused.
Don’t let any metallic foreign materials inside the product, which
may cause electric shock, fire or abnormal operation.
.
Caution
Safety Instruction
Safety Instructions when wiring
Prior to wiring, be sure that power of PLC and external power is
turned off.
If not, electric shock or damage on the product may be
caused.
Before PLC system is powered on, be sure that all the covers of
the terminal are securely closed.
If not, electric shock may be caused
Warning
Let the wiring installed correctly after checking the voltage rated
of each product and the arrangement of terminals.
If not, fire,
electric shock or abnormal operation may be caused.
Secure the screws of terminals tightly with specified torque when
wiring.
If the screws of terminals get loose, short circuit, fire or abnormal
operation may be caused.
*
Surely use the ground wire of Class 3 for FG terminals, which is
exclusively used for PLC
. If the terminals not grounded correctly,
abnormal operation may be caused.
Don’t let any foreign materials such as wiring waste inside the
module while wiring,
which may cause fire, damage on the product
or abnormal operation
.
Caution
Safety Instruction
Safety Instructions for test-operation or repair
Safety Instructions for waste disposal
Don’t touch the terminal when powered. Electric shock or abnormal
operation may occur.
Prior to cleaning or tightening the terminal screws, let all the
external power off including PLC power.
If not, electric shock or
abnormal operation may occur.
Don’t let the battery recharged, disassembled, heated, short or
soldered
. Heat, explosion or ignition may cause injuries or fire.
Warning
Don’t remove PCB from the module case nor remodel the module.
Fire, electric shock or abnormal operation may occur.
Prior to installing or disassembling the module, let all the external
power off including PLC power.
If not, electric shock or abnormal
operation may occur.
Keep any wireless installations or cell phone at least 30cm away
from PLC
. If not, abnormal operation may be caused.
Caution
Product or battery waste shall be processed as industrial waste.
The waste may discharge toxic materials or explode itself.
Caution
Revision History

Version Date Remark Page
V 1.0 2006.6 1. First Edition -
V 1.1 2007.7 1. Position and Special function contents separated
(1) Position function contents separated
(position part published)
(2) PID control and Ch. 12 Analog IO module contents
separated
2. Contents added
(1) Naming standard added
(2) Caution when selecting IO module added
(3) IO wiring method by using Smart Link board added
(4) Installation and wiring contents added
3. Content modified
(1) Safety instruction modified
(2) System Configuration modified
(3) High speed counter function modified
(4) External dimension modified
- -
2-3 ~ 2-6
7-1 ~ 7-6
7-27 ~ 7-28
10-1 ~ 10-18
1 ~ 6
2-7 ~ 2-10
8-6 ~ 8-8
App. 2-1 ~ 2-4
V 1.2 2008.3 1. XGB compact type ‘H’ type added
2. Built-in communication content separated
(1) Ch.9 built-in communication function separated
(Cnet I/F user manual)
-
Ch. 9
V1.3 2009.3 1. Specification of output for positioning added 7-13,14,17,18
V1.6 2010.3 1. “UL warranty voltage” word added
2. RTC example program modified
3. XBC input resistor modified and digital I/O mixed module
added
4. Installation of module added
5. DC power unit added
6. DC power unit and expansion module added
7. DC power unit and expansion module added
8. DC power unit and expansion module added
9. DC power unit and expansion module added
10. Error in high speed counter channel fixed
11. Specification of TR output for positioning modified
4-6
6-22
Chapter 7
9-10
Front cover
2-1 ~ 2-4
4-6 ~ 4-7
Chapter 7
Appendix 2
8-3
7-13, 14, 17, 18

 

Version Date Remark Page
12. Error in figure fixed
13. External memory module added
14. XGB compact type model added
15. ‘S’, ‘H’ type max. I/O point modified
16. ‘S’, ‘H’ type max. I/O point modified
V1.7
4-4
Ch6.13
Front cover
2-1 ~ 2-4
4-1 ~ 4-2
2014.3
1. Data Back-up method added
2. Module added
(1) XBE-DC16B/RY08B
(2) XBF-AD04C/DV04C/DC04C
(3) XBL-EIMT/EIMF/EIMH/EIPT/CMEA/CSEA/PMEC
3.Domain of Homepage Changed
4. External Memory Module Modified
(XBO-M1024B
XBO-M2MB)
4-11
7-20,7-23
2-2~ 2-8
2-2~ 2-8
Front/Back Cover
6-23~6-30

The number of User’s manual is indicated the right side of the back cover.
ⓒ LSIS Co., Ltd. 2006 All Rights Reserved.
About User’s Manual
About User’s Manual
Congratulations on purchasing PLC of LSIS Co.,Ltd.
Before use, make sure to carefully read and understand the User’s Manual about the functions,
performances, installation and programming of the product you purchased in order for correct use and
importantly, let the end user and maintenance administrator to be provided with the User’s Manual.
The Use’s Manual describes the product. If necessary, you may refer to the following description and order
accordingly. In addition, you may connect our website(
http://www.lsis.com/) and download the information as
a PDF file.
Relevant User’s Manual

Title Description No. of User
Manual
XG5000 User’s
Manual
It describes how to use XG5000 software especially about
online functions such as programming, printing, monitoring
and debugging by using XGT series products.
10310000512
XGK/XGB Series
Instruction &
Programming
It describes how to use the instructions for programming
using XGK/XGB series.
10310000510
XGB Hardware
User’s Manual
It describes how to use the specification of power/input
/output/expansion modules, system configuration and built-in
High-speed counter for XGB basic unit.
10310000926
XGB Analog
User’s Manual
It describes how to use the specification of analog
input/analog output/temperature input module, system
configuration and built-in PID control for XGB basic unit.
10310000920
XGB Cnet I/F
User’s Manual
It describes how to use built-in communication function for
XGB basic unit and external Cnet I/F module.
10310000816
XGB Fast Ethernet I/F
User’s Manual
It describes how to use XGB FEnet I/F module. 10310000873

 

Contents

 

Chapter 1 Introduction ...................................................................... 1-1~1-5

1.1 Guide to Use This Manual...................................................................................... 1-1
1.2 Features ................................................................................................................ 1-2
1.3 Terminology ........................................................................................................... 1-4

Chapter 2 System Configuration........................................................... 2-1~2-11

2.1 XGB System Configuration .................................................................................. 2-1
2.2 Product List .......................................................................................................... 2-3
2.3 Classification and Type of Product Name ............................................................. 2-5
2.3.1 Classification and type of basic unit .........................................................................2-5
2.3.2 Classification and type of expansion module ...........................................................2-6
2.3.3 Classification and type of special module .................................................................2-7
2.3.4 Classification and type of communication module .....................................................2-8
2.4 System Configuration ........................................................................................... 2-9
2.4.1 Cnet I/F system ..........................................................................................................2-9
2.4.2 Ethernet system........................................................................................................2-12

Chapter 3 General Specifications ................................................................. 3-1

3.1 General Specifications ........................................................................................... 3-1

Chapter 4 CPU Specifications ............................................................... 4-1~4-11

4.1 Performance Specifications .................................................................................. 4-1
4.2 Names of Part and Function ................................................................................. 4-4
4.3 Power Supply Specifications ................................................................................ 4-6
4.4 Calculating Example of Consumption Current/Voltage ......................................... 4-8
4.5 Battery ............................................................................................................... 4-10

4.5.1 Battery specification .................................................................................................4-10
4.5.2 Notice in using ..........................................................................................................4-10
4.5.3 Life of battery............................................................................................................4-10
4.5.4 How to change the battery .......................................................................................4-11
4.6 Data Back-up Method ......................................................................................... 4-11

Chapter 5 Program Configuration and Operation Method.................. 5-1~5-36

5.1 Program Instruction .............................................................................................. 5-1
5.1.1 Program execution methods ....................................................................................5-1
5.1.2 Operation processing during momentary power failure ...........................................5-2
5.1.3 Scan time ..................................................................................................................5-3
5.1.4 Scan Watchdog timer ...............................................................................................5-4
5.1.5 Timer processing ......................................................................................................5-5
5.1.6 Counter processing ..................................................................................................5-8
5.2 Program Execution ............................................................................................. 5-10
5.2.1 Configuration of program ........................................................................................5-10
5.2.2 Program execution methods ....................................................................................5-10
5.2.3 Interrupt . ..................................................................................................................5-12
5.3 Operation Mode ................................................................................................. 5-24
5.3.1 RUN mode ..............................................................................................................5-24
5.3.2 STOP mode ............................................................................................................5-25
5.3.3 DEBUG mode .........................................................................................................5-25
5.3.4 Change operation mode .........................................................................................5-29
5.4 Memory................................................................................................................ 5-30
5.4.1 Data memory ..........................................................................................................5-30
5.5 Configuration Diagram of Data Memory ............................................................. 5-32
5.5.1 “S” type .....................................................................................................................5-32
5.5.2 “H” type.....................................................................................................................5-33
5.5.3 Data latch area setting..............................................................................................5-34

Chapter 6 CPU Functions ...................................................................... 6-1~6-22

6.1 Type Setting ......................................................................................................... 6-1
6.2 Parameter Setting ................................................................................................ 6-2

6.2.1 Basic parameter setting ............................................................................................6-2
6.2.2 I/O parameter setting ................................................................................................6-3
6.3 Self-diagnosis Function ........................................................................................ 6-4
6.3.1 Saving of error log ....................................................................................................6-4
6.3.2 Troubleshooting ........................................................................................................6-5
6.4 Remote Functions.................................................................................................. 6-6
6.5 Forced Input/Output On and Off Function .............................................................. 6-7
6.5.1 Force I/O setup .........................................................................................................6-7
6.5.2 Processing time and method of Forced Input/Output On and Off ............................6-8
6.6 Direct Input/Output Operation ................................................................................6-8
6.7 Diagnosis of External Device .................................................................................6-9
6.8 Allocation of Input/Output Number .......................................................................6-10
6.9 Online Editing ......................................................................................................6-12
6.10 Reading Input/Output Information ...................................................................... 6-15
6.11 Monitoring ........................................................................................................ 6-16
6.12 RTC function...................................................................................................... 6-21
6.12.1 How to use ............................................................................................................6-21
6.13 External Memory Module ...................................................................................... 6-23
6.13.1 Structure ...............................................................................................................6-23
6.13.2 How to use ............................................................................................................6-23

Chapter 7 Input/Output Specifications ............................................... 7-1~7-33

7.1 Introduction .......................................................................................................... 7-1
7.2 Basic Digital Input Unit Specifications ................................................................... 7-7
7.2.1 XBM-DR16S input unit (Source/Sink type) ................................................................7-7
7.2.2 XBM-DN16S input unit (Source/Sink type) ................................................................7-8
7.2.3 XBM-DN32S input unit (Source/Sink type) ..............................................................7-9
7.2.4 XBC-DR32H / XBC-DN32H input unit (Source/Sink type).......................................7-10
7.2.5 XBC-DR64H / XBC-DN64H input unit (Source/Sink Type)......................................7-11
7.3 Basic Digital Output Unit Specifications .............................................................. 7-12
7.3.1 XBM-DR16S relay output unit..................................................................................7-12
7.3.2 XBM-DN16S transistor output unit (Sink type).........................................................7-13
7.3.3 XBM-DN32S transistor output unit (Sink type).........................................................7-14
7.3.4 XBC-DR32H output unit ...........................................................................................7-15
7.3.5 XBC-DR64H output unit ...........................................................................................7-16

7.3.6 XBC-DN32H output unit (Sink type).........................................................................7-17
7.3.7 XBC-DN64H output unit (Sink type).........................................................................7-18
7.4 Digital Input Module Specifications ..................................................................... 7-19
7.4.1 8 point DC24V input module (Source/Sink type) ....................................................7-19
7.4.2 16 point DC24V input module (Source/Sink type) ..................................................7-20
7.4.3 32 point DC24V input module (Source/Sink type) ...................................................7-21
7.5 Digital Output Module Specifications .................................................................. 7-22
7.5.1 8 point relay output module......................................................................................7-22
7.5.2 8 point relay output module......................................................................................7-23
7.5.3 16 point relay output module....................................................................................7-24
7.5.4 8 point transistor output module (Sink type) ............................................................7-25
7.5.5 16 point transistor output module (Sink type) ..........................................................7-26
7.5.6 32 point transistor output module (Sink type) ..........................................................7-27
7.5.7 8 point transistor output module (Source type)........................................................7-28
7.5.8 16 point transistor output module (Source type)......................................................7-29
7.5.9 32 point transistor output module (Source type)......................................................7-30
7.6 Digital I/O Mixed Module Input Specifications ..................................................... 7-31
7.7 Digital I/O Mixed Module Output Specifications .................................................. 7-32
7.8 IO Wiring by Using Smart Link Board ................................................................. 7-33
7.8.1 Smart link board .......................................................................................................7-33

Chapter 8 Built-in High-speed Counter Function .............................. 8-1~8-54

8.1 High-speed Counter Specifications ........................................................................ 8-1
8.1.1 Performance specifications ......................................................................................8-1
8.1.2 Designation of parts ..................................................................................................8-2
8.1.3 “S” type Functions ..................................................................................................8-6
8.1.4 “H” type Functions ................................................................................................8-23
8.2 Installation and Wiring ........................................................................................ 8-40
8.2.1 Precaution for wiring ...............................................................................................8-40
8.2.2 Example of wiring ...................................................................................................8-40
8.3 Internal Memory ................................................................................................. 8-41
8.3.1 Special area for High-speed counter ......................................................................8-41
8.3.2 Error code ...............................................................................................................8-49
8.4 Examples: Using High-speed Counter ................................................................ 8-50

Chapter 9 Installation and Wiring ........................................................ 9-1~9-17

9.1 Safety Instruction ................................................................................................. 9-1
9.1.1 Fail safe circuit ..........................................................................................................9-3
9.1.2 PLC heat calculation ..................................................................................................9-6
9.2 Attachment/Detachment of Modules ..................................................................... 9-8
9.2.1 Attachment/Detachment of modules .......................................................................9-8
9.2.2 Caution in handling ..................................................................................................9-12
9.3 Wire ..................................................................................................................... 9-13
9.3.1 Power wiring.............................................................................................................9-13
9.3.2 I/O Device wiring ......................................................................................................9-16
9.3.3 Grounding wiring ......................................................................................................9-16
9.3.4 Specifications of wiring cable ...................................................................................9-17

Chapter 10 Maintenance .................................................................... 10-1~10-2

10.1 Maintenance and Inspection ............................................................................. 10-1
10.2 Daily Inspection ................................................................................................ 10-1
10.3 Periodic Inspection ........................................................................................... 10-2

Chapter 11 Troubleshooting ............................................................ 11-1~11-12

11.1 Basic Procedure of Troubleshooting ................................................................. 11-1
11.2 Troubleshooting.................................................................................................. 11-1
11.2.1 Troubleshooting flowchart used with when the PWR(Power) LED turns Off. ........11-2
11.2.2 Troubleshooting flowchart used with when the ERR(Error) LED is flickering .......11-3
11.2.3 Troubleshooting flowchart used with when the RUN,STOP LED turns Off. .........11-4
11.2.4 Troubleshooting flowchart used with when the I/O part doesn’t operate normally..11-5
11.3 Troubleshooting Questionnaire ......................................................................... 11-7
11.4 Troubleshooting Examples ............................................................................... 11-8
11.4.1 Input circuit troubles and corrective actions .........................................................11-8
11.4.2 Output circuit and corrective actions ......................................................................11-9
11.5 Error Code List..................................................................................................11-11

Appendix 1 Flag List ........................................................... App. 1-1~App.1-10

Appendix 1.1 Special Relay (F) List .....................................................................App. 1-1
Appendix 1.2 Communication Relay (L) List ........................................................App. 1-6
Appendix 1.3 Network Register (N) List ............................................................App. 1-10

Appendix 2 Dimension............................................................. App.2-1~App.2-5

 

Appendix 3 Compatibility with MASTER-K ............................ App.3-1~App.3-5

 

Appendix 4 Instruction List ................................................... App.4-1~App.4-40

Appendix 4.1 Classification of Instructions............................................................App.4-1
Appendix 4.2 Basic Instructions ..........................................................................App.4-2
Appendix 4.3 Application Instruction ....................................................................App.4-5
Appendix 4.4 Special/Communication Instruction.............................................. App.4-37

Chapter 1 Introduction
1-1
Chapter 1 Introduction

1.1 Guide to Use This Manual

This manual includes specifications, functions and handling instructions for the XGB series PLC.
This manual is divided up into chapters as follows.

No. Title Contents
Chapter 1 Introduction Describes configuration of this manual, unit‟s features and
terminology.
Chapter 2 System Configurations Describes available units and system configuration in the XGB
series.
Chapter 3 General Specifications Describes general specifications of units used in the XGB
series.
Chapter 4 CPU Specifications Describes performances, specifications and operations.
Chapter 5 Program Configuration and
Operation Method
Chapter 6 CPU Module Functions
Chapter 7 Input/Output Specifications Describes operation of basic and input/output.
Chapter 8 Built-in High-speed Counter
Function
Describes built-in high-speed counter functions.
Chapter 9 Installation and Wiring Describes installation, wiring and handling instructions for
reliability of the PLC system.
Chapter 10 Maintenance Describes the check items and method for long operation of the PLC system. -term normal
Chapter 11 Troubleshooting Describes various operation errors and corrective actions.
Appendix 1 Flag List Describes the types and contents of various flags.
Appendix 2 Dimension Shows dimensions of the main units and expansion modules.
Appendix 3 Compatibility with
MASTER-K
Describes the compatibility with MASTER-K.
Appendix 4 Instruction List Describes the special relay and instruction list.

Chapter 1 Introduction
1-2

1.2 Features

The features of XGB system are as follows.
(1) The system secures the following high performances.
(a) High Processing Speed
(b) Max. 384 I/O control supporting small & mid-sized system implementation

Item Type Reference
XBM-DxxxS XBC-DxxxH
Operation processing
speed
160ns / Step 120ns / Step -
Max IO contact point 256 points 384 points
Program capacity 10Kstep 15Kstep -
Max. no. of expanded
base
7 10 -

(c) Enough program capacity
(d) Expanded applications with the support of floating point.
(e) XBM-DxxxS is expressed “S” type and XBC-DxxxH is expressed “H” type.
(2) Compact : the smallest size comparing to the same class model of competitors.
(a) Compact panel realized through the smallest size.

Item Type Size (W * H * D) Reference
Basic unit XBC-Dx32H 114 * 90 * 64 “H” type
XBC-Dx64H 180 * 90 * 64
XBM-DxxxS 30 * 90 * 64 “S” type
Extension module XBE-,XBF-,XBL- 20 * 90 * 60 Basis of minimum size

(3) Easy attachable/extensible system for improved user convenience.
(a) Easy attachable to European terminal board and convenient-to-use MIL connector method improving
convenient wiring. (“S” type basic unit and expanded module)
(b) By adopting a removable terminal block connector (M3 X 6 screw), convenience of wiring may be
increased.
(c) By adopting connector coupling method, modules may be easily connected and separated.
(4) Improved maintenance ability with kinds of register, built-in RTC (“H” type), comment backup and etc
(a) Convenient programming environment by providing analogue register and index register.
(b) Improved maintenance ability by operating plural programs and task program through module program.
(c) Built-in Flash ROM enabling permanent backup of program without any separate battery.
(d) Improved maintenance ability by types of comment backup.
(e) Built-in RTC function enabling convenient history and schedule management

Chapter 1 Introduction
1-3
(5) Optimized communication environment.
(a) With max. 2 channels of built-in COM (excl. loader), up to 2 channel communication is available without
any expanded of module.
(b) Supporting various protocols to improve the convenience (dedicated, Modbus, user-defined
communication)
(c) Communication module may be additionally increased by adding modules (up to 2 stages such as Cnet,
Enet and etc).
(d) Convenient network-diagnostic function through network & communication frame monitoring.
(e) Convenient networking to upper systems through Enet or Cnet.
(f) High speed program upload and download by USB Port
(6) Applications expanded with a variety of I/O modules.
(a) 8, 16, 32 points modules provided (if relay output, 8/16 points module).
(b) Single input, single output and combined I/O modules supported.
(7) Applications expanded through analog-dedicated register design and full attachable mechanism.
(a) All analogue modules can be attachable on extension base. (H type: up to 10 stages available)
(b) With analog dedicated register(U) and monitoring dedicated function, convenient use for I/O is
maximized (can designate operations using easy programming of U area and monitoring function)
(8) Integrated programming environment
(a) XG 5000: intensified program convenience, diverse monitoring, diagnosis and editing function
(b) XG - PD: COM/network parameters setting, frame monitoring, protocol analysis function
(9) Built-in high speed counter function
(a) Providing High-speed counter 1phase, 2phase and more additional functions.
(b) Providing parameter setting, diverse monitoring and diagnosis function using XG5000.
(c) Monitoring function in XG5000 can inspect without program, inspecting external wiring, data setting and
others.
(10) Built-in position control function
(a) Supporting max 100Kpps 2 axes.
(b) Providing parameter setting, operation data collection, diverse monitoring and diagnosis by using
XG5000.
(c) Commissioning by monitoring of XG5000, without program, inspecting external wiring and operation data
setting.

Chapter 1 Introduction
1-4
(11) Built-in PID
(a) Supporting max. 16 loops.
(b) Setting parameters by using XG5000 and supporting loop status monitoring conveniently with trend
monitor.
(c) Control constant setting through the improved Auto-tuning function.
(d) With many other additional functions including PWM output, ∆MV, ∆PV and SV Ramp, improving the
control preciseness.
(e) Supporting types of control modes such as forward/backward mixed operation, 2-stage SV PID control,
cascade control and etc.
(f) A variety of warning functions such as PV MAX and PV variation warning securing the safety.

1.3 Terminology

The following table gives definition of terms used in this manual.

Terms Definition Remark
Module A standard element that has a specified function which configures
the system. Devices such as I/O board, which inserted onto the
mother board.
Example)
Expansion module,
Special module,
Communication
module
Unit A single module or group of modules that perform an
independent operation as a part of PLC systems.
Example)
Main unit,
Expansion unit
PLC System A system which consists of the PLC and peripheral devices.
A user program can control the system.
-
XG5000 A program and debugging tool for the MASTER-K series.
It executes program creation, edit, compile and debugging.
(PADT: Programming Added Debugging Tool)
-
XG - PD Software to execute description, edition of basic parameter, high
speed link, P2P parameter, and function of communication
diagnosis
-
I/O image area Internal memory area of the CPU module which used to hold I/O
status.
Cnet Computer Network -
FEnet Fast Ethernet Network -
Pnet Profibus-DP Network -
Dnet DeviceNet Network -
RTC Abbreviation of „Real Time Clock‟. It is used to call general IC that
contains clock function.
-
Watchdog Timer Supervisors the pre-set execution times of programs and warns if
a program is not competed within the pre-set time.
-

Chapter 1 Introduction
1-5

Terms Definition Remark
Sink Input Current flows from the switch to the PLC input terminal if a input
signal turns on.
Z: Input
impedance
Source Input Current flows from the PLC input terminal to the switch after a
input signal turns on.
-
Sink Output Current flows from the load to the output terminal and the PLC
output turn on.
-
Source Output Current flows from the output terminal to the load and the PLC
output turn on.
-

 

Output
Contact

Chapter 2 System Configuration
2-1
Chapter 2 System Configuration
The XGB series has suitable to configuration of the basic, computer link and network systems.
This chapter describes the configuration and features of each system.
2.1. XGB System Configuration
XGB series System Configuration is as follows. Expanded I/O module and special module are available to
connect maximum 7 stages for “S” type and 10 stages for “H” type. Expanded communication module is
available to connect maximum 2 stages.
Main Unit I/O Module Special Module Communication Module

Chapter 2 System Configuration
2-2

Item Description
Total I/O points XBC-DxxxH (“H” type): 32~384 points
XBM-DxxxS (“S” type): 16~256 points
Maximum number of
expansion
modules
Digital I/O module “S” type: Max. 7 / “H” type: Max. 10
Special module “S” type: Max. 7 / “H” type: Max. 10
Communication I/F
module
Maximum 2
Items Main unit “H” type refer to 2.2 Product List
“S” type
Expansion
module
Digital I/O module
A/D·D/A module
Communication I/F
module

Chapter 2 System Configuration
2-3
2.2. Product List
XGB series’ product list is as follows.

Types Model Description Remark
Main Unit XBC-DR32H AC100-220V power supply, DC24V input 16 point, Relay output 16 point “H” type
XBC-DN32H AC100-220V power supply, DC24V input 16 point, Transistor output 16 point
XBC-DR64H AC100-220V power supply, DC24V input 32 point, Relay output 32 point
XBC-DN64H AC100-220V power supply, DC24V input 32 point, Transistor output 32 point
XBC-DR32HL AC100-220V power supply, DC24V input 16 point, relay output 16 point
XBC-DR32H/DC DC 24V power supply, DC24V input 16 point, relay output 16 point
XBC-DN32H/DC DC 24V power supply, DC24V input 16 point, TR output 16 point
XBC-DR64H/DC DC 24V power supply, DC24V input 32 point, relay output 32 point
XBC-DN64H/DC DC 24V power supply, DC24V input 32 point, TR output 32 point
XBM-DN16S DC24V Power supply, DC24V Input 8 point, Transistor output 8 point “S” type
XBM-DN32S DC24V Power supply, DC24V Input 16 point, Transistor output 16 point
XBM-DR16S DC24V Power supply, DC24V Input 8 point, Relay output 8 point
Expansion Unit XBE-DC08A DC24V Input 8 point Input
XBE-DC16A/B DC24V Input 16 point
XBE-DC32A DC24V Input 32 point
XBE-RY08A Relay output 8 point Output
XBE-RY08B Relay output 8 point(isolated ouput)
XBE-RY16A Relay output 16 point
XBE-TN08A Transistor output 8 point (sink type)
XBE-TN16A Transistor output 16 point (sink type)
XBE-TN32A Transistor output 32 point (sink type)
XBE-TP08A Transistor output 8 point (source type)
XBE-TP16A Transistor output 16 point (source type)
XBE-TP32A Transistor output 32 point (source type)
XBE-DR16A DC24V Input 8 point, Relay output 8 point In/Output
Special Module XBF-AD04A Current/Voltage input 4 channel Analog
ln/Out
XBF-AD04C Current/Voltage input 4 channel, High resolution
XBF-AD08A Current/Voltage input 8 channel
XBF-DC04A Current output 4 channel
XBF-DC04C Current output 4 channel, High resolution
XBF-DV04A Voltage output 4 channel
XBF-DV04C Voltage output 4 channel, High resolution
XBF-AH04A Current/Voltage input 2 channel, Current/Voltage output 2 channel,

Chapter 2 System Configuration
2-4

Types Model Description Remark
Special Module XBF-RD04A RTD (Resistance Temperature Detector) input 4 channel Temperature
XBF-RD01A RTD (Resistance Temperature Detector) input 1 channel
XBF-TC04S TC (Thermocouple) input 4 channel
XBF-PD02A Position 2Axis, Line Drive type Position
XBF-HD02A High Speed Counter 2 channel, Line Drive Type Counter
XBF-HO02A High Speed Counter 2 channel, Open Collector Type
Communication
Module
XBL-C21A Cnet (RS-232C/Modem) I/F -
XBL-C41A Cnet (RS-422/485) I/F -
XBL-EMTA Enet I/F -
XBL-EIMT RAPIEnet I/F 2 UTP cable -
XBL-EIPT EtherNet I/P Module -
XBL-CMEA CANopen MasterI/F -
XBL-CSEA CANopen Slave I/F -
XBL-PMEC Pnet I/F -
Down
load
cable
PMC-310S Connection cable (PC to PLC), 9pin(PC)-6pin(PLC) -
USB-301A Connection cable (PC to PLC), USB --

 

Download Cable (PMC-310S) Diagram
Note

Chapter 2 System Configuration
2-5
2.3. Classification and Type of Product Name
2.3.1 Classification and type of basic unit
Name of basic unit is classified as follows.

Classification Name DC input Relay output Transistor output Power
Module type
basic unit
XBM-DR16S 8 point 8 point None DC24V
XBM-DN16S 8 point None 8 point
XBM-DN32S 16 point None 16 point
Compact type
basic unit
XBC-DR32H 16 point 16 point None AC110V-220V
XBC-DN32H 16 point None 16 point
XBC-DR64H 32 point 32 point None
XBC-DN64H 32 point None 32 point
XBC-DR32HL 16 point 16 point None
XBC-DR32H/DC 16 point 16 point None DC24V
XBC-DN32H/DC 16 point None 16 point
XBC-DR64H/DC 32 point 32 point None
XBC-DN64H/DC 32 point None 32 point

 

X B M

-

D R X X S

Relay output (R)
Sink type transistor output (N)
Source type transistor output (P)
No. of I/O point
XGB PLC standard (S)
XGB PLC XGB PLC High-end type (H)
Module type basic unit (M)
Compact type basic unit(C)
DC input
MK language supported (B)
IEC language supported (E)

Chapter 2 System Configuration
2-6
2.3.2 Classification and type of expansion module
Name of expansion module is classified as follows.

Name DC input Relay output Transistor output Reference
XBE-DC08A 8 None None
XBE-DC16A/B 16 point None None
XBE-DC32A 32 point None None
XBE-RY08A/B None 8 point None
XBE-RY16A None 16 point None
XBE-TN08A None None 8 point
(sink type)
XBE-TN16A None None 16 point
(sink type)
XBE-TN32A None None 32 point
(sink type)
XBE-TP08A None None 8 point
(source type)
XBE-TP16A None None 16 point
(source type)
XBE-TP32A None None 32 point
(source type)
XBE-DR16A 8 8 None
XBE-TP64A None None 64 point (source type)
XBE-DC64A 64 point None None

 

X B E

-

DC

X X A
Relay output(RY)
Transistor output (TN/TP)
Digital input (DC)
Digital input+ sink type transistor output (DN)
Digital input+ source type transistor output (DP)
XGB series No. of I/O point
I/O expansion module
Chapter 2 System Configuration
2-7
2.3.3 Classification and type of special module
Special module is classified as follows.

Classification Name No. of
input ch.
Input type output ch. No. of Output type
Analog input XBF-AD04A/C 4 Voltage/Current None -
XBF-AD08A 8 Voltage/Current None
Analog output XBF-DC04A/C None - 4 Current
XBF-DV04A/C None - 4 Voltage
RTD input XBF-RD04A 4 PT100/JPT100 None -
XBF-RD01A 1 PT100/JPT100 None -
TC input XBF-TC04S 4 K, J, T, R None -
Positioning XBF-PD02A 2 Line Driver
High Speed
Counter
XBF-HD02A 2 Line Driver
XBF-HO02A 2 Open Collector

 

X B F

-

AD

X X A
Analog input (AD)
Analog voltage output (DC)
Analog current output (DV)
RTD input (RD)
Thermocouple input (TC)
Positioning Module(PD)
High Speed Counter(HD/HO)
No. of IO point
XGB series
Expansion special module
Non-insulation type (A)
Insulation type (S)

Chapter 2 System Configuration
2-8
2.3.4 Classification and type of communication module
Name of communication module is classified as follows.

Classification Name Type
Cnet Comm. Module XBL-C21A RS-232C, 1 channel
XBL-C41A RS-422/485, 1 channel
FEnet Comm. Module XBL-EMTA Electricity, open type Ethernet
RAPIEnet Comm. Module XBL
EIMT/EIMF/EIMH
Comm. Module between PLCs, electric media,
100 Mbps industrial Ethernet supported
EtherNet Comm. Module XBL-EIPT Open EtherNet I/P
CANopen Comm. Module XBL-CMEA CANopen Master
XBL-CSEA CANopen Slave
Pnet Comm. Module XBL-PMEC Profibus-DP

 

X B L - C21

Cnet 1 channel (RS-232C): C21A
Cnet 1 channel (RS-422/485): C41A
FEnet 1 channel: EMTA
RAPIEnet 1 channel: EIMT
XGB series
Expansion communication module
Chapter 2 System Configuration
2-9
2.4. System Configuration
2.4.1 Cnet I/F system
Cnet I/F System is used for communication between the main unit and external devices using RS-
232C/RS-422 (485) Interface. The XGB series has a built-in RS-232C port, RS-485 port and has also
XBL-C21A for RS-232C, XBL-C41A for RS-422/485. It is possible to construct communication systems
on demand.
1) 1:1 communication system
(1) 1:1 communication of an external device (computer) with main unit using a built-in port
(RS-232C/RS-485)
(2) 1:1 communication with main unit using a built-in RS-485 port
(In case of built-in RS-232C,it is for connecting to HMI device.)

Built-

in RS-232C Connection
PADT
connection
Built-in RS-485 Connection

RS-232C / RS-485

XBC-DR32H

XBC-DR32H XBM-

DN32S
XP30-TTA
Chapter 2 System Configuration
2-10
(3) 1:1 RS-232C Communication with remote device via modem by Cnet I/F modules
(4) 1:1 communication of an external device (monitoring unit) with main unit using a built-in RS-
232C/485 port.
Modem
Modem
XBM-DN32S XBL-C21A XBM-DN32S XBL-C21A
Modem
Modem
XBC-DR32H XBL-C21A
Built-in RS-232C/485 connection
XP30-TTA

Chapter 2 System Configuration
2-11
2) 1:n Communication system
(1) Using RS-485 built-in function can connect between one computer and multiple main units for up
to 32 stations.
(2) Using RS-485 built-in function/expansion Cnet I/F module can be connect for up to 32 stations.

Can be connected
Max. 32 stations
XBM-DR16S XBM-DN32S

PADT connection
Can be connected
Max. 32 stations
Built-in RS-232C
Connection
XBM-DN32S XBC-DN32H
PADT Connection
Built-in RS-232C connection

XBL-C41A
XBL-C41A
XBM-DN16S
Ma

XBM-DN32S
XBC-DN32H XBL-C41A

1) Refer to ‘XGB Cnet I/F user manual’ for details
Note

Can be connected
x. 32 stations

Chapter 2 System Configuration
2-12
Hub Hub
Hub
Hub
Router or
Gateway
Router or
Gateway
Public line
2.4.2 Ethernet system
Ethernet made by cooperation of Xerox, Intel, DEC is standard LAN connection method (IEEE802.3),
which is network connection system using 1.5KB packet with 100Mbps transmission ability. Since
Ethernet can combine a variety of computer by network, it is called as standard specification of LAN and
diverse products. By adopting CSMA/CD method, it is easy to configure the network and collect large
capacity data.

1) Refer to ‘XGB FEnet I/F user manual’ for details
Note

100Base-TX
M
HMI
HMI
H

Chapter 3 General Specifications
3-1
Chapter 3 General Specifications
3.1 General Specifications
The General specification of XGB series is as below.

No. Items Specification Reference
1 Ambient Temp. 0 ~ 55 C -
2 Storage Temp. 25 ~ 70 C
3 Ambient humidity 5 ~ 95%RH (Non-condensing)
4 Storage humidity 5 ~ 95%RH (Non-condensing)
5 Vibration Occasional vibration -
Frequency Acceleration Pulse width Times IEC61131-2
10 f 57Hz 0.075mm 10 times
each
direction
(X,Y and Z)
57 f 150Hz 9.8m/s2(1G)
Continuous vibration
Frequency Acceleration Pulse width
10 f 57Hz 0.035mm
57 f 150Hz 4.9m/s2(0.5G)
6 Shocks Peak acceleration : 147 m/s2(15G)
Duration : 11ms
Pulse wave type : Half-sine (3 times each direction per each axis)
7 Impulse noise Square wave
impulse noise
AC: 1,500 V
DC:
900 V
LSIS standard
Electrostatic
discharge
Voltage: 4kV (Contact discharge) IEC61131-2
IEC61000-4-2
Radiated
electromagnetic
field noise
27 ~ 500 MHz, 10V/m IEC61131-2,
IEC61000-4-3
Fast transient
/Burst noise
Classifi
cation
Power
supply
Digital/Analog Input/Output,
Communication Interface
IEC61131-2
IEC61000-4-4
Voltage 2kV 1kV
8 Operation
ambience
Free from corrosive gases and excessive dust -
9 Altitude Less than 2,000m
10 Pollution degree Less than 2
11 Cooling method Air-cooling

 

1) IEC (Inte
: An int
electric/
system
2) Pollution
: An in
perform
non-ele
the for
rnational Electrotechnical Commission)
ernational civil community that promotes international cooperation for standardization of
electro technology, publishes international standard and operates suitability assessment
related to the above.
Degree
dex to indicate the pollution degree of used environment that determines the insulation
ance of the device. For example, pollution degree 2 means the state to occur the pollution of
ctric conductivity generally, but the state to occur temporary electric conduction according to
ation of dew.
Notes

Chapter 4 CPU Specifications
4-1
Chapter 4 CPU Specifications

4.1 Performance Specifications

The following table shows the general specifications of the XGB module type CPU.

Items Specifications (“S” type) Remark
XBM-DR16S XBM-DN16S XBM-DN32S
Program control method Cyclic execution of stored program, Time-driven interrupt,
Process-driven interrupt
-
I/O control method Batch processing by simultaneous scan (Refresh method),
Directed by program instruction
Program language Ladder Diagram, Instruction List
Number of
instructions
Basic 28
Application 677
Processing speed
(Basic instruction)
0.16 /Step
Program capacity 10 ksteps
Max. I/O points 240 point (Main + Expansion 7 stages) 256 point
Data area P P0000 ~ P127F (2,048 point)
M M0000 ~ M255F (4,096 point)
K K00000 ~ K2559F (Special area: K2600~2559F) (40,960 point)
L L00000 ~ L1279F (20,480 point)
F F000 ~ F255F (4,096 point)
T 100ms, 10ms, 1ms : T000 ~ T255
(Adjustable by parameter setting)
C C000 ~ C255
S S00.00 ~ S127.99
D D0000 ~ D5119 (5120 word) Word
U U00.00 ~ U07.31 (Analog data refresh area: 256 word)
Z Z000~Z127 (128 Word)
N N0000~N3935 (3936 Word)
Total program 128 -
Initial task 1 (_INT)
Cyclic task Max. 8
I/O task Max. 8
Internal device task Max. 8
Operation mode RUN, STOP, DEBUG
Self-diagnosis function Detects errors of scan time, memory, I/O and power supply
Program port RS-232C (Loader)
Back-up method Latch area setting in basic parameter
Internal consumption current 400 mA 250 mA 280 mA
Weight 140 g 100 g 110 g

Chapter 4 CPU Specifications
4-2
The following table shows the general specifications of the XGB compact type CPU (XBC-DR32/64H,
XBC-DN32/DN64).

Items Specifications (“H” type) Remark
XBC-DN32H
(/DC)
XBC-DR32H
(/DC)
XBC-DN64H
(/DC)
XBC-DR64H
(/DC)
XBC
DR32HL
Program control method Cyclic execution of stored program, Time-driven interrupt,
Process-driven interrupt
-
I/O control method Batch processing by simultaneous scan (Refresh method),
Directed by program instruction
Program language Ladder Diagram, Instruction List
Number of
instructions
Basic 28
Application 687
Processing speed
(Basic instruction)
0.12 /Step
Program capacity 15 Kstep 30kstep
Max. I/O points 352 point (Main + Expansion 10
stages)
384 point (Main + Expansion 10
stages)
352 point
Data area P P0000 ~ P1023F (16,384 point)
M M0000 ~ M1023F (16,384 point)
K K0000 ~ K4095F (65,536 point)
L L0000 ~ L2047F (32,768 point)
F F0000 ~ F1023F (16,384 point)
T 100ms, 10ms, 1ms : T0000 ~ T1023 (1,024 point)
(Adjustable by parameter setting)
C C0000 ~ C1023 (1,024)
S S00.00 ~ S127.99
D D0000 ~ D10239 (10,240 word) Word
U U00.00 ~ U0A.31 (Analog data refresh area: 352 word)
Z Z000~Z127 (128 Word)
N N0000~N5119 (5,120 Word)
R R0000~R10239 (10,240 Word)
Total program 128 -
Initial task 1 (_INT)
Cyclic task Max. 8
I/O task Max. 8
Internal device task Max. 8
Operation mode RUN, STOP, DEBUG
Self-diagnosis function Detects errors of scan time, memory, I/O and power supply
Program port RS-232C 1 channel, USB 1 channel (USB 1.1 supported)
Back-up method Latch area setting in basic parameter
Internal consumption current 260 mA 660 mA 330 mA 1,040
A
660 mA
Weight 500 g 600 g 800 g 900 g 600 g

Chapter 4 CPU Specifications
4-3

Items Specifications Remark
“S” type “H” type
Built-in function PID control function Controlled by instructions, Auto-tuning, PWM output, Manual
output, Adjustable operation scan time, Anti Windup, Delta MV
function, SV-Ramp function
-
Cnet I/F function Dedicated protocol support
MODBUS protocol support RS-232C 1 port
User defined protocol support RS-485 1 port
High-speed counter Capacity 1 phase: 20 kHz 4 channel
2 phase: 10 kHz 2 channel
1 phase: 100 kHz 4 channel,
20kHz 4 channel
2 phase: 50 kHz 2 channel, 10kHz
2 channel
Counter
mode
4 different counter modes according to input pulse and
addition/subtraction method
1 phase pulse input: addition/subtraction counter
1 phase pulse input: addition/subtraction counter by B
phase
2 phase pulse input: addition/subtraction counter
2 phase pulse input: addition/subtraction by
phase differences
Additional
function
Internal/External preset function
Latch counter function
Comparison output function
Revolution number per unit time function
Positioning function Basic function No. of control axis: 2 axes
Control method: position/speed
control
Control unit: pulse
Positioning data: 30 data/axis
(operation step No. 1~30)
Operation mode: End/Keep/
Continuous
Operation method: Single,
Repeated operation
No. of control axis: 2 axes
Control method: position/speed
control
Control unit: pulse
Positioning data: 80 data/axis
(operation step No. 1~80)
Operation mode:
End/Keep/Continuous
Operation method: Single,
Repeated operation
TR output
type support
Positioning
function
Positioning method: Absolute / Incremental
Address range: -2,147,483,648 ~ 2,147,483,647
Speed: Max. 100Kpps(setting range 1 ~ 100,000pps)
Acceleration / Deceleration method : trapezoidal method
Return to Origin Origin detection when approximate origin turns off
Origin detection when approximate origin turns on
Origin detection by approximate origin.
JOG operation Setting range: 1~100,000 ( High / Low speed)
Additional
function
Inching operation, Speed synchronizing operation,
Position synchronizing operation, linear interpolation
operation etc.
Pulse catch 50
8 point (P0000 ~ P0007)
10 4 point
(P0000 ~ P0003)
50
4 point
(P0004 ~ P0007)
-
External interrupt 8 point: 50
(P0000 ~ P0007)
10 4 point
(P0000 ~ P0003)
50
4 point
(P0004 ~ P0007)
Input filter Select among 1,3,5,10,20,70,100 (Adjustable)

Chapter 4 CPU Specifications
4-4

4.2 Names of Part and Function

 

“S” Type
No. Name Description
Input indicator LED Input indicator LED
PADT connecting
connector
PADT connecting connector
Input connector and
terminal block
Input connector and terminal block
Output connector and
terminal block
Output connector and terminal block
Key switch RUN / STOP Key switch
In case of STOP mode, Remote mode changeable.
Output indicator LED Output indicator LED
Status indicator LED It indicates CPU module’s status.
PWR(Red): Power status
RUN(Green): RUN status
STOP mode: Off/ RUN mode : On
Error(Red): In case of error, it is flickering.

 



⑤ ④





8-1
8-2
8-3

① ②

⑦ ⑥
XBM-DN16S
XBM-DN32S XBM-DR16S

Chapter 4 CPU Specifications
4-5

No. Name Description
8-1 Built-in RS-485
connecting
connector
Built-in RS-485 connecting connector
- “+” , “-“ terminal connecting connector in RS-485 communication
8-2 Built-inRS-232C
connecting
connector
Built-in RS-232C connecting connector
- “TxD” , “RxD“ , “GND” terminal connecting connector in RS-232C
communication
8-3 Power supply
connector
Power supply connector (24V)

 

“H” Type
No. Name Description
Input indicator LED Input indicator LED
PADT connecting
connector
PADT connecting USB (USB 1.1 supported) 1 channel,
RS-232C 1 channel connector
Input connector and
terminal block
Input connector and terminal block
Output connector and
terminal block
Output connector and terminal block
Key switch RUN / STOP Key switch
In case of STOP mode, Remote mode changeable.
Output indicator LED Output indicator LED
Status indicator LED It indicates CPU module’s status.
PWR(Red): Power status
RUN(Green): RUN status
STOP mode: Off/ RUN mode : On
Error(Red): In case of error, it is flickering.
8-1 Built-in RS-232C
/ RS-485
Connecting
connector
Built-in RS-485 connecting connector
“+” , “-“ terminal connecting connector in RS-485 communication
Built-in RS-232C connecting connector
“TxD” , “RxD“ , “GND” connecting connector in RS-232C
8-2 Power supply
connector
AC100~240V power supply connector
Battery holder Battery (3V) holder
Mode switch Program mode and O/S download mode select switch

 







8-1
8-2

Chapter 4 CPU Specifications
4-6

4.3 Power Supply Specifications

It describes the power supply specification of main unit.

Items Specification (“S” type)
Input Rated voltage DC24V
Input voltage range DC20.4~28.8V (-15%, +20%)
Inrush current 70APeak or less
Input current 1A (Typ.550 )
Efficiency 60% or more
Permitted momentary
power failure
Less than 10
Output Output voltage DC5V (±2%)
Output current 1.5 A
Power supply status indication LED On when power supply is normal
Cable specification 0.75 ~ 2 mm2

 

Items Specification ( “H” type)
XBC
DR32H(/HL),
XBC-DN32H
XBC-DR64H,
XBC-DN64H
XBC-DR32H/DC,
XBC-DN32H/DC
XBC-DR64H/DC,
XBC-DN64H/DC
Input Rated voltage
(UL warranty voltage)
AC 100 ~ 240 V DC 24V
Input voltage range AC85~264V(-15%, +10%) DC19.2~28.8V(-20%, +20%)
Inrush current 50APeak or less
Input current AC 220V : 0.5A or less,
AC 110V : 1A or less
0.7A or less 1A or less
Efficiency 65% or more
Permitted momentary
power failure
Less than 10
Output Rated
output
DC5V 2A 3A 2A 3A
DC24V 0.4A 0.6A - -
Output voltage ripple DC5V (±2%)
Power supply status indication LED On when power supply is normal
Cable specification 0.75 ~ 2 mm2

* Use the power supply which has 4 A or more fuse for protecting power supply.
Chapter 4 CPU Specifications
4-7
1) Consumption current (DC 5V)

Item Model Current consumption
Main unit XBM-DR16S 400
XBM-DN16S 250
XBM-DN32S 280
XBC-DR32H(/HL) 660
XBC-DR64H 1,040
XBC-DN32H 260
XBC-DN64H 330
XBC-DR32H/DC 660
XBC-DR64H/DC 1,040
XBC-DN32H/DC 260
XBC-DN64H/DC 330
Expansion I/O module XBE-DC32A 50
XBE-DC16A 30
XBE-DC08A 20
XBE-RY16A 440
XBE-RY08A 240
XBE-TN32A 80
XBE-TN16A 50
XBE-TN08A 40
XBE-TP32A 80
XBE-TP16A 50
XBE-TP08A 40
XBE-DR16A 250
Expansion special module XBF-AD04A 120
XBF-DV04A 110
XBF-DC04A 110
XBF-RD04A 100
XBF-RD01A 100
XBF-TC04S 100
Expansion communication
module
XBL-C21A 110
XBL-C41A 110
XBL-EMTA 190

Chapter 4 CPU Specifications
4-8

4.4 Calculation Example of Consumption Current/Voltage

Calculate the consumption current and configure the system not to exceed the output current capacity of
basic unit.
(1) XGB PLC configuration example 1
Consumption of current/voltage is calculated as follows.

Type Model Unit No. Internal 5V
consumption
current
(Unit : )
Remark
Main unit XBM-DN16S 1 250 In case contact points are On.
(Maximum consumption current)
Expansion
module
XBE-DC32A 2 50
XBE-TN32A 2 80
XBF-AD04A 1 120 All channel is used.
(Maximum consumption current)
XBF-DC04A 1 110
XBL-C21A 1 110
Consumption
current
830 -
Consumption
voltage
4.25 W 0.85 * 5V = 4.25W

In case system is configured as above, since 5V consumption current is total 850mA and 5V output of XGB
standard type main unit is maximum 1.5A, normal system configuration is available.
(2) XGB PLC configuration example 2

Type Model Unit No. Internal 5V
consumption
current
(Unit : )
Remark
Main unit XBM-DR16S 1 400 In case all contact points are On.
(Maximum consumption current)
Expansion
module
XBE-DR16A 3 250
XBE-TN32A 2 80
XBF-AD04A 1 120 All channel is used.
(Maximum consumption current)
XBL-C21A 1 110
Consumption
current
1,540 -
Consumption
voltage
7.7W 1.54 * 5V = 7.7W

If system is configured as above, total 5V current consumption is exceeded 1,540 mA and it exceeds the 5V
output of XGB standard type main unit. Normal system configuration is not available. Although we assume
the above example that all contact points are on, please use high-end type main unit which 5V output
capacity is higher than standard type main unit.

Chapter 4 CPU Specifications
4-9
(3) XGB PLC configuration example 3

Type Model Unit No. Internal 5V
consumption
current
(Unit : )
Remark
Main unit XBC-DR32H 1 660 In case of all contact points are
On.
(Maximum consumption current)
Expansion
module
XBE-DR16A 3 250
XBE-TN32A 2 80
XBF-AD04A 1 120 All channel is used.
(Maximum consumption current)
XBL-C21A 1 110
Consumption
current
1,800 -
Consumption
voltage
9W 1.8 * 5V = 9W

The above system is an example using XBC-DR32H about system example (2). Unlike (2) example, 5V
output capacity of XBC-DR32H is maximum 2A, normal configuration is available.

Remark
Calculating of consumption current is based on maximum consumption current. In application system,
the consumption current is consumed less than above calculation.

Chapter 4 CPU Specifications
4-10
4.5 Battery
This contents is only applied to “H” type.
4.5.1 Battery specification

Item Specification
Voltage/Current DC 3V / 220 mA
Warranty period 3 years (ambient temp.)
Purpose Program and data backup,
RTC operation in case of power failure
Specification Manganese Dioxide lithium battery
Dimension (mm) φ 20 X 3.2 mm

4.5.2 Notice in using
(1) Do not heat the battery or solder the polarity. ( It may cause the reduction of life.)
(2) Do not measure the voltage or short with tester. (It may cause the fire.)
(3) Do not disassemble the battery.
4.5.3 Life of battery
Life of battery depends on the power failure time and ambient temperature etc..
If battery is getting low, main unit cause the warning, ‘battery voltage low warning’. The user can check it
by error LED, flag and error message of XG5000.
Since battery works properly for long time, after battery voltage low warning, so the user can take the
action after battery voltage low warning occurred.

Chapter 4 CPU Specifications
4-11
4.5.4 How to change the battery
The user should change the battery used to save the program and backup the data in case of power
failure periodically. Though the user eliminate the battery, it works for 30 minute by super capacitor.
Change the battery as fast as possible.
Sequence changing battery is as follows.
4.6 Data back-up method
This contents is only applied to XBM series. Capacitor in PLC back-ups data

Model Back-up time notes
XBM-DR16S
XBM-DN16/32S
10 days Normal temperature(25)

 

Remark
(1) Charge the Capacitor with power On over 30minutes
(2) If back-up problem occurs when turning on the power within standard back-up time, take A/S
service
(3) Data Back-up time would be changed by temperature and etc.
(If the temperature is high, Data back-up time would be reduced.)

 

Start of battery change

 

Open battery cover
Insert new battery and connect to
connector with proper direction
ERR LED off?
No
Battery malfunction

Pick up using battery from holder and
disassemble the connector
Check the LED whether ERR LED is off
Yes
Complete
Chapter 5 Program Configuration and Operation Method
5-1
Chapter 5 Program Configuration and Operation Method

5.1 Program Instruction

5.1.1 Program execution methods
1) Cyclic operation method (Scan)
This is a basic program proceeding method of PLC that performs the operation repeatedly for the prepared
program from the beginning to the last step, which is called „program scan‟. The series of processing like
this is called „cyclic operation method‟. The processing is divided per stage as below.

Stage Processing description
-
A stage to start the scan processing which is executed once
when power is applied or Reset is executed, as below.
Self-diagnosis execution
Data clear
Address allocation of I/O module and type register
If initializing task is designated, Initializing program is executed.
Reads the state of input module and saves it in input image
area before starting the operation of program.
Performs the operation in order from the program start to last
step.
Performs the operation in order from the program start to last step.
A processing stage to return to the first step after CPU module
completes 1 scan processing and the processing performed is as
below.
Update the current value of timer and counter etc.
User event, data trace service
Self-diagnosis
High speed link, P2P e-Service
Check the state of key switch for mode setting

 

Start
m
m

Initialization processing
Input image area refresh
Program operation processing
Prograstart
Progralast step
Output image area refresh
END

Chapter 5 Program Configuration and Operation Method
5-2
2) Interrupt operation (Cycle time, Internal device)
This is the method that stops the program operation in proceeding temporarily and carries out the
operation processing which corresponds to interrupt program immediately in case that there occurs the
status to process emergently during PLC program execution.
The signal to inform this kind of urgent status to CPU module is called „interrupt signal‟. There is a Cycle
time signal that operates program every appointed time and external interrupt signal that operates program
by external contact (I/O; P000~P007). Besides, there is an internal device start program that starts
according to the state change of device assigned inside.
3) Constant Scan (Fixed Period)
This is the operation method that performs the scan program every appointed time. This stands by for a
while after performing all the scan program, and starts again the program scan when it reaches to the
appointed time. The difference from constant program is the update of input/output and the thing to
perform with synchronization.
At constant operation, the scan time indicates the net program processing time where the standby time is
deducted. In case that scan time is bigger than „constant‟, [F0005C] „_CONSTANT_ER‟ flag shall be „ON‟.
5.1.2 Operation processing during momentary power failure
CPU module detects the momentary power failure when input power voltage supplied to power module is
lower than the standard. If CPU module detects the momentary power failure , it carries out the operation
processing as follows.
If momentary power failure within 10 ms is occurred, main unit (CPU) keeps the operation. But, if
momentary power failure above 10
, the operation is stop and the output is Off. Restart processing
like at power input shall be performed.
1) Momentary power failure within 10 ms
2) Momentary power failure exceeding 10 ms

Remark
1) Momentary power failure?
This means the state that the voltage of supply power at power condition designated by PLC is
lowered as it exceeds the allowable variable range and the short time (some ms ~ some dozens ms)
interruption is called „momentary power failure‟ ).

CPU keeps the operation.
Restart processing like at power input shall
be performed.
Input power
Within 10 ms momentary
power failure
Momentary power failure exceeding 20ms
momentary power failure exceed
Input power

Chapter 5 Program Configuration and Operation Method
5-3
5.1.3 Scan time
The processing time from program step 0 to the next step 0 is called „Scan Time‟.
1) Scan time calculation expression
Scan time is the sum of the processing time of scan program and interrupt program prepared by the user
and PLC internal time, and is distinguished by the following formula.
(1) Scan time = Scan program processing time
Interrupt program processing time PLC internal
processing time
Scan program processing time = processing time of user program not saved as interrupt program
Interrupt program processing time = Sum of interrupt program proceeding time processed during 1 scan
PLC internal processing time = Self-diagnosis time I/O refresh time Internal data processing time
Communication service processing time
(2) Scan time depends on whether to execute interrupt program and communication processing.
2) Scan time monitor
(1) Scan time can be monitored
Online-PLC Information-Performance.
(2) Scan time is save in special relay (F) area as follows.
F0050: max. value of scan time (unit: 0.1 ms)
F0051: min. value of scan time (unit: 0.1 ms)
F0052: current value of scan time (unit: 0.1 ms)
Chapter 5 Program Configuration and Operation Method
5-4
5.1.4 Scan Watchdog timer
WDT (Watchdog Timer) is the function to detect the program congestion by the error of hardware and software of
PLC CPU module.
1) WDT is the timer used to detect the operation delay by user program error. The detection time of WDT
is set in Basic parameter of XG5000.
2) If WDT detects the excess of detection setting time while watching the elapsed time of scan during
operation, it stops the operation of PLC immediately and keeps or clears the output according to
parameter setting
3) If the excess of Scan Watchdog Time is expected in the program processing of specific part while
performing the user program (FOR ~ NEXT instruction, CALL instruction), clear the timer by using „WDT‟
instruction.
„WDT‟ instruction initializes the elapsed time of Scan Watchdog Timer and starts the time measurement
from 0 again.
(For further information of WDT instruction, please refer to Instruction.)
4) To clear the error state of watchdog, we can use the following method : power re-supply, manipulation
of manual reset switch, mode conversion to STOP mode.

Remark
1) The setting range of Watchdog Timer is 10 ~ 1000ms (Unit: 1ms).

WDT instruction
execution

0 1 2 3 ….. …8 9 0 1 2 …
0 1 2 … …6 7
0 1 2 …

WDT Reset SCAN END
WDT
count(ms) SCAN END

Chapter 5 Program Configuration and Operation Method
5-5
5.1.5 Timer processing
The XGB series use up count timer. There are 5 timer instructions such as on-delay (TON), off-delay (TOFF),
integral (TMR), monostable (TMON), and re-triggerable (TRTG) timer.
The measuring range of 100msec timer is 0.1 ~ 6553.5 seconds, 10msec timer is 0.01 ~ 655.35 seconds,
and that of 1msec timer is 0.001 ~ 65.53 seconds. Please refer to the „XG5000 User manual‟ for details.
1) On delay timer
The current value of timer starts to increase from 0 when the input condition of TON instruction turns on.
When the current value reaches the preset value (Current value=Preset value), the timer output relay
(Txxxx) turns on. When the timer input condition is turned off, the current value becomes 0 and the timer
output relay is turned off.
2) Off delay timer
The current value of timer set as preset value and the timer output relay is turned on when the input
condition of TOFF instruction turns on. When the input condition is turned off, the current value starts to
decrease. The timer output relay is turned off when the current value reaches 0.
Preset value
Timer output relay
Timer type
Preset value (PV)

t1+ 0 2
PT
t
t
t 1 t 3 5
0 t 2 t t

t4
t5+PT
t1
t2 t5
Input condition
Output relay
Preset value
Current value
t0

t0 t1 t4 t5
+PT PT
t0 t1 t3 t4 t5
t2

t0 t1 t2 t3 t4 t5
Input condition
Output relay
Preset value
Current value

Chapter 5 Program Configuration and Operation Method
5-6
3) Integral timer
In general, its operation is same as on-delay timer. Only the difference is the current value will not be clear
when the input condition of TMR instruction is turned off. It keeps the elapsed value and restart to
increase when the input condition is turned on again. When the current value reaches preset value, the
timer output relay is turned on.
The current value can be cleared by the RST instruction only.
4)
Monostable timer
In general, its operation is same as off-delay timer. However, the change of input condition is ignored
while the timer is operating (decreasing). When current value reaches preset value the timer output relay
is turned off and current value is cleared.
Timer input
condition
Timer output relay
Preset value
Current value
Timer reset input

t 1 t t 4
0 t 2
t
5
t0 t1 t2 t3 t5 t5+PT
PT = (t1-t0)+(t3 -t2)

t0 t1 t2 t4
Timer input
condition
Timer output relay
Preset value
Current value

t
t
0 t1 t
2
2 t3 t
4
4
t4+PT

0 t0+PT tt2+PT t
Chapter 5 Program Configuration and Operation Method
5-7
5) Retriggerable timer
The operation of retriggerable timer is same as that of monostable timer. Only difference is that the
retriggerable timer is not ignore the input condition of TRTG instruction while the timer is operating
(decreasing). The current value of retriggerable timer will be set as preset value whenever the input
condition of TRTG instruction is turned on.

Remark
The Maximum timing error of timers of XGB series is „1 scan time + the time from 0 step to
timer instruction‟

 

t0
t0+PT
t3
Timer input condition
Timer output relay
Preset value (PV)
Current value

t2 t3
t2
(ET)
Chapter 5 Program Configuration and Operation Method
5-8
5.1.6 Counter processing
The counter counts the rising edges of pulses driving its input signal and counts once only when the input
signal is switched from off to on. XGB series have 4 counter instructions such as CTU, CTD, CTUD, and
CTR. The followings shows brief information for counter operation. Refer to the „XGB Instruction Manual‟ for
details.
Up counter increases the current value.
Down counter decreases the current value.
Up/Down counter compares the input value from both counters input.
Ring counter increase the current value and the current value is cleared as 0 when the current value
reaches the preset value.
1) Renewal of counter‟s current value and contact On/Off
(1) Up counter
Up counter increases the current value at the rising edges of input.
The counter output contact (Cxxx) is turned On when the current value reaches the preset value.
When the reset input is turned On, the counter output contact (Cxxx) is turned Off.
(2) Down counter
Down counter decreases the current value at the rising edges of input.
The counter output contact (Cxxx) is turned On when the current value reaches the preset value.
When the reset input is turned On, the counter output contact (Cxxx) is turned Off.
(3) Up/Down counter
The current value is increased with the rising edge of up-count input signal, and decreased with the
rising edge of down-count input signal. The counter output contact (Cxxx) is turned On when the
current value is same as or more than current value. The counter output contact (Cxxx) is turned Off
when the current value is same as or less than current value.
When the reset input is turned On, the current value is cleared as 0.
Chapter 5 Program Configuration and Operation Method
5-9
(4) Ring counter
The current value is increased with the rising edge of the counter input signal, and the counter output
contact (Cxxx) is turned on when the current value reaches the preset value. Then the current value and
counter output contact (Cxxx) is cleared as 0 when the next rising edge of the counter input signal is
applied.
When the reset input is turned On, the counter output contact is cleared as 0.
2) Maximum counting speed
The maximum counting speed of determined by the length of scan time. Counting is possible only when
the on/off switching time of the counter input signal is longer than scan time.
Duty is the ratio of the input signal‟s on time to off time as a percentage.

Remark
1) Use of High Speed Counter
In order to counter pulse that is faster than maximum counting speed of normal counter, use
built-in High Speed counter function.

Maximum counting speed )
t
1
(
100
n
C
S
max
  n : duty (%)
tS : scan time [s]
On

Off Off T1
T2

 

If T1 T2, n = x 100 [%]
T1+T2

If T1 > T2, n = x 100 [%]
T1

Chapter 5 Program Configuration and Operation Method
5-10

5.2 Program Execution

5.2.1 Configuration of program
All functional elements need to execute a certain control process are called as a „program‟. Program is stored in
the built-in RAM mounted on a CPU module or flash memory of a external memory module. The following table
shows the classification of the program.

Program type Description
Initializing program It will be executed till the specific Flag „INIT_DONE‟ is On. And while the
initialization task is executed, several of initializing program is
programmed. (If INIT_DONE instruction is executed, scan program is
executed.)
Scan program The scan program is executed regularly in every scan.
Cycle time interrupt
program
The program is performed according to the fixed time interval in case that the
required processing time condition is as below.
In case that the faster processing than 1 scan average processing time is
required
In case that the longer time interval than 1 scan average processing time is
required
In case that program is processed with the appointed time interval
External interrupt
program
The external interrupt program is performed process on external interrupt
signal.
Subroutine
program
Only when some condition is satisfied.(in case that input condition of CALL
instruction is On)

5.2.2 Program execution methods
Here describes the program proceeding method that is executed when the power is applied or key switch is „RUN‟.
The program performs the operation processing according to the configuration as below.
Start processing

Scan pro
gram
END processing
Initializing program

 

Subroutine program
ernal interrupt program
Ext
Cycle time program

Only when some
condition is satisfied.
It executes up to execution of INIT_DONE instruction when initializing program is designated.
Chapter 5 Program Configuration and Operation Method
5-11
1) Scan program
(1) Function
This program performs the operation repeatedly from 0 step to last step in order prepared by the program
to process the signal that is repeatedly regularly every scan.
In case that the execution condition of interrupt by task interrupt or interrupt module while executing
program is established, stop the current program in execution and perform the related interrupt program.
2) Interrupt program
(1) Function
This program stops the operation of scan program and then processes the related function in prior to
process the internal/external signal occurred periodically/non-periodically.
(2) Type
Task program is divided as below.
Cycle time task program: available to use up to 8.
Internal device task program: available to use up to 8.
I/O (External contact task program): available to use up to 8. (P000 ~ P007)
Cycle time task program
Performs the program according to the fixed time internal.
Internal device task program
Performs the corresponding program when the start condition of internal device occurs.
The start condition detection of device shall be performed after processing of scan program.
I/O (External contact task program)
Performs the program according to the input external signal (P000~P007).

Remark
(1) Write the interrupt program as shortly as possible. In case same interrupt occurs repeatedly
before completion of interrupt, program is not executed and O/S watch dog error may occur.
(2) Though interrupt which has lower priority occurs many times during execution of interrupt
which has higher priority, interrupt which has lower priority occurs only one time.

Chapter 5 Program Configuration and Operation Method
5-12
5.2.3 Interrupt
For your understanding of Interrupt function, here describes program setting method of XG5000 which is an XGB
programming S/W. Example of interrupt setting is as shown bellows.
Interrupt setting

Interrupt source Interrupt name priority Task No. Program
Initializing Interrupt 0_ - - -
Cycle time 1 Interrupt 1_cycle time 2 0 Cycle time 1
External Interrupt 2_external 2 8 External
Internal device Interrupt 3_internal 3 14 Internal
Cycle time 2 Interrupt 4_cycle time 3 1 Cycle time 2

 

Remark
In case that several tasks to be executed are waiting, execute from the highest Task Program in
priority. When the same priority tasks are waiting, execute from the order occurred.
While interrupt executing, if the highest interrupt is occurred, the highest interrupt is executed earliest of
all.
When power On, All interrupts are in the state „Disable‟
Internal device interrupt is executed after END instruction.

Initializing
(Before INIT_DONE instruction)
Interrupt 1_Cycle time Cycle time 1 execution
occur
Cycle time 1/
external occur
simultaneously
Cycle time 1 execution
External I/O execution
Internal device
Interrupt occur
Internal device interrupt
execution
Cycle time 1
execution
Timed-driven 1
execution
Cycle time 2
occur
Cycle time 2 execution
END
Scan program
Chapter 5 Program Configuration and Operation Method
5-13
1) How to prepare interrupt program
Generate the task in the project window of XG5000 as below and add the program to be performed by each
task. For further information, please refer to XG5000 user‟s manual.
(It can be additional when XG5000 is not connected with PLC.)
Click right button of mouse on project name and click Add item-Task.
The screen of Task setting is shown. Click Initializationin Execution condition and make a Task name.
Chapter 5 Program Configuration and Operation Method
5-14
Click right button of mouse at registered task and selectAdd Item-Program.
Make initializing program. In initializing program, INIT_DONE instruction must be made. If not, Scan
program is not executed.

Chapter 5 Program Configuration and Operation Method
5-15
2) How to prepare Cycle interrupt program
Generate the task in the project window of XG5000 as below and add the program to be performed by each
task. For further information, please refer to XG5000 user‟s manual.
(It can be additional when XG5000 is not connected with PLC)
Click right button of mouse at registered task and selectAdd Item-Program.
It shows setting screen of Task.
Chapter 5 Program Configuration and Operation Method
5-16
Task type

Classification Description Remark
Task name Make Task name. Character, number
available
Priority Set the priority of task. (2~7) “2” is the highest
priority number.
Task number Set the Task number.
Cycle time task (0 ~ 7): 8
External I/O task (8 ~ 15): 8
Internal device task (16 ~ 23): 8
-
Execution
condition
Initialization Set the initial program when running the project. Till the execution of
INIT_DONE
instruction
Cycle time Set the cyclic interrupt. 0~4294967295
available
I/O Set the external I/O. P000 ~ P007
available
Internal
device
Set the internal device to interrupt execution.
Bit: Among Rising, Falling, Transition, On, Off
Word: Among >,>=,<,<=
-

Click right button of mouse at registered task and selectAdd Item-Program.
Chapter 5 Program Configuration and Operation Method
5-17
Register the Program name and Program description.
It is displayed the program window to write task program.
It is displayed the setting in project window.
Chapter 5 Program Configuration and Operation Method
5-18
3) Task type
Task type and function is as follows.

Type
Spec.
Cycle time task
(Interval task)
I/O task
(Interrupt task)
Internal device task
(Single task)
Max. Task
number
8 8 8
Start condition Cyclic
(setting up to max.
4,294,967.295 sec. by
1ms unit)
Rising or falling edge of
main unit‟s contact P000
~P007
Internal device
execution condition
Detection and
execution
Cyclic execution per
setting time
Immediate execution at
the edge of main unit‟s
contact
Retrieve the condition
and execute after
completing Scan
Program
Detection delay
time
Max. 1 ms delay Max. 0.05 ms delay Delay as much as max. scan time
Execution
priority
2~7 level setting
(2 level is highest in
priority)
2~7 level setting
(2 level is highest in
priority)
2~7 level setting
(2 level is highest in
priority)
Task no. Within 0~7 range
without user
duplication
With 8~15 range without
user duplication
Within 16~23 range
without user duplication

4) Processing methods of task program
Here describes common processing method and notices for Task program.
(1) Feature of task program
Task Program is executed only when execution condition occurs without every scan repeat processing.
When preparing Task Program, please consider this point.
For example, if a timer and counter were used in cyclic task program of 10 second cycle, this timer
occurs the tolerance of max. 10 seconds and the counter and the timer and as the counter checks the
input status of counter per 10 seconds, the input changed within 10 seconds is not counted up.
(2) Execution priority
In case that several tasks to be executed are waiting, execute from the highest Task Program in priority.
When the same priority tasks are waiting, execute from the order occurred.
In case Cycle time task and external I/O task is occurred concurrently, execute from the highest task
program. (In sequence of XG5000 setting)
The task program priority should be set considering the program features, importance and the
emergency when the execution requested.
(3) Processing delay time
There are some causes for Task Program processing delay as below. Please consider this when task
setting or program preparation.
Task detection delay (Refer to detailed description of each task.)
Program proceeding delay caused by Priority Task Program proceeding
(4) Relationship of initialize, Scan Program and Task Program
ser identification task does not start while performing Initialization Task Program.
As Scan Program is set as lowest priority, if task occurs, stop Scan Program and process Task Program
in advance. Accordingly, if task occurs frequently during 1 scan or concentrates intermittently, scan time
may extend abnormally. Cares should be taken in case of task condition setting.

Chapter 5 Program Configuration and Operation Method
5-19
(5) Protection of Program in execution from Task Program
In case that the continuity of program execution is interrupted by high priority Task Program during
program execution, it is available to prohibit the execution of Task Program partially for the part in
problem. In this case, it is available to perform the program protection by „ DI (Task Program Start
Disabled) and „EI (Task Program Start Enabled)‟ application instruction.
Insert „DI‟ application instruction in the start position of the part requiring the protection and insert „EI‟
application instruction in the position to release. Initialization Task is not influenced by „DI‟, „EI‟ application
instruction.
If interrupt is occurred while „CALLP‟ instruction executing, interrupt program is executed after „CALLP‟
instruction execution.
5) Cyclic task program processing method
Here describes the processing method in case that task (start condition) of Task program is set as Cycle
time.
(1) Items to be set in Task
Set the execution cycle and priority which are the start condition o f Task program to execution. Check
the task no. to manage the task.
(2) Cyclic task processing
Performance the corresponding cyclic task program per setting time interval (execution cycle).
(3) Notice in using cyclic task program
When cyclic task program is in execution currently or waiting for execution, if the demand to execute the
same task program occurs, the new occurred task shall be disregarded.
Timer that makes a demand to execute cyclic task program only while operation mode is Run mode,
shall be added. The shutdown time shall be all disregarded.
When setting the execution cycle of cyclic task program, consider the possibility that the demand to
execute several cyclic task program at the same time occurs.
If 4 cyclic task programs that the cycle is 2sec, 4sec, 10sec and 20sec are used, 4 demands of
execution per 20 seconds shall be occurred at the same time and scan time may extend
instantaneously.

Chapter 5 Program Configuration and Operation Method
5-20
6) I/O task program processing
It described the I/O task program processing. (P000 ~ P007)
(1) Items to be set in Task
Set the execution condition and priority to the task being executed. Check the task no. to manage the
task.
(2) I/O task processing
If interrupt signal from external signal (I/O) is occurred on main unit (P000 ~ P007), task program is
executed by external (I/O) signal.
(3) Precaution in using I/O task program
If task program which is executed by interrupt signal is on execution or standby status, new task program
which is requested by identical I/O is ignored.
Only operation mode is Run mode, execution request of task program is recognized. Namely, execution
request of task program is ignored when operation mode is Stop mode.

Chapter 5 Program Configuration and Operation Method
5-21
7) Internal device task program processing
Here describes the processing method of international device task program which extended the task (start
condition) of task program from contact point to device as execution range.
(1) Items to be set in Task
Set the execution condition and priority to the task being executed. Check the task no. for task
management.
(2) Internal device task processing
After completing the scan program execution in CPU module, if the condition that becomes the start
condition of internal device task program is met, according to the priority, it shall be executed.
(3) Precautions in using internal device task program
Accordingly, even if the execution condition of internal device task program occurs in Scan Program
or Task Program (Cycle time, I/O), it shall not be executed immediately but executed at the time of
completion of Scan Program.
If the demand to execute Internal Device Task Program occurs, the execution condition shall be
examined at the time of completion of Scan Program. Accordingly, if the execution condition of Internal
Device Task occurs by Scan Program or Task Program (Cycle time) during „1 scan‟ and disappears, the
task shall not be executed as it is not possible to detect the execution at the time of examination of
execution condition.

Chapter 5 Program Configuration and Operation Method
5-22
8) Verification of task program
(1) Is the task setting proper?
If task occurs frequently more than needed or several tasks occur in one scan at the same time, scan time
may lengthen or be irregular. In case not possible to change the task setting, verify max. scan time.
(2) Is the priority of task arranged well?
The low priority task program shall be delayed by the high priority task program, which results in disabling
the processing within the correct time and even task collision may occur as next task occurs in the state
that the execution of previous task is delayed. Consider the emergency of task and execution time etc
when setting the priority.
(3) Is the Task Program written in shortest?
If the execution time of Task Program is longer, scan time may lengthen or be irregular. Even it may cause
the collision of task program. Write the execution time as short as possible. (Especially, when writing the
cyclic task program, write the execution time so that the task program can be executed within 10% cycle
of the shortest task among several tasks.)
(4) Is program protection for the high priority task needed during program execution?
If other task is inserted during task program execution, complete the task in execution and operate the
standby tasks in the order of high priority. In case that it is not allowed to insert other task in Scan
Program, prevent the insert partially by using „DI‟ and „EI‟ application instruction. The problem may occur
while processing the global variables used commonly with other program or special or communication
module.
9) Program configuration and processing example
If task and program are registered as below.

Interrupt type Interrupt name Priority Task No. Program
Cycle time 10 _cycle time 3 0 Program 1
Internal device Internal device_M00 5 16 Program 2
I/O I/O_P00 2 8 Program 3

Scan program name: “ Scan Program”
Execution time respective program: Scan program = 17 , Program 1 = 2 , Program 2= 7 ,
Program 3 = 2

Chapter 5 Program Configuration and Operation Method
5-23

Process per time
Time () Process
0 Scan started and scan program started to execute.
0~6 Scan program is executed.
6~8 Scan program is stop because execution external I/O (P000) is requested. And program
3 is executed. Request of execution at 7[ms] is ignored because program 3 has been
executing.
8~10 Program 3 is finished and Scan program is continued.
10~12 Scan program is stop by request of „10 _Cycle time‟ interrupt signal and execute program
1.
12~20 Program 1 is finished and Scan program is continued.
20 Request of „Cycle time‟ interrupt signal and „External I/O (P000)‟ signal is occurred
concurrently but priority of „External I/O‟ signal is higher than „Cycle time‟ interrupt signal
so program 3 is executed and program 1 is standby.
20~22 Program 3 is finished and Scan program is continued.
22~24 After program 3 is completed, program 1 (the program of „10ms_Cycle time‟ is executed.
24~25 P1 execution completed and the stopped scan program execution finished
25 At the finished point of scan program, check the request of Internal device „M000‟
execution and execute program 2.
25~30 Program P2 is executed.
30~32 When „10 _Cycle time‟ interrupt signal is occurred, the priority of that is higher than Internal
device „M000‟ though program 2 is stopped and program 1 is executed.
32~34 P1 executed completed and the stopped P2 execution finished
34 New scan starts (Start scan program execution)

PO executed
P1 executed
10ms_Cycle time
Program 2
Internal device_M000
Program 3
External I/O_P000
Time
0 6 7 8 10 12 20 22 24 25 30 32 34
Scan started
(Initial operation started) Scan program stopped New scan started

Chapter 5 Program Configuration and Operation Method
5-24

5.3 Operation Mode

For operation mode of CPU module, there are 3 types such as RUN mode, STOP mode and DEBUG mode..
Here describes the operation processing of each operation mode.
5.3.1 RUN mode
This is the mode to executed program operation normally.
1) Processing at mode change
At the beginning, execute initialization of data area and examine the effectiveness of program and judge the
possibility of execution.
2) Operation processing contents
Execute I/O refresh and program operation.
(1) Detects the start condition of Interrupt Program and executes Interrupt Program.
(2) Examines the normal operation or missing of built-in module.
(3) Communication service and other internal processing.
RUN mode first scan start
Initialize data area
Examine Program effectiveness and judge the
possibility of execution
Execute input refresh
Program execute, Interrupt Program execute
Communication service and internal processing
Execute output refresh
Operation
mode change
RUN mode keep
Change to other mode
Operation by changed operation
mode
Examine the normal operation or missing of
built-in module

Chapter 5 Program Configuration and Operation Method
5-25
5.3.2 STOP mode
This is the mode in stop state without Program operation. It is available to transmit the program through XG5000
only in Remote STOP mode.
1) Processing at Mode Change
Clear the output image area and execute output refresh.
2) Operation Processing Contents
(1) Executes I/O refresh.
(2) Examines the normal operation or missing of built-in module.
(3) Communication service or other internal processing.
5.3.3 DEBUG mode
This is the mode to detect Program error or trace the operation process and the conversion to this mode is
available only in STOP mode. This is the mode to check the program execution state and the contents of each
data and verify the program.
1) Processing at mode change
(1) Initializes the data area at the beginning of mode change.
(2) Clears the output image area and execute input refresh.
2) Operation processing contents
(1) Executes I/O refresh.
(2) Debug operation according to setting state.
(3) After finishing Debug operation by the end of Program, execute output refresh.
(4) Examine the normal operation or missing of built-in module.
(5) Executes communication service or other service.
3) Debug operation
It describes debug mode.
Chapter 5 Program Configuration and Operation Method
5-26

Item Description Remark
Start/Stop Debugging Change the debug ↔ stop mode
Go It starts debug operation.
Step Over It operates by 1 step.
Step Into It starts the subroutine program. Other operation is
identical to Step
Over.
Step Out It finished the subroutine program.
Go to Cursor It operates to current cursor position.
Set/Remove Breakpoints Set/Removes current cursor position to break
points.
Breakpoints List It displays list of breakpoints.
Breakpoint Conditions It specifies device value and number of scan.

(1) Set/Remove Breakpoints
▪ Sets breakpoint at current cursor position. After breakpoint setting, (breakpoint setting indicator) is
displayed.
(2) Go
▪ Run the program to breakpoint. At break-pointer (stop indicator) is displayed.

Chapter 5 Program Configuration and Operation Method
5-27
(3) Step Over
▪ Run the program to next step. At break point, Step over indicator is displayed.
(4) Breakpoint List
▪ It displays current Breakpoint List. It supports Select All, Reset All, Goto, Remove, Remove All.
(5) Break condition
▪ It sets Device Break and Scan Break.

Chapter 5 Program Configuration and Operation Method
5-28

Remark
▪ Refer to XG5000 Users Manual „Chapter 12 Debugging‟ for detailed information.

Chapter 5 Program Configuration and Operation Method
5-29
5.3.4 Change operation mode
1) Operation Mode Change Method
The method to change operation mode are as follows.
(1) By mode key of CPU module
(2) By connecting the programming tool (XG5000) to communication port of CPU
(3) By changing the operation mode of other CPU module connected to network by XG5000 connected to
communication port of CPU.
(4) By using XG5000, HMI, computer link module connected to network
(5) By „STOP„ instruction during program execution
2) Type of operation mode
The operation mode setting is as follows.

Operation mode switch XG5000 command Operation mode
RUN X Run
STOP RUN Remote Run
STOP Remote Stop
Debug Debug Run
Mode change Previous operation mode
RUN -> STOP - Stop

(1) Remote mode conversion is available only in the state of „Remote Enabled: On‟, „Mode switch: Stop‟.
(2) In case of changing the Remote „RUN‟ mode to „STOP‟ by switch, operate the switch as follows.
(STOP)
RUN STOP .

Warning
In case of changing Remote RUN mode to RUN mode by switch, PLC operation continues the
operation without interruption.
It is available to modify during RUN in RUN mode by switch but the mode change operation by
XG5000 is limited. This should be set only in case that remote mode change is not allowed.

Chapter 5 Program Configuration and Operation Method
5-30

5.4 Memory

There are two types of memory in CPU module that the user can use. One is Program Memory that saves the
user program written by the user to build the system, and the other is Data Memory that provides the device area
to save the data during operation.
5.4.1 Data memory
1) Bit device area
Various Bit Device are provided per function. The indication method is indicated by device type for first digit,
word position by decimal for middle digit and bit position by hexadecimal for the last digit.

Area per device Device features Description
“S” type “H” type
P0000 ~
P127f
P0000~
P1023f
I/O device “P” Image area to save the state of I/O device.
After reading the input module state, saves it in the
corresponding P area and sends P area Data
saving the operation result to output module.
M0000 ~
M255f
M0000~
M1023f
Internal device “M” Internal Memory provided to save Bit Data in Program
L0000 ~
L1279f
L0000~
L2047f
Communication device
“L”
Device to indicate high speed link/P2P service state
information of communication module.
K00000
~ K2559f
K00000~
K4095f
Preservation device “K” Device area to preserve the data during power
shutdown, which is used without setting power
shutdown preservation parameter separately. (Pay
attention to write in special area (K2600 ~ 2559F)).
F0000 ~
F255f
F0000~
F1023f
Special device “F” System flag area that manages the flag necessary for system operation in PLC.
T0000 ~
T255
T0000~
T1023
Timer device “T” Area to save the state value of timer device of contact/current value/set
C0000 ~
C255
C0000~
C1023
Counter device “C” Area to save the state of contact/current value/set value of counter device
S00.00 ~
S127.99
S00.00~
S127.99
Step controller “S”
128 x 100 step
Relay for step control

Chapter 5 Program Configuration and Operation Method
5-31
2) Word device area

Area per device Device features Description
“S” type “H” type
D00000 ~
D5119
D0000~
D10239
Data register “D” Area to preserve the internal data.
Bit expression possible. (D0000.0)
U00.00 ~
U07.31
U00.00~
U0A.31
Analog data
register “U”
Register used to read data from special module installed
in the slot. Bit expression possible
N0000 ~
N3935
N0000~
N5119
Communication
data register
“N”
P2P Service Save area of communication module.
Bit expression impossible
Z000 ~
Z127
Z000~
Z127
Index register
“Z”
Dedicated device to use Index function
Bit expression impossible
T0000 ~
T255
T0000~
T1023
Timer current value
register “T”
Area to indicate the current value of timer
C0000 ~
C255
C0000~
C1023
Counter current
value register “C”
Area to indicate the current value of counter
- R0000~
R10239
File register “R” Register for saving the file

Chapter 5 Program Configuration and Operation Method
5-32

5.5 Configuration Diagram of Data Memory

5.5.1 “S” type
Bit data area Word data area User Program area
영역

I/O Relay
(2048 points)
“P”
Keep Relay
(40960 points)
“K”
Special Relay
(4096 points)
“F”
Auxiliary Relay
(4096 points)
“M”

Auxiliary Relay
(20480 points) “L”
P000
P127
M000
L0000
M255
K000
K2559
F000
F255

Data Register
(5120 words)
“D”
Comm. Data
Register
(3936 words)
“N”

D0000
D5119

Timer setting value
(256 words)
Timer current value
(256 words)
Counter setting value
(256 words)
Counter current value
(256 words)

T000
T255
T000
T255 C000
C255
C000
C255

Parameter area
User Program area
(10 K step)

 

Timer
(256 points) “T”
Counter
(256 points) “C”

T000
Step controller
(128 x 100 step)
S00.00~S127.99 “S”
S000
S127
0 ~ F 0000 ~ FFFF
C000
C255
N0000
N3935
Index Register
(128 words)
U07.31
Z127 “Z”
Analog Data
Register
(256 words) “U”
U00.00
Z000
L1279
T255

Chapter 5 Program Configuration and Operation Method
5-33
5.5.2 “H” type
Bit data area Word data area

I/O Relay
(2048 points)
“P”
Keep Relay
(40960 points)
“K”
Special Relay
(4096 points)
“F”
Auxiliary Relay
(4096 points)
“M”

Auxiliary Relay
(20480 points) “L”
P0000
P1023
M0000
L0000
M1023
K0000
K4095
F0000
F1023

Data Register
(10240 words)
“D”
Comm. Data
Register
(5120 words)
“N”

D0000
D10239

Parameter area
User Program area
(15 K step)

 

Timer
(256 points) “T”
Counter
(256 points) “C”

T0000
Step controller
(128 x 100 step)
S00.00~S127.99 “S”
S000
S127
0 ~ F 0000 ~ FFFF
C0000
C1023
N0000
N5119

Timer setting value
(1024 words)
Timer current value
(1024 words)
Counter setting value
(1024 words)
Counter current value
(1024 words)

T0000
T1023
T0000
T1023 C0000
C1023
C0000
C1023
U0A.31
Analog Data
Register
(1024 words) “U”
U00.00
Index Register
Z127 (128 words) “Z”
Z000
User Program area
L2047
T1023
File Register
R10239 (10240 words) “R”
R000

Chapter 5 Program Configuration and Operation Method
5-34
5.5.3 Data latch area setting
When PLC stops and restarts the data required for operation or the data occurred during operation, if you
want to keep and use those data, data latch can be used and it is available to use a certain area of some
data device as latch area by parameter setting.
The below shows the features for latch device.

Device 1st latch 2nd latch Features
P X X Image area to save the state of I/O device
M O O Internal device area
K X X Device keeping the device state during power shutdown
F X X System flag area
T O O Timer related area (Bit/words both)
C O O Counter related area (Bit/words both)
S O O Relay for step control
D O O General words data save area
U X X Analog Data Register (latch disabled )
L X X High speed link/P2P Service state device of communication
module (latch enabled)
N X X P2P Service address area of communication module (latch
enabled)
Z X X Index dedicated Register (latch disabled)
R X X File register (latch enabled)

 

Remark
▪ K, L, N, R devices are basically latched.

1) Latch area setting
▪ Click Device Area Setup of Basic parameter settings.

Chapter 5 Program Configuration and Operation Method
5-35
2) Data latch area operation
The method to delete the latched data is as below.
- latch 1, latch 2 clear operation by XG5000
- write by Program (initialization program recommended)
- write „0‟ FILL from XG5000 monitor mode.
For keep or reset (clear) operation of latch area data according to PLC operation, please refer to the
below table.

No. Classification Detailed operation Latch 1 Latch 2
1 Power change Off/On Keep Keep
2 Reset by XG5000 Overall reset Reset Keep
3 Program write (online) - Keep Keep
4 Data broken SRAM broken by battery error Reset Reset
Data broken by other reason Reset Reset
5 XG5000 online Clear Latch 1 Reset Keep
Clear Latch 2 Reset Reset

▪ Latch 1 area is cleared byOnline-Reset PLC- “Overall reset”.
Chapter 5 Program Configuration and Operation Method
5-36
Latch 1, 2 area is cleared byOnline-Clear PLC.
3) Data initialization
In case of Memory Delete state, the memory of all device shall be cleared as „0‟. In case of giving the data
value at the beginning according to system, please use the initialization task.
▪ Device area is cleared by click „Clear‟ in
Online-Clear PLC-Clear Memory.
Chapter 6 CPU Functions
6-1
Chapter 6 CPU Functions
6.1 Type Setting
It describes setting of XGB PLC type.

PLC
Series
CPU type Description Reference
XGB XGB-DR16C3 Dedicated product Module type
XGB-XBMS “S” type : XBM-DN16/32S , XBM-DR16S Module type
XGB-XBCH “H” type : XBC-DR32/64H , XBC-DN32/64H Compact
type

 

Remark
▪ In case type is different, connection is not available.

Chapter 6 CPU Functions
6-2
6.2 Parameter Setting
This paragraph describes how to set parameters.
6.2.1 Basic parameter setting
Clicking Basic Parameter in the project window shows the following window.
There are three main options ; “Basic Operation Setup” , “Device Area Setup” and “Error Operation
Setup”.

Chapter 6 CPU Functions
6-3

Category Item Description Note
Basic
operations
Fixed period
operation
Set the time of fixed period operation. 1~999
Watchdog timer Set the time of scan watchdog. 10~1000
Standard input filter Set the time of standard input filter. 1,3,5,10,20,70,100
Output during
debugging
Set whether to allow output actually during
debugging operation.
Allowance/Prohibition
Keep output when
an error occurs
Set whether to preserve output holding
function set in I/O parameter in case of error.
Allowance/Prohibition
Delete all areas
except latch when an
error occurs
Set whether to clear each device that is not
designated as a latch area in case of error
Allowance/Prohibition
Device
area
Select latch area Set the latch area of each device. -
Error
operation
Operation resumes
in case of operation
error
Set whether to pause or resume operation in
case of operation error.
Pause/Resume

6.2.2 I/O parameter setting
This setting is to set and reserve each I/O information. Clicking I/O Parameterin the project
window shows the following setting window.
Clicking
Modulein Slot Positionindicates a list of modules, in which you may set I/O
corresponding to the actual system. Then, the following window is displayed.
Clicking
Detailsin Slot Positionshows the following window to set filter and emergency output.
Chapter 6 CPU Functions
6-4

Remark
If settings are different with I/O module actually accessed, “Inconsistent module type error” occurs,
displaying error.
Without settings, CPU reads each I/O module information and operates.

6.3 Self-diagnosis Function
6.3.1 Saving of error log
CPU module logs errors occurred so that the causes will be identified and fixed easily. Clicking
Error/Warningof Onlineshows the current error and previous error log.
[“S” type] [“H” type]

Item Description Remarks
Error/Warning Display the current error/warning. -
Error Log Display a log of error/warning occurred. Saving up to 100

 

Remark
1) Saved data are not deleted until selecting a menu of XG5000 and clicking “Delete”.
2) “H” type displays Data and Time.

Chapter 6 CPU Functions
6-5
6.3.2 Troubleshooting
(1) Trouble types
Trouble occurs due to PLC itself, system configuration error or abnormal operation result detected. Trouble
is divided into trouble mode stopping operation for the safety and warning mode generating alert to user
with a mode in trouble.
The causes troubling PLC system are as follows.
PLC hardware trouble
System configuration error
Operation error while operating user program
Error detected owing to external device in trouble
(2) Operation mode if trouble occurs
PLC system logs any trouble occurred in flag and determines whether to stop or resume operation
depending on trouble mode.
A) PLC hardware trouble
In case an error occurs so that PLC such as CPU module and power module may not work normally,
the system is halted, but any warning may not interfere with the operation.
B) Operation error while operating user program
Representing an error occurred during operation of user program, in case of numeric operation error,
it displays the error in error flag but the system resumes operating. However, if the operation time
exceeds by the operation monitoring time limit and I/O module does not control it normally, the system
is halted.
C) Error detected owing to external device in trouble
Representing the detection of external device to be controlled by users program of PLC, if an error is
detected, the system is halted, but any warning may not interfere with the operation.

Remark
1) If any trouble occurs, the unique trouble number is saved in a special relay F****.
2) For details of flag, refer to the appendix 1 Flag List.

Chapter 6 CPU Functions
6-6
6.4 Remote Functions
CPU module may change operation by communication as well as by key switches mounted on the module. To
operate it remotely, it is necessary to set ‘RUN/STOP’ switch to ‘STOP’.
(1) Remote operations are as follows.
▪ Operable by accessing to XG5000 through RS-232C port mounted on CPU module.
▪ Can operate other PLC connected to PLC network with CPU module connected to XG5000.
(2) Remote RUN/STOP
▪ Remote RUN/STOP is the externally controlled RUN/STOP function.
▪ It is convenient when CPU module is located at a position hard to control or when CPU module within
control panel is to control RUN/STOP function remotely.
(3) Remote DEBUG
▪It manages debugging remotely when remote mode is STOP. Namely, DEBUG operation is to execute
program operation depending on designated operation conditions.
▪Remote DEBUG is a convenient function when confirming program operation status or data during
system debugging.
(4) Remote Reset
▪Remote reset is to reset CPU module remotely if an error occurs at a place hard to directly control CPU
module.
▪Like operation by switches, it supports ‘Reset’ and ‘Overall Reset’.

Remark
1) For details regarding remote functions, refer to ‘Online’ of XG5000 Users Manual.

Chapter 6 CPU Functions
6-7
6.5 Forced Input/Output On and Off Function
Force I/O function is used to force to turn I/O areas on or off, regardless of program results.
6.5.1 Force I/O setup
ClickOnline -Force I/O .

Item Description
Move address Move to the beginning and end of I/O area (P000↔P127)
Move to ±8 of I/O area displayed at the very left.
Move to ±1 of I/O area.
Application Set whether to allow or not Force I/O
Single Flag Set whether to allow or not Force I/O by bits.
Data Set Force I/O data on or off by bits.
Select All Set to allow Force I/O with all I/O area on
Delete All Delete to allow Force I/O with all I/O area off.
Setting device Display I/O area set as a bit.

Chapter 6 CPU Functions
6-8
6.5.2 Processing time and processing method of Force Input/Output On and Off
(1) Forced Input
Regarding input, at the time of input refresh it replaces the data of contact set as Force On/Off among
data read from input module with the data as Force and updates input image area. Therefore, user
program executes operations with actual input data while Force input area is operated with data set as
Force.
(2) Forced Output
Regarding output, at the time of output refresh upon the execution user program operation, it replaces
the data of contact set as Force On/Off among data of output image area containing operation results
with data set as Force and outputs the data in output module. Unlike (Force) input, the output image
area is not changed by Force On/Off setting.
(3) Cautions when using Force I/O function
It operates from the time when I/O is individually set as ‘Allow’ after setting Force data.
It is possible to set Force input although I/O module is not actually mounted.
Despite of the power changed Off -> On, operation mode changes or any operation by pressing reset key,
the data of which On/Off is set before is kept in CPU module.
Even in STOP mode, Force I/O data is not removed.
To set new data from the beginning, it is necessary to deselect all settings of I/O by using ‘Delete All’
option.
6.6 Direct Input/Output Operation
Refreshing I/O operates after completion of scan program. If data of I/O is changed while program is
scanned, it does not refreshed at the changed moment. Refreshed I/O data is applied after ‘END’ instruction
on program.
This function may be useful when directly reading the status of input contact during program operation by
refreshing I/O by means of ‘IORF’ instruction or outputting operation results to output contact.
‘IORF’ command is operated when M00000 is ON. First operand designates slot number. Second operand
designates the upper 32 bit data as mask data. Third operand designates the lower 32 bit data as mask data.
The bit to refresh set as 1 (hFF) and others set as 0 (h00) (not refreshed).

Remark
For details regarding IORF instruction, refer to XGB Instructions List.

Chapter 6 CPU Functions
6-9
6.7 Diagnosis of External Device
This flag is provided for a user to diagnose any fault of external device and, in turn, execute halt or warning of
the system. Use of this flag displays faults of external device without any complicated program prepared and
monitors fault location without any specific device (XG5000 and etc) or source program.
(1) Detection and classification of faults in external device
▪The trouble (fault) of external device may be detected by user program and largely divided, depending on
the type, into error and warning; the former requires halt of PLC operation and the latter simply displays
the status while PLC keeps working.
▪‘Error’ uses ‘F202 (_ANC_ERR)’ and ‘Warning’ uses ‘F203 (_ANC_WB) flag’.
▪As the detection request flag, ’Error’ uses ‘F2002 (_CHK_ANC_ERR) flag’ while ‘Warning’ uses ‘F2003
(_CHK_ANC_WB) flag’.
(2) Troubleshooting external device
▪ When detecting any trouble of external device in user program, it writes a value except ‘0’ by classifying
the type, which is defined by a user in ‘F202 (_ANC_ERR)’ while the detection request flag checks it at
the time when the program ends with ‘F2002 (_CHK_ANC_ERR) On, and PLC turns off all output,
making it as the same error status as detected by PLC itself.
▪ If any trouble occurs, a user may identify the cause by using XG5000 and alternatively by monitoring
‘F202 (_ANC_ERR) flag’.
Example
▪If any trouble occurs, CPU is in error status and operation halts. At this moment, F2020 and F2002 flags
are off (error LED switches on and off every second.)
(3) Processing warning of external device
▪When detecting any warning of external device in user program, it turns on a flag in the warning position
of system flag ‘F203 (_ANC_WB) and if turning on the detection request flag, ‘F2003 (_CHK_ANC_WB)’ ,
it displays warning at the time when scan program ends. If a warning occurs, the detection request flag,
‘F2003 (_CHK_ANC_WB)’ is automatically off (F203 is not deleted).
▪If a warning occurs, the LED switches on and off every other second
.
▪If turning off a bit in question of F203 and turning on F2003 bit after processing warning, warning is
cancelled and the LED turns off.
Example

FSET F2020
FSET F2002

M000
Error device bit On
Error detection request On

FSET F2030
FSET F2003
FRST F2030
FSET F2003

M000
Warning device bit On
Warning detection request On
Warning cancellation
Warning detection request On
M001

Chapter 6 CPU Functions
6-10
6.8 Allocation of Input/Output Number
Allocation of I/O number is to allocate an address to every I/O of each module to read data from input module
and output data to output module when it executes operations.
XGB series adopts 64 points occupation to every module.
(1) Allocation of I/O number
64 points are allocated to every module (incl. special, communication).

System Configuration
Number of
Connection stage
Type I/O allocation Remarks
0 XBM-DN32S Input: P0000 ~ P001F
Output: P0020 ~ P003F
Basic unit fixed
1 XBE-DC32A Input: P0040~P007F Actual input: P0040 ~ P004F
2 XBE-TN32A Output: P0080 ~ P011F Actual output: P0080 ~ P009F
3 XBL-C41A P0120 ~ P015F -
4 XBF-AD04A P0160 ~ P019F -
5 XBE-DV04A P0200~P027F -
6 XBE-DC32A Input: P0240~P027F Actual input: P0240 ~ P024F
7 XBE-TN32A Output: P0280 ~ P031F Actual output: P0280 ~ P028F

Empty I/O point is available for internal relay.
(2) In case of allocating IO of IO parameter, allocation information is displayed.

Chapter 6 CPU Functions
6-11

System Configuration
Number of
Connection
stage
Type I/O allocation Remarks
0 XBC-DN32H Input: P0000 ~ P001F
Output: P0020 ~ P003F
Basic unit fixed
1 XBE-DC32A Input: P0040~P007F Actual input: P0040 ~ P005F
2 XBE-TN32A Output: P0080 ~ P011F Actual output: P0080 ~ P009F
3 XBL-C41A P0120 ~ P015F -
4 XBF-AD04A P0160 ~ P019F -
5 XBF-DV04A P0200 ~ P023F -
6 XBE-DC32A Input: P0240~P027F Actual input: P0240 ~ P025F
7 XBE-TN32A Output: P0280 ~ P031F Actual output: P0280 ~ P029F

In case of using monitor function of XG5000, I/O allocation information is displayed.
I/O module allocation
information
Description of each module

Chapter 6 CPU Functions
6-12
6.9 Online Editing
It is possible to modify program and communication parameter during operation of PLC without control
operation stopped. The following describes basic modification. For details of modifying program, refer to
XG5000 Users Manual.
Items to be modified during operation are as follows.
Program
Communication parameter
(1) It displays programs that are currently running.
(2) Click
Online-Start Online Editing.
Chapter 6 CPU Functions
6-13
(3) It turns to program modification mode during run when the program background is changed.
(4) Modifying a program.
(5) Upon the modification of program, click
Online-Write Modified Program.
Chapter 6 CPU Functions
6-14
(6) Upon the writing of program, click
Online-End Online Editing.
(7) The program background returns and the program modification during run is completed.

Remark
▪ For parameter modification during run, change each parameter on XG-PD and clickOnline-Write
Modified Program
.

Chapter 6 CPU Functions
6-15
6.10 Reading Input/Output Information
It monitors information of individual modules consisted of XGB series system.
(1) Click
Online-I/O Info. Then, information of each module connected to the system is monitored.
(2) If clicking Details after selecting a module, it displays detail information of a selected module.

Chapter 6 CPU Functions
6-16
6.11 Monitoring
It monitors system information of XGB series system.
(1) Clicking
Monitordisplays the following sub-menus.
(2) Items and descriptions

Item Description Remarks
Start/Stop Monitoring Designate the start and stop of monitor. Click for reverse turn.
Pause Pause monitoring. -
Resume Resume paused monitor. -
Pausing Conditions Pause monitoring if a preset value of device
corresponds to condition.
Monitor resumes;
clicking for resume.
Change Current Value Change the present value of currently selected
device.
-
System Monitoring Monitor general system information. -
Device Monitoring Monitor by device (type). -
Trend Monitoring Monitor trend of device set in the system. For details, refer to
XG5000 Users Manual.
Custom Events Monitor the value of device set when an event set
by a user occurs.
Data Traces Trace the value of device.

Chapter 6 CPU Functions
6-17
(a) Change current value
▪It changes the current value of each device selected in the current program window.
(b) Device monitoring
▪It monitors by device (type).

Chapter 6 CPU Functions
6-18
(c) Pausing conditions
▪It stops monitoring in case a device value set in the program corresponds.
(d) Trend monitoring
▪It displays device values graphically.

Chapter 6 CPU Functions
6-19
(e) Custom events
▪It monitors detail information when an event set by a user occurs. Additional user event may be
registered.
▪It sets basic setting and relative device.
If rising edge of M0000 device occurs, it records the message of an alarm, “Out of order Water Tank 1”
and the device values of D0000,L0000,D0100,N1000 are recorded.
▪ Set the relative device(s).

Chapter 6 CPU Functions
6-20
▪ Monitor event history of custom event.
▪ Double-clicking a number produced monitors the relative values of device and the detail message as
follows.

Remark
▪For details of monitor, refer to XG5000 Users Manual.

Chapter 6 CPU Functions
6-21
6.12 RTC function
“H” type (XBC-DxxxH) supports the RTC (clock) function and user can use this function for time
management of system or error log. RTC function is executed steadily when power is off or instantaneous
power cut status. Current time of RTC is renewed every scan by system operation status information flag.
6.12.1 How to use
(1) Reading/setting clock data
(a) Reading or setting from XG5000
1) Click
Online』의『PLC Information.
2) Click PLC RTC tap of PLC Information
.
3) In case the user wants to send the clock of PC to PLC, press ‘Synchronize PLC with PC clock’.
4) In case the user wants to send the clock the user wants, change the setting value of Time box
and press ‘Send to PLC’.
(b) Reading by special relay
The user can monitor as follows by special relay.

Special relay area Data Contents
F053 H0709 07year 9month
F054 H1214 12date 14hour
F055 H2040 20minute 40second
F056 H2003 20XXyear, Wednesday

(c) Modification of clock data by program
Chapter 6 CPU Functions
6-22

area Content
K0000 Year, month
K0001 Date, hour
K0002 Minute, second
K0003 Centaury, day

Write clock data to temporary device (P, M, K, L, Z, U, D, R) and turn on/off input contact point
M0000. ( If date and day data is not matched, Write is not available.)
Monitor and check the above special area (F053~F056)
(d) How to express the day

Number 0 1 2 3 4 5 6
Day Sunday Monday Tuesday Wednesday Thursday Friday Saturday

(2) Deviation of clock data
±2.2s / 1 d

1) Initially, RTC may not have any clock data.
2) When using the CPU module, first make sure to set the accurate clock data.
3) If any data out of the clock data range is written into RTC, it does not work properly.
i.e.) 14M 32D 25H
4) RTC may stop or have an error due to abnormal battery and other causes. The error is released if a
new clock data is written.

 

Remark

07year 9month
12date 14hour
20minute 40second
20XXyear, Wednesday

Chapter 6 CPU Functions
6-23
6.13 External Memory Module
You can save the user program safely and download the program into the system when program is damaged
without special manipulation by using external memory module.
6.13.1 Memory module specification

Item XBO-M2MB Ref.
Memory capacity 2MByte
Memory type Flash Memory
Specification USB supported, Program Read/Write
Indicator LED 1. RUN
2. WRITE
3. READ
Operating mode setup Mode setup by rotary switch
Operating power supply RS-232C communication connecter,
USB connector
5V
Purpose For moving

6.13.2 Memory module structure

Note
-.Memory module can be used for XGB (not supported for XGK/I/R)
-.Memory module is not supported at the version below
(XBMS: V2.5 or less, XBCH: V1.8 or less, XECH: V1.2 or less)

RS-232C connector
RUN LED
WRITE LED
READ LED
1 : READ mode
3 : WRITE mode
5 : PADT I/F mode
USB connector

Chapter 6 CPU Functions
6-24
6.13.3 How to use memory module
(1) Save program, parameter, communication parameter at external memory module
(a) Set the switch of memory module as 1
(b) Install memory module at the RS-232C port of main unit
- After installation, program and parameter (including communication) is saved into memory
module and READ LED is on
- If Saving program and parameter is complete, READ LED is off
(c) Separate memory module from main unit
(2) Save user program of external memory module at main unit
(a) Set the operating mode of main unit as STOP
- In RUN mode, you can’t save program
(b) Set the switch of memory module as 3
(c) Install the memory module
- Install it at the RS-232C port of the main unit.
- PLC program and parameter (including communication) is written and WRITE LED is on
- If saving program and parameter is complete, WRITE LED is off.
(d) If you change operation mode of PLC into RUN, PLC operates with program and parameter saved
in memory module.
With the above handling, you can run PLC with program saved in memory module
(3) Save program of XG5000at the memory module
(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC
(b) Select Project
Write to Memory on XG5000 menu.
(c) ‘Write’ window is created as follows.

Chapter 6 CPU Functions
6-25
(d) “Writing completed” window appears.
(e) With above method, through PADT, you can save program, parameter, communication parameter
at XBO-M2MB
(4) Open from memory module
(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC
(b) Select “Project
Open from Memory” on XG5000 menu
(c) “Read” window is created as follows.

Chapter 6 CPU Functions
6-26
(d) “Reading is completed” window appears.
(e) With above method, through PADT, you can save program, parameter, communication parameter
from XBO-M2MB
(5) Write to Memory module
(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port
(b) Click “Online
Write to Memory module” on XG-PD menu
(c) If you click “OK” button, it saves each parameter at the memory module.

Chapter 6 CPU Functions
6-27
(d) If “Enable Link” window appears, check the item and press “Write”
(e) “Enable, Disable” window appears

Chapter 6 CPU Functions
6-28
(6) Read from Memory module
(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC
(b) Select “Online
Read from Memory module” on XG-PD menu.
(c) If you click “OK” button”, it read each parameter form the memory module.
-. “Open from memory module” and “Write to Memory module” menus of PADT are activated when
PLC is Offline. They are deactivated when PLC is Online.
-. When connecting with PADT, connection type should be ‘USB’
Note
Chapter 6 CPU Functions
6-29
6.13.4 How to use when password is set
(1) When connecting PADT with memory module
(a) When setting password at program and writing program to memory module, it is saved according
to rotary switch operating mode without functions cancelling the password
1) When writing program, check whether to use password at ‘Write’ window.
2) If you press ‘OK’ after setting password, program is saved at memory module with that
password.
(b) When reading password-set program to PADT, screen appears, which is same as when password
is set in PLC.
1) “Password” window is created.
2) If you input password same as that in memory module, it reads program.
3) When password is incorrect, error message appears as follows.

Chapter 6 CPU Functions
6-30
(2) Write to PLC by memory module
(a) When password of program in memory module is not set
1) When no password is set in PLC
- Saves program of the memory module in PLC
2) When password is set in PLC
- Writing is not executed
(b) When password of program in memory module is set
1) When no password is set in PLC
- Writing to PLC is executed
But, password of the memory module is not written to PLC.
2) When password is set in PLC
- When PLC password is same as that of the memory module, writing is executed.
- When PLC password is not same as that of the memory module, writing is not executed.
(WRITE LED flickers)
(3) Reading program in PLC to memory module
(a) When password of program in PLC is not set
1) When no password is set in the memory module
- Reads program from PLC
2) When password is set in the memory module
- After reading, it clears password of the memory module
(b) When password of program in PLC is set
1) When no password is set in the memory module
- Writing is not executed
2) When password is set in the memory module
- When PLC password is same as that of the memory module, writing is executed.
- When PLC password is not same as that of the memory module, writing is not executed.
(4) When LED flickers

Condition LED
1 PLC type is not XGB RUN LED flickers
2 Operating mode changes while being connected to PADT or
PLC
RUN LED flickers
3 Connected to PADT while mode switch is 1 READ LED flickers
4 PLC program upload is prohibited READ LED flickers
5 You execute reading when password is set in PLC
(when password is not same as that of memory module)
READ LED flickers
6 Connected to PADT while mode switch is 3 WRITE LED flickers
7 You execute writing the memory module when PLC mode is
RUN
WRITE LED flickers
8 Connected to the different type of PLC with the type set in the
memory module
WRITE LED flickers
9 You executes writing when PLC password is not same as that of
memory module
WRITE LED flickers

-. Memory module can cancel PLC password and read/write but can’t set, delete and change the
password.
-. Do not run PLC while external memory module is connected to.
-. Do not remove memory module while READ/WRITE LED is on.
Note
Chapter 7 Input/Output Specifications
7-1
Chapter 7 Input/Output Specifications
7.1 Introduction
Here describes the notices when selecting digital I/O module used for XGB series.
1) For the type of digital input, there are two types such as current sink input and current source
input.
2) The number of max. Simultaneous input contact point is different according to module type. It
depends on the input voltage, ambient temperature. Use input module after checking the
specification.
3) When response to high speed input is necessary, use interrupt input contact point. Up to 8
interrupt points are supported.
4) In case that open/close frequency is high or it is used for conductive load open/close, use
Transistor output module or triac output module as the durability of Relay Output Module shall
be reduced.
5) For output module to run the conductive (L) load, max. open/close frequency should be used
by 1second On, 1 second Off.
6) For output module, in case that counter timer using DC/DC Converter as a load was used,
Inrush current may flow in a certain cycle when it is ON or during operation. In this case, if
average current is selected, it may cause the failure. Accordingly, if the previous load was
used, it is recommended to connect resistor or inductor to the load in serial in order to reduce
the impact of Inrush current or use the large module having a max. load current value.

Output
module

Resistor Load

L

Inductor Load
Chapter 7 Input/Output Specifications
7-2
7) Relay life of Relay output module is shown as below.
Max. life of Relay used in Relay output module is shown as below.
Open/Close times (× 10000)
100
50
30
20
10
0.5 1 2 3 5 10 100
Open/Close current (A)

C 2 5 Resis tive lo d
C 3 0 Resisti ve l a

AC 125V Resistive load
Chapter 7 Input/Output Specifications
7-3
8) A clamped terminal with sleeve can not be used for the XGB terminal strip. The clamped terminals
suitable for terminal strip are as follows (JOR 1.25-3:Daedong Electricity in Korea).
9) The cable size connected to a terminal strip should be 0.3~0.75
stranded cable and 2.8
thick. The cable may have different current allowance depending on the insulation thickness.
10) The coupling torque available for fixation screw and terminal strip screw should follow the table
below.

Coupling position Coupling torque range
IO module terminal strip screw (M3 screw) 42 ~ 58 N·
IO module terminal strip fixation screw
(M3 screw)
66 ~ 89 N·

11) Relay life graph is not written based on real use. (This is not a guaranteed value). So consider
margin. Relay life is specified under following condition.
(a) Rated voltage, load: 3 million times: 100 million times
(b) 200V AC 1.5A, 240V AC 1A (COS¢ =0.7): 1 million times
(c) 200V AC 0.4A, 240V AC 0.3A (COS¢ =0.7): 3 million times
(d) 200V AC 1A, 240V AC 0.5A (COS¢ =0.35): 1 million times
(e) 200V AC 0.3A, 240V AC 0.15A (COS¢ =0.35): 3 million times
(f) 24V DC 1A, 100V DC 0.1A (L/R=7ms): 1million times
(g) 24V DC 0.3A, 100V DC 0.03A (L/R=7ms): 3million times
12) Noise can be inserted into input module. To prevent this noise, the user can set filter for input
delay in parameter. Consider the environment and set the input filter time.

Input filter time (ms) Noise signal pulse size (ms) Reference
1 0.3
3 1.8 Initial value
5 3
10 6
20 12
70 45
100 60

6.0mm or less 6.0mm or less
Chapter 7 Input/Output Specifications
7-4
(a) Setting input filter
1) Click I/O Parameter
in the project window of XG5000
2) Click
Moduleat the slot location.
Chapter 7 Input/Output Specifications
7-5
3) Set I/O module really equipped.
4) After setting I/O module, click Input Filter.
5) Set filter value.

Chapter 7 Input/Output Specifications
7-6
(b) Setting output status in case of error
1) Click Emergency Out in the I/O parameter setting window.
2) Click Emergency Output.
If it is selected as Clear, the output will be Off and if Hold is selected, the output will be kept.

Chapter 7 Input/Output Specifications
7-7
7.2 Basic Digital Input Unit Specifications
7.2.1XBM-DR16S input unit (Source/Sink type)

Model
Specification
Basic unit
XBM-DR16S
Input point 8 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 (00~03: About 7 )
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
On Voltage/Current DC19V or higher/ 3 or higher
Off Voltage/Current DC6V or lower/ 1 or lower
Input resistance About 5.6 (P00~P03: about 3.3 )
Response
time
Off On 1/3/5/10/20/70/100 (set by I/O parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common Method 8 point / COM
Proper cable size Twisted pair 0.3~0.75 (external diameter 2.8 or less)
Current consumption () 180 (When Input On LED On)
Operation indicator Input On, LED On
External connection
method
9 pin terminal block connector
Weight 140g
Circuit configuration No. Contact Type
TB1 00
TB2 01
TB3 02
TB4 03
TB5 04
TB6 05
TB7 06
TB8 07
TB9 COM

 

DC24V
0 7
Terminal block no.
TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9

Internal
Circuit
R
TB1
COM
Photo coupler
TB8
TB9
R

Chapter 7 Input/Output Specifications
7-8
7.2.2XBM-DN16S input unit (Source/Sink type)

Model
Specification
Basic unit
XBM-DN16S
Input point 8 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 (Contact point 0~3: About 7 )
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
On Voltage/Current DC19V or higher / 3 or higher
Off Voltage/Current DC6V or less / 1 or less
Input resistance About 5.6 (P00~P03: About 3.3 )
Response
time
Off On 1/3/5/10/20/70/100 (set by I/O parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 8 point / COM
Proper cable size 0.3
Current consumption 180 (when all point On)
Operation indicator Input On, LED On
External connection method 20 pin connector
Weight 100g
Circuit configuration No. Contact No. Contact Type
B10 00 A10 NC
B09 01 A09 NC
B08 02 A08 NC
B07 03 A07 NC
B06 04 A06 NC
B05 05 A05 NC
B04 06 A04 NC
B03 07 A03 NC
B02 COM A02 NC
B01 COM A01 NC

 

DC24V
0 7
Connector no.
B10
B09
B08
B07
B06
B05
B04
B03
B02
A10
A09
A08
A07
A06
A05
A04
A03
A02
B01 A01

Internal
circuit
R
B10
COM
Photo coupler
B03
B02
R

Chapter 7 Input/Output Specifications
7-9
7.2.3XBM-DN32S input unit (Source/Sink type)

Model
Specification
Basic unit
XBM-DN32S
Input point 16 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 (Contact point 0~3: About 7 )
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
On Voltage/Current DC19V or higher / 3 or higher
Off Voltage/Current DC6V or less / 1 or less
Input resistance About 5.6 (P00~P03: About 3.3 )
Response
time
Off On 1/3/5/10/20/70/100 (set by I/O parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 16 point / COM
Proper cable size 0.3
Current consumption 200 (when all point On)
Operation indicator Input On, LED On
External connection
method
20 pin connector
Weight 110g
Circuit configuration No. Contact No. Contact Type
B10 00 A10 08
B09 01 A09 09
B08 02 A08 0A
B07 03 A07 0B
B06 04 A06 0C
B05 05 A05 0D
B04 06 A04 0E
B03 07 A03 0F
B02 COM A02 COM
B01 COM A01 COM

 

DC24V
0 F
Connector no.
B10
B09
B08
B07
B06
B05
B04
B03
B02
A10
A09
A08
A07
A06
A05
A04
A03
A02
B01 A01

Internal
circuit
R
B10
COM
Photo coupler
A03
B02
R

Chapter 7 Input/Output Specifications
7-10
7.2.4XBC-DR32H / XBC-DN32H input unit (Source/Sink type)

Model
Specification
Basic unit
XBC-DR32H(/DC) XBC-DN32H(/DC)
Input point 16 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 (Contact point 0~3: About 7 )
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
On Voltage/Current DC19V or higher / 3 or higher
Off Voltage/Current DC6V or less / 1 or less
Input resistance About 5.6 (P00~P03: About 3.3 )
Response
time
Off On 1/3/5/10/20/70/100 (set by I/O parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 16 point / COM
Proper cable size 0.3
Current consumption 200 (when all point On)
Operation indicator Input On, LED On
External connection
method
24 points connecting connector (M3 X 6 screw)
Weight 600g 500g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
TB6 00
TB7 01
TB8 02
TB9 03
TB10 04
TB11 05
TB12 06
TB13 07
TB14 08
TB15 09
TB16 0A
TB17 0B
TB18 0C
TB19 0D
TB20 0E
TB21 0F
TB22 COM
TB23 24G
TB24 24V

 

DC24V
0 F
Terminal block no.
TB2
TB4
TB6
TB8
TB1
TB3
TB5
TB7

Internal
circuit
R
B10
COM
Photocoupler
A03
B02
R
TB10
TB12
TB14
TB16
TB18
TB20
TB9
TB11
TB13
TB15
TB17
TB19

Chapter 7 Input/Output Specifications
7-11
7.2.5XBC-DR64H / XBC-DN64H input unit (Source/Sink Type)

Model
Specification
Basic unit
XBC-DR64H(/DC) XBC-DN64H(/DC)
Input point 32 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 (Contact point 0~3: About 7 )
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
On Voltage/Current DC19V or higher / 3 or higher
Off Voltage/Current DC6V or less / 1 or less
Input resistance About 5.6 (P00~P03: About 3.3 )
Response
time
Off On 1/3/5/10/20/70/100 (set by CPU parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 16 point / COM
Proper cable size 0.3
Current consumption 200 (when all point On)
Operation indicator Input On, LED On
External connection
method
42 point connecting connector (M3 X 6 screw)
Weight 900g 800g
Circuit configuration No. contact No. contact type
TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
TB6 00
TB7 01
TB8 02
TB9 03
TB10 04
TB11 05
TB12 06
TB13 07
TB14 08
TB15 09
TB16 0A
TB17 0B
TB18 0C
TB19 0D
TB20 0E
TB21 0F
TB22 COM0
TB23 NC
TB24 10
TB25 11
TB26 12
TB27 13
TB28 14
TB29 15
TB30 16
TB31 17
TB32 18
TB33 19
TB34 1A
TB35 1B
TB36 1C
TB37 1D
TB38 1E
TB39 1F
TB40 COM1
TB41 24G
TB42 24V

 

DC24V
0F
00
DC24V
1F
10
Terminal block no.
TB2
TB4
TB6
TB8
TB10
TB12
TB14
TB16
TB18
TB20
TB22
TB24
TB26
TB28
TB30
TB32
TB34
TB36
TB38
TB40
TB42
TB1
TB3
TB5
TB7
TB9
TB11
TB13
TB15
TB17
TB19
TB21
TB23
TB25
TB27
TB29
TB31
TB33
TB35
TB37
TB39
TB41

Internal
circuit
R
TB6
COM0
Photo coupler
TB21
TB22
R
R
TB24
COM1
Photo coupler
TB39
TB40
R

Chapter 7 Input/Output Specifications
7-12
7.3 Basic Digital Output Unit Specification
7.3.1XBM-DR16S relay output unit

Model
Specification
Basic unit
XBM-DR16S
Output point 8 point
Insulation method Relay insulation
Rated load voltage / current DC24V 2A(Resistive load) / AC220V 2A(COSΨ = 1), 5A/COM
Min. load voltage/current DC5V / 1
Max. load voltage/current AC250V, DC125V
Off leakage current 0.1 (AC220V, 60 )
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Service
life
Mechanical 20 millions times or more
Electrical Rated load voltage / current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ) 100,000 times or more
Response
time
Off On 10 or less
On Off 12 or less
Common method 8 point / COM
Proper cable size Twisted pair0.3~0.75 (External diameter 2.8 or less)
Current consumption 360 (when all point On)
Operation indicator Output On, LED On
External connection method 9 point terminal block connector
Weight 140g
Circuit configuration No. Contact Type
TB1 20
TB2 21
TB3 22
TB4 23
TB5 24
TB6 25
TB7 26
TB8 27
TB9 COM

 

Terminal block no. TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9

DC5V
Internal RY
circuit
TB
TB9
TB8

Chapter 7 Input/Output Specifications
7-13
7.3.2XBM-DN16S transistor output unit (Sink type)

Model
Specification
Basic unit
XBM-DN16S
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage General output: 0.2A/ 1point,
Output for positioning (P20, P21): 01.A/ 1 point, 2A/1COM
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response
time
Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 8 point / COM
Proper cable size 0.3
Current consumption 180 (when all point On)
External
power supply
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 10 or less (DC24V connection)
Operation indicator Output On, LED On
External connection method 20 pin connector
Weight 100g
Circuit configuration No. Contact Type
B10 20
B09 21
B08 22
B07 23
B06 24
B05 25
B04 26
B03 27
B02 DC12
/24V
B01
A10 NC
A09 NC
A08 NC
A07 NC
A06 NC
A05 NC
A04 NC
A03 NC
A02 COM
A01

 

B10
B09
B08
B07
B06
B05
B04
B03
B02
A10
A09
A08
A07
A06
A05
A04
A03
A02
B01 A01
Connector no.

DC12/24V
R
Internal
circuit
B10
B01,B02
B03
A01,A02
DC5V
Chapter 7 Input/Output Specifications
7-14
7.3.3XBM-DN32S transistor output unit (Sink type)

Model
Specification
Basic unit
XBM-DN32S
Output point 16 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage General output: 0.2A/ 1point,
Output for positioning (P20, P21): 01.A/ 1 point, 2A/1COM
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response
time
Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 16 point / COM
Proper cable size 0.3
Current consumption 200 (when all point On)
External
power supply
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 10 or less (DC24V connection)
Operation indicator Output On, LED On
External connection method 20 pin connector
Weight 110g
Circuit configuration No. Contact Type
B10 20
B09 21
B08 22
B07 23
B06 24
B05 25
B04 26
B03 27
B02 DC12
/24V
B01
A10 28
A09 29
A08 2A
A07 2B
A06 2C
A05 2D
A04 2E
A03 2F
A02 COM
A01

 

B10
B09
B08
B07
B06
B05
B04
B03
B02
A10
A09
A08
A07
A06
A05
A04
A03
A02
B01 A01
Connector no.

DC12/24V
R
Internal
circuit
B10
B01,B02
A03
A01,A02
DC5V
Chapter 7 Input/Output Specifications
7-15
7.3.4 XBC-DR32H output unit

Model
Specification
Basic unit
XBC-DR32H(/DC)
Output point 16 point
Insulation method Relay insulation
Rated load
voltage/current
DC24V 2A (Resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
Min. load
voltage/current
DC5V / 1
Max. load voltage AC250V, DC125V
Off leakage current 0.1 (AC220V, 60 )
Max. on/off frequency 3,600 times / hour
Surge killer None
Life Mechanical 20 million or above
Electrical Rated load voltage / current one hundred thousand or above
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) one hundred thousand or above
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) one hundred thousand or above
DC24V / 1A, DC100V / 0.1A (L / R = 7 ) one hundred thousand or above
Response
time
Off On 10 or less
On Off 12 or less
Common method 4 point / COM
Proper cable size Strand wire 0.3~0.75 (External diameter 2.8 or less)
Internal consumption
current
360 (When all output are on)
Operation indicator Output On, LED On
External connection method 24 point terminal block connector (M3 X 6 screw)
Weight 600g
Circuit configuration No. contact No. Contact Type
TB1 AC100
~ 240V
TB2 FG
TB3
TB4 NC
TB5 20
TB6 21
TB7 22
TB8 23
TB9 COM0
TB10 24
TB11 25
TB12 26
TB13 27
TB14 COM1
TB15 28
TB16 29
TB17 2A
TB18 2B
TB19 COM2
TB20 2C
TB21 2D
TB22 2E
TB23 2F
TB24 COM3

RY
Internal Circuit
TB5
TB9
TB8
RY
TB10
TB14
TB13
RY
TB15
TB19
TB18
RY

Terminal block no. TB2
TB4
TB6
TB8
TB10
TB12
TB14
TB16
TB18
TB20
TB22
TB24
TB1
TB3
TB5
TB7
TB9
TB11
TB13
TB15
TB17
TB19
TB21
TB23

TB20
TB24
TB23
COM0
COM1
COM2
COM3

Chapter 7 Input/Output Specifications
7-16
7.3.5XBC-DR64H output

Model
Specification
Basic unit
XBC-DR64H(/DC)
Output point 32 point
Insulation method Relay insulation
Rated load
voltage/current
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
Min. load
voltage/current
DC5V / 1
Max. load voltage AC250V, DC125V
Off leakage current 0.1 (AC220V, 60 )
Max. on/off frequency 3,600 times / hour
Surge killer None
Life Mechanical 20 million or above
Electrical Rated load voltage / current one hundred thousand or above
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) one hundred thousand or above
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) one hundred thousand or above
DC24V / 1A, DC100V / 0.1A (L / R = 7 ) one hundred thousand or above
Response
time
Off On 10 or less
On Off 12 or less
Common method 4 point / COM (COM0~COM3), 8 point / COM (COM4~COM5)
Proper cable size Strand wire 0.3~0.75 (External diameter 2.8 or less)
Internal consumption
current
720 (When all output are on)
Operation indicator Output On, LED On
External connection method 42 point terminal block connector (M3 X 6 screw)
Weight 900g
Circuit configuration No. Contact No. Contact type
TB1 AC100
~240V
TB2 FG
TB3
TB4 NC
TB5 20
TB6 21
TB7 22
TB8 23
TB9 COM0
TB10 24
TB11 25
TB12 26
TB13 27
TB14 COM1
TB15 28
TB16 29
TB17 2A
TB18 2B
TB19 COM2
TB20 2C
TB21 2D
TB22 2E
TB23 2F
TB24 COM3
TB25 30
TB26 31
TB27 32
TB28 33
TB29 34
TB30 35
TB31 36
TB32 37
TB33 COM4
TB34 38
TB35 39
TB36 3A
TB37 3B
TB38 3C
TB39 3D
TB40 3E
TB41 3F
TB42 COM5

I RY
NTERNA
l
CIRCUIT
TB5
TB9
TB8
RY
TB10
TB14
TB13
RY
TB15
TB19
TB18
RY
TB20
TB24
TB23
COM0
COM1
COM2
COM3
RY
TB25
TB33
TB32
RY

Terminal block no. TB2
TB4
TB6
TB8
TB10
TB12
TB14
TB16
TB18
TB20
TB22
TB24
TB26
TB28
TB30
TB32
TB34
TB36
TB38
TB40
TB42
TB1
TB3
TB5
TB7
TB9
TB11
TB13
TB15
TB17
TB19
TB21
TB23
TB25
TB27
TB29
TB31
TB33
TB35
TB37
TB39
TB41

TB34
TB42
TB41
COM4
COM5

Chapter 7 Input/Output Specifications
7-17
7.3.6XBC-DN32H output unit (Sink type)

Model
Specification
Basic unit
XBC-DN32H(/DC)
Output point 16 point
Insulation method Photo coupler insulation
Rated load
voltage/current
DC 12 / 24V
Min. load
voltage/current
DC 10.2 ~ 26.4V
Max. load voltage General output: 0.5A/ 1point,
Output for positioning (P20, P21, P22, P23): 01.A/ 1 point, 2A/1COM
Off leakage current 0.1 or less
Max. on/off frequency 4A / 10 or less
Surge killer DC 0.4V or less
Output point Zener diode
Response time Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 4 point / COM
Proper cable size Strand wire 0.3~0.75 (external diameter 2.8 or less)
Internal consumption
current
400 (When all output are on)
External power
supply
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 25 or less (When connecting DC24V)
Operation indicator Output On, LED On
External connection method 24 point terminal block connector (M3 X 6 screw)
Weight 500g
Circuit configuration No. Contact No. Contact Type
TB1 AC100
~240V
TB2 FG
TB3
TB4 DC12
/24V
TB5 20
TB6 21
TB7 22
TB8 23
TB9 COM0
TB10 24
TB11 25
TB12 26
TB13 27
TB14 COM1
TB15 28
TB16 29
TB17 2A
TB18 2B
TB19 COM2
TB20 2C
TB21 2D
TB22 2E
TB23 2F
TB24 COM3

INTERNA
l
CIRCUIT

Terminal block no. TB2
TB4
TB6
TB8
TB10
TB12
TB14
TB16
TB18
TB20
TB22
TB24
TB1
TB3
TB5
TB7
TB9
TB11
TB13
TB15
TB17
TB19
TB21
TB23

TB04
DC12/24V
R
TB05
TB08
TB09
DC12/24V
R
TB10
TB13
TB14
DC12/24V
R
TB15
TB18
TB19
DC12/24V
R
TB20
TB23
TB24
DC5V

Chapter 7 Input/Output Specifications
7-18
7.3.7XBC-DN64H output unit (Sink type)

Model
Specification
Basic unit
XBC-DN64H(/DC)
Output point 32 point
Insulation method Photo coupler insulation
Rated load
voltage
DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load current General output: 0.5A/ 1point,
Output for positioning (P20, P21, P22, P23): 01.A/ 1 point, 2A/1COM
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
On max. voltage drop DC 0.4V or less
Surge killer Zener diode
Response
time
Off On 1 or less
On Off 1 or less (Rated load, Resistive load)
Common method 4 point / COM (COM0~COM3), 8 point / COM (COM4~COM5)
Proper cable size Strand wire 0.3~0.75 (external diameter 2.8 or less)
Internal consumption
current
500 (When all output are on)
External power
supply
Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)
Current 25 or less (when connecting DC24V)
Operation indicator Output On, LED On
External connection method 42 point terminal block connector (M3 X 6 screw)
Weight 800g
Circuit configuration No. contact No. contact Type
TB1 AC100
~240V
TB2 FG
TB3
TB4 DC12
/24V
TB5 20
TB6 21
TB7 22
TB8 23
TB9 COM0
TB10 24
TB11 25
TB12 26
TB13 27
TB14 COM1
TB15 28
TB16 29
TB17 2A
TB18 2B
TB19 COM2
TB20 2C
TB21 2D
TB22 2E
TB23 2F
TB24 COM3
TB25 30
TB26 31
TB27 32
TB28 33
TB29 34
TB30 35
TB31 36
TB32 37
TB33 COM4
TB34 38
TB35 39
TB36 3A
TB37 3B
TB38 3C
TB39 3D
TB40 3E
TB41 3F
TB42 COM5

INTERNA
l
CIRCUIT

Terminal block no. TB2
TB4
TB6
TB8
TB10
TB12
TB14
TB16
TB18
TB20
TB22
TB24
TB26
TB28
TB30
TB32
TB34
TB36
TB38
TB40
TB42
TB1
TB3
TB5
TB7
TB9
TB11
TB13
TB15
TB17
TB19
TB21
TB23
TB25
TB27
TB29
TB31
TB33
TB35
TB37
TB39
TB41

TB04
DC12/24V
R
TB05
TB08
TB09
DC12/24V
R
TB10
TB13
TB14
DC12/24V
R
TB15
TB18
TB19
DC12/24V
R
TB20
TB23
TB24
DC5V
DC12/24V
R
TB25
TB32
TB33
DC12/24V
R
TB34
TB41
TB42

Chapter 7 Input/Output Specifications
7-19
7.4 Digital Input Module Specification
7.4.1 8 point DC24V input module (Source/Sink type)

Model
Specification
DC input module
XBE-DC08A
Input point 8 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
On Voltage/Current DC19V or higher / 3 or higher
Off Voltage/Current DC6V or less / 1 or less
Input resistance About 5.6
Response
time
Off On 1/3/5/10/20/70/100 (set by CPU parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 8 point / COM
Proper cable size Stranded pair 0.3~0.75 (External diameter 2.8 or less)
Current consumption 30 (when all point On)
Operation indicator Input On, LED On
External connection
method
9 point terminal block connector
Weight 52 g
Circuit configuration No. Contact Type
TB1 0
TB2 1
TB3 2
TB4 3
TB5 4
TB6 5
TB7 6
TB8 7
TB9 COM

 

DC24V
0 7
Terminal block no.
TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9

Internal
circuit
R
TB1
COM
Photo coupler
TB8
TB9
R

Chapter 7 Input/Output Specifications
7-20
7.4.2 16 point DC24V input module (Sink/Source type)

Model
Specification
DC input module
XBE-DC16A XBE-DC16B
Input point 16 point
Insulation method Photo coupler insulation
Rated input voltage DC24V DC12/24V
Rated input current About 4 About 4/8
Operation voltage range DC20.4~28.8V
(ripple rate < 5%)
On Voltage/Current DC19V or higher / 3 or higher DC9V or higher / 3 or higher
Off Voltage/Current DC6V or less / 1 or less DC5V or less / 1 or less
Input resistance About 5.6 About 2.7
Response
time
Off On 1/3/5/10/20/70/100 (set by CPU parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 16 point / COM
Proper cable size Stranded cable 0.3~0.75 (External diameter 2.8 or less)
Current consumption 40 (when all point On)
Operation indicator Input On, LED On
External connection method 8 pin terminal block connector + 10 pin terminal block connector
Weight 53 g
Circuit configuration No. Contact Type
TB1 0
TB2 1
TB3 2
TB4 3
TB5 4
TB6 5
TB7 6
TB8 7
TB1 8
TB2 9
TB3 A
TB4 B
TB5 C
TB6 D
TB7 E
TB8 F
TB9 COM
TB10 COM

 

DC24V
0 7
Connector no.
TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9
TB10

Internal
circuit
R
TB1
COM
Photo coupler
TB8
TB9
R

Chapter 7 Input/Output Specifications
7-21
7.4.3 32 point DC24V input module (Source/Sink type)

Model
Specification
DC input module
XBE-DC32A
Input point 32 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
Input Derating Refer to Derating diagram
On Voltage/Current DC 19V or higher / 3 or higher
Off Voltage/Current DC 6V or less / 1 or less
Input resistance About 5.6
Response
time
Off On 1/3/5/10/20/70/100 (set by CPU parameter) Default:3
On Off
Insulation pressure AC 560Vrms / 3 Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 32 point / COM
Proper cable size 0.3
Current consumption 50 (when all point On)
Operation indicator Input On, LED On
External connection method 40 pin connector
Weight 60g
Circuit configuration No. Contact No. Contact Type
B20 00 A20 10
B19 01 A19 11
B18 02 A18 12
B17 03 A17 13
B16 04 A16 14
B15 05 A15 15
B14 06 A14 16
B13 07 A13 17
B12 08 A12 18
B11 09 A11 19
B10 0A A10 1A
B09 0B A09 1B
B08 0C A08 1C
B07 0D A07 1D
B06 0E A06 1E
B05 0F A05 1F
B04 NC A04 NC
B03 NC A03 NC
B02 COM A02 COM
B01 COM A01 COM

 

DC28.8V
DC24V
Connector no.
100
80
60
40
0 10 20 30 40 50 55

On rate (%)
Ambient temperature
(℃ )
90
70
50
Input Derating diagram
B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01

Internal
circuit
R
1F
0
B20
COM
DC5V
Photo coupler
A05
B02
LED
R

Chapter 7 Input/Output Specifications
7-22
7.5 Digital Output Module Specification
7.5.1 8 point relay output module

Model
Specification
Relay output module
XBE-RY08A
Output point 8 point
Insulation method Relay insulation
Rated load voltage / Current DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 5A/COM
Min. load voltage/Current DC5V / 1
Max. load voltage/Current AC250V, DC125V
Off leakage current 0.1 (AC220V, 60 )
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Service life Mechanical 20 millions times or more
Electrical Rated load voltage / current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ) 100,000 times or more
Response
time
Off On 10 or less
On Off 12 or less
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 (External diameter 2.8 or less)
Current consumption 230 (when all point On)
Operation indicator Output On, LED On
External connection method 9 pin terminal block connector
Weight 80g
Circuit configuration No. Contact Type
TB1 0
TB2 1
TB3 2
TB4 3
TB5 4
TB6 5
TB7 6
TB8 7
TB9 COM

 

TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9
Terminal block no.

DC5V
Internal RY
circuit
TB1
TB9
TB8

Chapter 7 Input/Output Specifications
7-23
7.5.2 8 point relay output module(Relay insulation)

Model
Specification
Relay output module
XBE-RY08B
Output point 8 point
Insulation method Relay insulation
Rated load voltage / Current DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 5A/COM
Min. load voltage/Current DC5V / 1
Max. load voltage/Current AC250V, DC125V
Off leakage current 0.1 (AC220V, 60 )
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Service life Mechanical 20 millions times or more
Electrical Rated load voltage / current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ) 100,000 times or more
Response
time
Off On 10 or less
On Off 12 or less
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 (External diameter 2.8 or less)
Current consumption 230 (when all point On)
Operation indicator Output On, LED On
External connection method 9 pin terminal block connector
Weight 81g
Circuit configuration No. Contact Type
TB1 0
TB2 COM0
TB3 1
TB4 COM1
TB5 2
TB6 COM2
TB7 3
TB8 COM3
TB9 NC
TB1 4
TB2 COM4
TB3 5
TB4 COM5
TB5 6
TB6 COM6
TB7 7
TB8 COM7
TB9 NC

 

TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9
TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9
Terminal block no
.

RY
Internal
circuit
TB1
DC5V
TB7
TB2
TB8
RY

Chapter 7 Input/Output Specifications
7-24
7.5.316 point relay output module

Model
Specification
Relay output module
XBE-RY16A
Output point 16 point
Insulation method Relay insulation
Rated load voltage/ current DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 5A/COM
Min. load voltage/current DC5V / 1
Max. load voltage/current AC250V, DC125V
Off leakage current 0.1 (AC220V, 60 )
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Service
life
Mechanical 20 millions times or more
Electrical Rated load voltage / current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ) 100,000 times or more
Response
time
Off On 10 or less
On Off 12 or less
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 (External diameter 2.8 or less)
Current consumption 420 (when all point On)
Operation indicator Output On, LED On
External connection method 9 pin terminal block connector x 2 ea
Weight 130g
Circuit configuration No. Contact Type
TB1 0
TB2 1
TB3 2
TB4 3
TB5 4
TB6 5
TB7 6
TB8 7
TB9 COM
TB1 8
TB2 9
TB3 A
TB4 B
TB5 C
TB6 D
TB7 E
TB8 F
TB9 COM

Internal RY
circuit

Terminal block no. TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9
TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9

TB1
TB9
TB8
DC5V
Chapter 7 Input/Output Specifications
7-25
7.5.4 8 point transistor output module (Sink type)

Model
Specification
Transistor output module
XBE-TN08A
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.5A / 1 point
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response
time
Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 (External diameter 2.8 or less)
Current consumption 40 (when all point On)
External
power
supply
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 10 or less (DC24V connection)
Operation indicator Output On, LED On
External connection
method
10 pin terminal block connector
Weight 52g
Circuit configuration No. Contact Type
TB01 0
TB02 1
TB03 2
TB04 3
TB05 4
TB06 5
TB07 6
TB08 7
TB09 DC12
/24V
TB10 COM

 

TB01
TB02
TB03
TB04
TB05
TB06
TB07
TB08
TB09
TB10
TB01
Terminal block no.
DC12/24V
R
DC5V

Internal
circuit
TB09
TB08
TB10

Chapter 7 Input/Output Specifications
7-26
7.5.5 16 point transistor output module (Sink type)

Model
Specification
Transistor output module
XBE-TN16A
Output point 16 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.2A / 1 point, 2A / 1COM
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response
time
Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 16 point / COM
Proper cable size Stranded cable 0.3~0.75 (External diameter 2.8 or less)
Current consumption 60 (when all point On)
External
power supply
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 10 or less (DC24V connection)
Operation indicator Output On, LED On
External connection method 8 pin terminal block connector + 10 pin terminal block connector
Weight 54 g
Circuit configuration No. Contact Type
TB01 0
TB02 1
TB03 2
TB04 3
TB05 4
TB06 5
TB07 6
TB08 7
TB01 8
TB02 9
TB03 A
TB04 B
TB05 C
TB06 D
TB07 E
TB08 F
TB09 DC12
/24V
TB10 COM

 

Terminal block no. TB01
TB02
TB03
TB04
TB05
TB06
TB07
TB08
TB09
TB10
TB01
TB02
TB03
TB04
TB05
TB06
TB07
TB08

DC12/24V
R
Internal
circuit
TB01
TB09
TB08
TB10
DC5V

Chapter 7 Input/Output Specifications
7-27
7.5.6 32 point transistor output module (Sink type)

Model
Specification
Transistor output module
XBE-TN32A
Output point 32 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.2A / 1 point, 2A / 1COM
Off leakage current 0.1 or less
Max. inrush current 0.7A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response time Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 32 point / COM
Proper cable size 0.3
Current consumption 120 (when all point On)
External power
supply
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 20 or less (DC24V connection)
Operation indicator Output On, LED On
External connection method 40 pin connector
Weight 60g
Circuit configuration No. Conta ct No. Conta ct Type
B20 00 A20 10
B19 01 A19 11
B18 02 A18 12
B17 03 A17 13
B16 04 A16 14
B15 05 A15 15
B14 06 A14 16
B13 07 A13 17
B12 08 A12 18
B11 09 A11 19
B10 0A A10 1A
B09 0B A09 1B
B08 0C A08 1C
B07 0D A07 1D
B06 0E A06 1E
B05 0F A05 1F
B04 NC A04 NC
B03 NC A03 NC
B02 DC12/
24V
A02 COM
B01 A01

 

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01
Connector no.
DC12/24V

R
Internal
circuit
B20
B01,B02
A05
A01,A02
DC5V
Chapter 7 Input/Output Specifications
7-28
7.5.7 8 point transistor output module (Source type)

Model
Specification
Transistor output module
XBE-TP08A
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.5A / 1 point
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response
time
Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 (external diameter 2.8 or less)
Current consumption 40 (when all outputs are on)
External
power
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 10 or less (when connecting DC24V)
Operation indicator LED on when output on
External connection
method
10 pin terminal block connector
Weight 30g
Circuit configuration No. Contact Type
TB01 0
TB02 1
TB03 2
TB04 3
TB05 4
TB06 5
TB07 6
TB08 7
TB09 COM
TB10 0V

 

TB01
TB02
TB03
TB04
TB05
TB06
TB07
TB08
TB09
TB10
Terminal
block no.

DC5V
R
Internal
circuit
TB09
TB10
TB01
TB08

Chapter 7 Input/Output Specifications
7-29
7.5.816 point transistor output module (Source type)

Model
Specification
Transistor output module
XBE-TP16A
Output point 16 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response
time
Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 16 point / COM
Proper cable size Stranded cable 0.3~0.75 (external diameter 2.8 or less)
Current consumption 60 (When all outputs are on)
External
power
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 10 or less (connecting DC24V)
Operation indicator LED On when output On
External connection method 8 pin terminal block connector + 10 pin terminal block connector
Weight 40g
Circuit configuration No. Contact Type
TB01 0
TB02 1
TB03 2
TB04 3
TB05 4
TB06 5
TB07 6
TB08 7
TB01 8
TB02 9
TB03 A
TB04 B
TB05 C
TB06 D
TB07 E
TB08 F
TB09 COM
TB10 0V

DC5V
DC12/24V
R
Internal
circuit
L

Terminal
block no.
TB01
TB02
TB03
TB04
TB05
TB06
TB07
TB08
TB09
TB10
TB01
TB02
TB03
TB04
TB05
TB06
TB07
TB08

LED
TB09
L
TB10
TB01
TB08

Chapter 7 Input/Output Specifications
7-30
7.5.9 32 point transistor output module (Source type)

Model
Specification
Transistor output module
XBE-TP32A
Output point 32 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.2A / 1 point, 2A / 1COM
Off leakage current 0.1 or less
Max. inrush current 4A / 10 or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Response time Off On 1 or less
On Off 1 or less (Rated load, resistive load)
Common method 32 point / COM
Proper cable size 0.3
Current consumption 120 (When all outputs are on)
External power Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
Current 20 or less (connecting DC24V)
Operation indicator LED On when output On
External connection method 40 pin connector
Weight 60g
Circuit configuration No. Contact No. Contact Type
B20 00 A20 10
B19 01 A19 11
B18 02 A18 12
B17 03 A17 13
B16 04 A16 14
B15 05 A15 15
B14 06 A14 16
B13 07 A13 17
B12 08 A12 18
B11 09 A11 19
B10 0A A10 1A
B09 0B A09 1B
B08 0C A08 1C
B07 0D A07 1D
B06 0E A06 1E
B05 0F A05 1F
B04 NC A04 NC
B03 NC A03 NC
B02 COM A02 0V
B01 A01

 

B20
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
A07
A06
A05
A04
A03
A02
A01
Connector
No.

DC5V
DC12/24V
R
Internal
circuit
L
LED
B02,B01
L
A02,A01
B20
A05

Chapter 7 Input/Output Specifications
7-31
7.6 Digital I/O Mixed module Input Specification
7.6.1 8 point DC24V input (Source/Sink type)

Model
Specification
DC input module
XBE-DR16A
Input point 8 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On Voltage/Current DC19V or higher / 3 or higher
Off Voltage/Current DC6V or less / 1 or less
Input resistance About 5.6
Response
time
Off On 1/3/5/10/20/70/100 (set by CPU parameter) Default: 3
On Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 or more by Megohmmeter
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 (External diameter 2.8 or less)
Current consumption 280 (When all inputs and outputs are on)
Operation indicator LED on when input on
External connection
method
9 pin terminal block connector
Weight 81g
Circuit configuration No. Contact Type
TB1 0
TB2 1
TB3 2
TB4 3
TB5 4
TB6 5
TB7 6
TB8 7
TB9 COM

 

DC24V
0 7
Terminal
block no.
TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9

Internal
circuit
R
TB1
COM
DC5V
Photo coupler
TB8
TB9
LED
R

Chapter 7 Input/Output Specifications
7-32
7.7 Digital I/O Mixed module Output Specification
7.7.1 8 point relay output

Model
Specification
Relay output module
XBE-DR16A
Output point 8 point
Insulation method Relay insulation
Rated load
voltage / Current
DC24V 2A(Resistive load) / AC220V 2A(COSΨ = 1), 5A/COM
Min. load voltage/Current DC5V / 1
Max. load voltage AC250V, DC125V
Off leakage current 0.1 (AC220V, 60 )
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Service
life
Mechanical 20 millions times or more
Electrical Rated load voltage / current 100,000 times or more
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ) 100,000 times or more
Response
time
Off On 10 or less
On Off 12 or less
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 (external diameter 2.8 or less)
Current consumption 280 (When all inputs and outputs are on)
Operation indicator LED on when output on
External connection
method
9 pin terminal block connector
Weight 81g
Circuit configuration No. Contact Type
TB1 0
TB2 1
TB3 2
TB4 3
TB5 4
TB6 5
TB7 6
TB8 7
TB9 COM

 

TB1
TB2
TB3
TB4
TB5
TB6
TB7
TB8
TB9
Terminal
block no.

DC5V
RY
Internal
circuit
L
LED
TB1
TB9
TB8
L
Chapter 7 Input/Output Specifications
7-33
7.8 IO Wiring by Using Smart Link Board
7.8.1Smart link board
Easy wiring is available by connecting the IO connector with smart link board.
The available smart link and IO cable are as follows.

XGB Smart link Connection cable
Item Model Model No. of
Pin
Model Length Contents
Main unit XBM
DN32S
SLP
T40P
40 XBM SLT-CT101- 1m For main unit connection (20Pin + 20Pin)
XBM-
DN16S
Expansion
module
XBE
DC32A
SLP
T40P
40 SLT XBE-CT101- 1m For expansion module
connection (40Pin)
XBE
TN32A
SLP
T40P
40 SLT XBE-CT101- 1m
SLP
RY4A
40 SLP XBE-CT101- 1m For expansion module
connection (40Pin)
Exclusive for relay built-in
SLP type

It describes wring of XGB, SLP-T40P and SLT-CT101-XBM.
For wring of other smart link boards or XGB extension module, refer to XGB user manual for hardware.
1) SLT-T40P terminal array
Terminal array of SLP-T40P is as follows.

Item Specification
Rated voltage AC/DC 125[V]
Rated current Max. 1[A]
Withstanding
voltage
600V 1min
Insulation
resistor
100 (DC500V)
Cable
specification
1.25[] or below
Terminal/screw M3 X 8L
Torque 6.2 f.or
above
Terminal
material
PBT, UL94V-0
Weight 186g

Chapter 7 Input/Output Specifications
7-34
2) Wiring of SLT-T40P and XGB extension module
Wiring of XGB main unit through SLP-T40P and SLT-CT101-XBM is as follows.
XBM-DN32S
SLP-T40P
SLT-CT101-XBM
At this time, relationship of XGB IO signal and Smart link board terminal number is as follows.
The following figure describes signal allocation when SLT-CT101-XBM is used as connection cable.
When the user makes the cable, make sure that wring is done as figure below.
Signal name
Input Output

Chapter 8 Built-in High-speed Counter Function
8-1
Chapter 8 Built-in High-speed Counter Function
XGB series have built-in function of High-speed counter in basic unit. This chapter describes specifications
and usage of High-speed counter’s function.
8.1 High-speed Counter Specifications
It describes specifications, setting and usage of function, programming and wiring with external
device of built-in basic unit.
8.1.1 Performance specifications
(1) Performance specification

Classification Description
“S” type “H” type
Count input
signal
Signal A-phase, B-phase
Input type Voltage input (Open collector)
Signal level 24V
Max. coefficient speed 20 kpps 100 kpps
Number of
channels
1 phase 4 (20kpps 4 channels) 8 (10kpps 4 channels/20kpps 4 channels)
2 phase 2 In case of 2 multiplication: 10kpps 4 (50kpps 2 channels/ 10kpps 2 channels)
In case of 4 multiplication: 8kpps (50kpps 2 channels/ 8kpps 2 channels)
Coefficient range Signed 32 Bit (-2,147,483,648 ~ 2,147,483,647)
Count mode
(Program setting)
Linear count (if 32-bit range exceeded, Carry/Borrow occurs)
Counter max. and min. value is indicated
Ring count (repeated count within setting range)
Input mode
(Program setting)
1-phase input
2-phase input
CW/CCW input
Signal type Voltage
Up/Down
setting
1 phase input Increasing/decreasing operation setting by B-phase input
Increasing/decreasing operation setting by program
2 phase input Automatic setting by difference in phase
CW/CCW A-phase input: increasing operation
B-phase input: decreasing operation
Multiplication
function
1 phase input 1 multiplication
2 phase input 4 multiplication
CW/CCW 1 multiplication
Control input Signal Preset instruction input
Signal level DC 24V input type
Signal type Voltage
External
output
Output points 1 point/channel (for each channel)
:output contact point of basic unit
available
2 point/channel (for each channel)
:output contact point of basic unit
available
Type Select single-compared (>, >=, =, =<, <) or section compared output
(included or excluded) (program setting)
Output type Relay, Open-collector output (Sink)

Chapter 8 Built-in High-speed Counter Function
8-2

Classification Description

 

“S” type “H” type
Count Enable To be set through program (count available only in enable status)
Preset function To be set through terminal (contact) or program
Auxiliary mode Count Latch

(2) Counter/Preset input specification

Classification Spcification
Input voltage 24V DC (20.4V ~ 28.8V)
Input current 4
On guranteed voltage (min.) 20.4V
Off guranteed voltage (max.) 6V

8.1.2 Designation of parts
(1) Designation of parts

Name “S”type “H” type
XBM-DN16/32S XBM-DR16S XBC-DN32/64H,XBC-DR32.64H
Structure

 

P00
P01
P02
P03
P04
P05
COM
COM
P07
P06
B A B A
P00
P01
P02
P03
P04
P05
COM
P06
P07

Chapter 8 Built-in High-speed Counter Function
8-3
(a) “S” type

Terminal
No.
Names Usage
1-phase 2-phase 1-phase 2-phase
P000 Ch0 counter input Ch0 A-phase input Counter input terminal A-phase input
P001 Ch1 counter input Ch0 B-phase input Counter input terminal B-phase input
P002 Ch2 counter input Ch2 A-phase input Counter input terminal A-phase input
P003 Ch3 counter input Ch2 B-phase input Counter input terminal B-phase input
P004 Ch0 preset 24V Ch0 preset 24V Preset input terminal Preset input terminal
P005 Ch1 preset 24V - Preset input terminal No use
P006 Ch2 preset 24V Ch2 preset 24V Preset input terminal Preset input terminal
P007 Ch3 preset 24V - Preset input terminal No use
COM0 Input common Input common Common terminal Common terminal

(b) “H” type

Terminal
No.
Names Usage
1-phase 2-phase 1-phase 2-phase
P000 Ch0 counter input Ch0 A-phase input Counter input
terminal
A-phase input
P001 Ch1 counter input Ch0 B-phase input Counter input
terminal
B-phase input
P002 Ch2 counter input Ch2 A-phase input Counter input
terminal
A-phase input
P003 Ch3 counter input Ch2 B-phase input Counter input
terminal
B-phase input
P004 Ch4 counter input Ch4 A-phase input Counter input
terminal
A-phase input
P005 Ch5 counter input Ch4 B-phase input Counter input
terminal
B-phase input
P006 Ch6 counter input Ch6 A-phase input Counter input
terminal
A-phase input
P007 Ch7 counter input Ch6 B-phase input Counter input
terminal
B-phase input
P008 Ch0 preset 24V Ch0 preset 24V Preset input
terminal
Preset input
terminal
P009 Ch1 preset 24V - Preset input
terminal
No use
P00A Ch2 preset 24V Ch2 preset 24V Preset input
terminal
Preset input
terminal
P00B Ch4 preset 24V - Preset input
terminal
No use
P00C Ch5 preset 24V Ch4 preset 24V Preset input
terminal
Preset input
terminal
P00D Ch6 preset 24V - Preset input
terminal
No use
P00E Ch7 preset 24V Ch6 preset 24V Preset input
terminal
Preset input
terminal
P00F Ch8 preset 24V - Preset input
terminal
No use
COM0 Input common Input common Input common Input common

Chapter 8 Built-in High-speed Counter Function
8-4
Chapter 8 Built-in High-speed Counter Function
8-5
(2) Interface with external devices
The internal circuit of High-speed counter is as shown below.
(a) “S” type

I/O Internal circuit Terminal
No.
Signal Operation On/Off
guaranteed
voltage
1-phase 2-phase
Input P00 Ch 0
Pulse input
Ch 0
A-phase input
On 20.4~28.8V
Off 6V or less
P01 Ch 1
Pulse input
Ch 0
B-phase input
On 20.4~28.8V
Off 6V or less
P02 Ch 2
Pulse input
Ch 2
A-phase input
On 20.4~28.8V
Off 6V or less
P03 Ch 3
Pulse input
Ch 2
B-phase input
On 20.4~28.8V
Off 6V or less
P04 Ch 0
Preset input
Ch 0
Preset input
On 20.4~28.8V
Off 6V or less
P05 Ch 1
Preset input
- On 20.4~28.8V
Off 6V or less
P06 Ch 2
Preset input
Ch 2
Preset input
On 20.4~28.8V
Off 6V or less
P07 Ch 2
Preset input
- On 20.4~28.8V
Off 6V or less
COM0 COM (input common)

 

3.3 k
3.3 k
3.3 k
3.3 k
5.6 k
5.6 k
5.6 k

5.6 k

Chapter 8 Built-in High-speed Counter Function
8-6

I/O Internal circuit Terminal
No.
Signal Operation On/Off
guaranteed
voltage
1-phase 2-phase
Input P0000 Ch 0
Pulse input
Ch 0
A-phase input
On 20.4~28.8V
Off 6V or less
P0001 Ch 1
Pulse input
Ch 0
B-phase input
On 20.4~28.8V
Off 6V or less
P0002 Ch 2
Pulse input
Ch 2
A-phase input
On 20.4~28.8V
Off 6V or less
P0003 Ch 3
Pulse input
Ch 2
B-phase input
On 20.4~28.8V
Off 6V or less
P0004 Ch 4
Pulse input
Ch 4
A-phase input
On 20.4~28.8V
Off 6V or less
P0005 Ch 5
Pulse input
Ch 4
B-phase input
On 20.4~28.8V
Off 6V or less
P0006 Ch 6
Pulse input
Ch 6
A-phase
input
On 20.4~28.8V
Off 6V or less
P0007 Ch 7
Pulse input
Ch 6
B-phase
input
On 20.4~28.8V
Off 6V or less
P0008 Ch 0
Preset input
Ch 0
Preset input
On 20.4~28.8V
Off 6V or less
P0009 Ch 1
Preset input
- On 20.4~28.8V
Off 6V or less
P000A Ch 2
Preset input
Ch 2
Preset input
On 20.4~28.8V
Off 6V or less
P000B Ch 3
Preset input
- On 20.4~28.8V
Off 6V or less
P000C Ch 4
Preset input
Ch 4
Preset input
On 20.4~28.8V
Off 6V or less
P000D Ch 5
Preset input
- On 20.4~28.8V
Off 6V or less
P000E Ch 6
Preset input
Ch 6
Preset input
On 20.4~28.8V
Off 6V or less
P000F Ch 7
Preset input
- On 20.4~28.8V
Off 6V or less

 

2.7 k
2.7 k
2.7 k
2.7 k
2.7 k
2.7 k
2.7 k
2.7 k
5.6 k
5.6 k
5.6 k
5.6 k
5.6 k
5.6 k
5.6 k
5.6 k

Chapter 8 Built-in High-speed Counter Function
8-7

COM0 COM (input common)

Chapter 8 Built-in High-speed Counter Function
8-8
8.1.3 “S” type Functions
(1) Counter mode
A) High Speed counter module can count High Speed pulses which can not be processed by CPU
module’s counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (-
2,147,483,648 ~ 2,147,483,647).
B) Available input is 1-phase input, 2-phase input and CW/ CCW input.
C) Count increasing/decreasing methods are as follows;
(1) For 1-phase input: (1) Increasing/decreasing count operation by program setting
(2) Increasing/decreasing count operation by B-phase input signal
(2) For 2-phase input: setting by difference in phase between A-phase and B-phase
(3) For CW/CCW input: Increasing operation if B-phase is LOW with A-phase input, and
Decreasing operation if A-phase is LOW with B-phase input.
D) Auxiliary modes are as follows;
① Count Latch
Periodic Pulse Count
E) Pulse input mode
(1) Increasing/decreasing count operation by program setting
a) 1-phase 1-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by the
applicable program.

Increasing/Decreasing classification A-phase input pulse
rising
A-phase input pulse
falling
Increasing/decreasing count setting signal Off Increasing count -
Increasing/decreasing count setting signal On Decreasing count -

● Operation example
A-phase input pulse

Increasing Decreasing Increasing
signal
10
11 12 13 10 11
12
On
11
Off

Increasing/Decreasing
count setting Count value

Chapter 8 Built-in High-speed Counter Function
8-9
(2) Increasing/decreasing count operation by B-phase input signal
a) 1-phase 2-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by Bphase.

Increasing/Decreasing classification A-phase input pulse
rising
A-phase input pulse
falling
B-phase input pulse Off Increasing count -
B-phase input pulse On Decreasing count -

● Operation example
2) 2-phase count mode
a) 2-phase 4-multiplication operation mode
A-phase input pulse and B-phase input pulse count at rising/falling respectively. If A-phase
input is antecedent to B-phase input, increasing operation starts, and if B-phase input is
antecedent to A-phase input, decreasing operation starts.
▪ Operation example

Increasing Decreasing
2 11
3 4
5 8 9 13 1211 9 8 5 4
6 7 10 151 4 10 7 6 3 2

121314 B-phase input pulse
Count value
A-phase input pulse
Increasing

Decreasing
7
8 9 10 7 8
9
On
8
Off

Increasing
B-phase input pulse
Count value A-phase input pulse

Chapter 8 Built-in High-speed Counter Function
8-10
3) CW(Clockwise)/CCW(Counter Clockw`ise) operation mode
A-phase input pulse counts at rising , or B-phase input pulse counts at rising.
Increasing operation executed when B-phase input pulse is Low with A-phase input pulse at
rising, and Decreasing operation executed when A-phase input pulse is Low with B-phase
input pulse at rising.

Increasing/Decreasing
classification
A-phase input pulse High A-phase input pulse Low
B-phase input pulse High - decreasing count
B-phase input pulse Low Increasing count -

▪ Operation example
(2) Counter type
2 types of count (Linear counter, Ring counter) can be selected for the applicable use based on
functions.
▪ Counter mode is saved at the following special K area.

Mode Area per each channel (word) Reference*1)
Ch.0 Ch.1 Ch.2 Ch.3
Counter
mode
K300 K330 K360 K390 0 : 1 : linear ring

*1) If counter mode is set as value other than 0, 1, error code ‘20’ will occur.
B-phase input pulse
Count value
A-phase input pulse

Increasing Decreasing
7 11 7
8 9 10

10 9 8
Chapter 8 Built-in High-speed Counter Function
8-11
2 types of count can be selected for the applicable use based on functions.
A) Linear counter
■ Linear Count range: -2,147,483,648 ~ 2,147,483,647
■ If count value reaches the maximum value while increased, Carry will occur, and if count
value reaches the minimum value while decreased, Borrow will occur.
■ If Carry occurs, count stops and increasing is not available but decreasing is available.
■ If Borrow occurs, count stops and decreasing is not available but increasing is available.
B) Ring count
■ Ring Count range: user-defined minimum value ~ user-defined maximum value
■ Count display: If Ring Counted, user-defined minimum value of Ring Count is counted and
displayed, but the value is not displayed.
• Ring counter value is saved at the following special K area.

type Area per each channel (Double word) Reference
Ch.0 Ch.1 Ch.2 Ch.3
Ring counter
value
K310 K340 K270 K400

+2,147,483,647
Decreasing Increasing
Borrow
Carry
-2,147,483,648

Count start point

Chapter 8 Built-in High-speed Counter Function
8-12
1)During increasing count
■ Even if count value exceeds user-defined maximum value during increasing count,
Carry only occurs and count does not stop differently to Linear Count.
2) During decreasing count
■ Even if count value exceeds user-defined minimum value during decreasing count,
Borrow only occurs and count does not stop differently to Linear Count.
3) Operation when setting Ring Count based on present count value (during increasing
count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to increase up to the user-defined maximum value and
down to the user-defined minimum value and keeps counting after Carry occurs.
- Not the maximum but the minimum value only is displayed with count kept on as
shown below.
Borrow occurred
Ring Count
maximum value
Preset value
Ring Count
Minimum value (0)

Present positi on ○:
●:

Not included
Included

○:
●:
Present posit ion

Not included
Included
Carry occurred
Ring Count
maximum value
Preset value
Ring Count
minimum value

Chapter 8 Built-in High-speed Counter Function
8-13
4) Operation when setting Ring Count based on present count value (during decreasing count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to decrease down to the user-defined minimum value and up to
the user-defined maximum value and keeps counting after Borrow occurs.

1. Based on count value within or out of user-defined range, count will be decided to be within or out
of the range when setting Ring Count.
2. Ring Count setting when count value is out of the range is regarded as user’s mistake. The count
is not available within the Ring Count range.
3. Use preset function or the like when using Ring Count so to surely position the count value within
the range.
Remark

2,147,483,647
Ring Count
maximum value
-2,147,483,648
Ring Count
minimum value (0)
※If within the user-defined range
Carry occurred

Carry occurred
Present position ○:Not included
●:Included
Present position

※If out of the user-defined
range
2,147,483,647
Ring Count
maximum value
-2,147,483,648
Ring Count
minimum value
※If within the userdefined range

Borrow occurred
position
Borrow occurred
○:
●:I
ncluded
Present Present position

※If out of the userdefined range
Not included

Chapter 8 Built-in High-speed Counter Function
8-14
(3) Compared output
(a) High Speed counter module has a compared output function used to compare present count
value with compared value in size to output as compared.
(b) Available compared outputs are 2 for 1 channel, which can be used separately.
(c) Compared output conditions are 7 associated with >, =, < .
(d) Parameter setting
■ Compared output mode setting
■ Upper setting value is saved in special K area.

Compared output condition Memory address (word) Value*2)
Present Value < Compared Value Channel 0 : K302
Channel 1 : K330
Channel 2 : K358
Channel 3 : K386
Set to “0”
Present Value ≤ Compared Value Set to “1”
Present Value = Compared Value Set to “2”
Present Value ≥ Compared Value Set to “3”
Present Value > Compared Value Set to “4”
Compared value 1 ≤ Count value ≤ Compared value 2 Set to “5”
Count value Compared value 1,
Count value Compared value 2
Set to “6”

*2) If compared output value not set to 0~6 using counter, error code ‘23’ will be occurred.
■ In order to make actual comparison enabled after compared output condition set, the
compared enable signal is to be On.

Classification Area per channel Operation
Ch. 0 Ch. 1 Ch. 2 Ch. 3
Count enable signal K2600 K2700 K2800 K2900 0: N/A, 1: enable
Compared enable signal K2604 K2704 K2804 K2904 0: forbidden, 1: enable

Chapter 8 Built-in High-speed Counter Function
8-15
▪ In order to make external output, the compared equivalent output signal (P20~P27) must be
set. If Compared output contact is Off, Compared coincidence output signal (internal device)
is only output.

Classification Area per channel Operation
Ch. 0 Ch. 1 Ch. 2 Ch. 3
Compared equivalent
output signal
K2612 K2712 K2812 K2912 0: Compared output not
equivalent
1: Compared output
equivalent

• Comp output point (P20 ~ P27) setting
Chapter 8 Built-in High-speed Counter Function
8-16
(e) Detailed description for compared output
A) Mode 0 (Present value < Compared value)
■ If counted present value is less than compared value, output is sent out, and if present
value increases to be equal to or greater than compared value, output is not sent out.
B) Mode1 (Count value ≤ Compared value)
■ If present count value is less than or equal to compared value, output is sent out, and if
count value increases to be greater than compared value, output is not sent out.
123456 123457 123458 123459 123460 123461 123462

123460
)

Count value
Compared output
Min. set value
Compared Output
output signal
Compared Output
Enable
External output
(in case of
designated output

123456 123457 123458 123459 123460 123461 123462
123460

Count value
Compared Output
Min. set value
External output
(in case of
designated output)
Compared Output
output signal
Compared Output
Enable

Chapter 8 Built-in High-speed Counter Function
8-17
C) Mode 2 (Count value = Compared value)
■ If present count value is equal to compared value, output is sent out. In order to turn the
output Off, Compared output Enable and Compared output signal is to be On.
D) Mode 3 (Count value ≥ Compared value)
■ If present count value is greater than or equal to compared value, output is sent out, and if
count value decreases to be less than compared value, output is not sent out.
123456 123457 123458 123459 123460 123461 123462

123457

Count value
Compared Output
Min. set value
External output
(in case of
designated output)
Compared Output
output signal
Compared Output
Enable
Count value
123456 123457 123458 123459 123460 123461 123462
Compared Output
Min. set value
External output
(in case of
designated output)

123460

Compared Output
output signal
Compared Output
Enable

Chapter 8 Built-in High-speed Counter Function
8-18
E) Mode 4 (Count value > Compared value)
■ If present count value is greater than compared value, output is sent out, and if count value
decreases to be less than or equal to compared value, output is not sent out.
F) Mode 5
(Compared output Min. set value ≤ Count value ≤ Compared output Max. set value)
■ If present count value is greater than or equal to compared output Min. value and less than
or equal to compared output Max. set value, output is sent out, and if count value
increases/decreases to exceed compared value’s range, output is not sent out.
Count value 123456 123457 123458 123459 123460 123461 123462
Compared Output
Min. set value
Compared Output
Enable
Compared Output
signal
External output
(in case of
designated output)

123459

123456 123457 123458 123459 123460 123461 123462

123458
123460

Count value
Compared Output
Min. set value
Compared Output
Max. set value
Compared Output
Enable
Compared Output
signal
External Output
(in case of
designated output)

Chapter 8 Built-in High-speed Counter Function
8-19
G) Mode 6 (Count value ≤ Compared output Min. value, Count value ≥ Compared output Max. value)
■ If present count value is less than or equal to compared output Min. value and greater than
or equal to compared output Max. value, output is sent out, and if count value
increases/decreases to exceed compared value’s range, output is not sent out.
123456 123457 123458 123459 123460 123461 123462

123457
123461

Count value
Compared Output
Min. set value
Compared Output
Max. set value
Compared Output
Enable
Compared Output
output signal
External output
(in case of
designated output)

Chapter 8 Built-in High-speed Counter Function
8-20
(4) Carry signal
A) Carry signal occurs
(1) When count range maximum value of 2,147,483,647 is reached during Linear Count.
(2) When user-defined maximum value of Ring Count changed to the minimum value during Ring
Count.
B) Count when Carry Signal occurs
(1) Count stops if Carry occurs during Linear Count.
(2) Count does not stop even if Carry occurs during Ring Count.
C) Carry reset
(1) The Carry generated can be cancelled by Carry/Borrow reset signal On.

Classification Device area per channel
Channel 0 Channel 1 Channel 2 Channel 3
Carry signal K2610 K2710 K2810 K2910

(5) Borrow signal
A) Borrow signal occurs
(1) When count range minimum value of -2,147,483,648 is reached during Linear Count.
(2) When user-defined minimum value of Ring Count changed to the maximum value during
Ring Count.
B) Count when Borrow signal occurs
(1) Count stops if Borrow occurs during Linear Count.
(2) Count does not stop even if Borrow occurs during Ring Count.
C) Borrow reset
(1) The Borrow generated can be cancelled by Carry/Borrow reset signal On..

Classification Device area per channel
Channel 0 Channel 1 Channel 2 Channel 3
Borrow signal K2611 K2711 K2811 K2911

Chapter 8 Built-in High-speed Counter Function
8-21
(6) Revolution/Unit time
While auxiliary mode enable signal is On, it counts the number of input pulses for a specified time.
A) Setting
(1) Unit time setting
1) Input unit time and pulse number per 1 revolution
Setting value is saved at the following special K are and user can designate it directly.

Classification Device area per channel
Channel 0 Channel 1 Channel 2 Channel 3
Unit time (1~60000)*3) K322 K352 K382 K412

*3) If revolution per unit time is enabled and unit time value is other than 1~60000ms, error code
‘34’ occurs.
2) Input pulse number per 1 revolution

Classification Device area per channel
Channel 0 Channel 1 Channel 2 Channel 3
Pulse number /revolution
(1~60000)*4)
K323 K353 K383 K413

*4) If revolution per unit time is enabled and pulse number/revolution is other than 1~60000,
error code ‘35’ occurs.
3) If Count function of revolution per unit time is used, enable signal set by On.

Classification Device area per channel
Channel 0 Channel 1 Channel 2 Channel 3
Revolution/unit time
command
K2605 K2705 K2805 K2905

B) Count function of Revolution per Unit time is used to count the number of pulses for a
specified time while Enable signal is On.

Chapter 8 Built-in High-speed Counter Function
8-22
C) With the displayed number of pulses updated for a specified time and the number of
pulses per revolution input, Revolution/Unit time can be counted.
D) Number of Revolution per 1 second is indicated after number of pulse per 1 revolution is
set and time is set to 1 second (1000ms). In order to indicate by Revolutions per minute
(RPM), the operation is executed in program.
E) The example that number of pulse per 1 revolution set to ‘1’ and time is set to 1000 ms is
as shown below. (Ch0)
F) In order to indicate revolution per minute (RPM), the program is as shown below. In case
of DMUL operation, RPM value is saved 64 bit in D100~D103. If operated RPM value is
used, it can use to Word or Dword type according to system (case of RPM value is small
number).
Command
Count value
1000
500
0

300 400
700 500
350
1000
300
1000
100
1000
300
1000
200

Revolution
per time
(K264)

Chapter 8 Built-in High-speed Counter Function
8-23
G) The example that number of pulse per 1 revolution set to ‘10’ and time is set to 60,000 ms
is as shown below.
(7) Count latch
(a) When Count latch signal is On, present count value is latched.
(b) Setting
If present counter value is to latch, Count Latch function is set ‘Use’.

Classification Device area per channel
Channel 0 Channel 1 Channel 2 Channel 3
Count latch command K2606 K2706 K2806 K2906

▪ Count latch function is operated when Count latch signal is On. Namely, counter value is not
cleared when power supply Off =>On and mode change, it is counted from previous value.
▪ In latch counter function, internal or external preset function has to use for clearing present
value.
Command
Count value
1000
500
0

300 400
700 500
350
60000
30
60000
10
60000
30
60000
20

Revolution
per time

Chapter 8 Built-in High-speed Counter Function
8-24
(8) Preset function
It changes the current value into preset value.
There are two types of preset function, internal preset and external preset. External preset is fixed
as input contact point.
• Preset setting value is saved at the following special K area.

Type Area per each channel (Double word) Ref.
Ch.0 Ch.1 Ch.2 Ch.3
Internal preset K304 K334 K364 K394 -
External preset K306 K336 K366 K396 -

• Preset command is specified through the following special K area, external preset is used by
executing the designated input contact point after allowance bit is on.

Type Area per each channel (Bit) Ref.
Ch.0 Ch.1 Ch.2 Ch.3
Internal preset
command
K2601 K2701 K2801 K2901 -
External preset
allowance
K2602 K2702 K2802 K2902 -
External preset
command
P008 P009 P00A P00B -

Chapter 8 Built-in High-speed Counter Function
8-25
8.1.4 “H” type Functions
(1) Counter mode
A) High Speed counter module can count High Speed pulses which can not be processed by CPU
module’s counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (-
2,147,483,648 ~ 2,147,483,647).
B) Available input is 1-phase input, 2-phase input and CW/ CCW input.
C) Count increasing/decreasing methods are as follows;
(1) For 1-phase input: (1) Increasing/decreasing count operation by program setting
(2) Increasing/decreasing count operation by B-phase input signal
(2) For 2-phase input: setting by difference in phase between A-phase and B-phase
(3) For CW/CCW input: Increasing operation if B-phase is LOW with A-phase input, and
Decreasing operation if A-phase is LOW with B-phase input.
D) Auxiliary modes are as follows;
① Count Latch
Count function about the number of revolution per unit time
E) Pulse input mode
1) 1 phase count mode
A) Increasing/decreasing count operation by program setting
a) 1-phase 1-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by the
applicable program.

Increasing/Decreasing classification A-phase input pulse
rising
A-phase input pulse
falling
Increasing/decreasing count setting signal Off Increasing count -
Increasing/decreasing count setting signal On Decreasing count -

● Operation example
A-phase input pulse

Increasing Decreasing Increasing
signal
10
11 12 13 10 11
12
On
11
Off

Increasing/Decreasing
count setting Count value

Chapter 8 Built-in High-speed Counter Function
8-26
B) Increasing/decreasing count operation by B-phase input signal
b) 1-phase 2-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by B-phase.

Increasing/Decreasing classification A-phase input pulse
rising
A-phase input pulse
falling
B-phase input pulse Off Increasing count -
B-phase input pulse On Decreasing count -

● Operation example
2) 2-phase count mode
a) 2-phase 4-multiplication operation mode
A-phase input pulse and B-phase input pulse count at rising/falling respectively. If A-phase
input is antecedent to B-phase input, increasing operation starts, and if B-phase input is
antecedent to A-phase input, decreasing operation starts.
▪ Operation example

Increasing Decreasing
2 11
3 4
5 8 9 13 1211 9 8 5 4
6 7 10 151 4 10 7 6 3 2

121314 B-phase input pulse
Count value
A-phase input pulse
Increasing

Decreasing
7
8 9 10 7 8
9
On
8
Off

Increasing
B-phase input pulse
Count value A-phase input pulse

Chapter 8 Built-in High-speed Counter Function
8-27
3) CW(Clockwise)/CCW(Counter Clockwise) operation mode
A-phase input pulse counts at rising , or B-phase input pulse counts at rising.
Increasing operation executed when B-phase input pulse is Low with A-phase input pulse at
rising, and Decreasing operation executed when A-phase input pulse is Low with B-phase
input pulse at rising.

Increasing/Decreasing
classification
A-phase input pulse High A-phase input pulse Low
B-phase input pulse High - decreasing count
B-phase input pulse Low Increasing count -

▪ Operation example
(2) Counter type
2 types of count (Linear counter, Ring counter) can be selected for the applicable use based on
functions.
▪ Counter mode is saved at the following special K area.

Mode Area per each channel (word) Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Counter
mode
K300 K330 K360 K390 K2220 K2250 K2280 K2310 0 : 1 : linear ring

B-phase input pulse
Count value
A-phase input pulse

Increasing Decreasing
7 11 7
8 9 10

10 9 8
Chapter 8 Built-in High-speed Counter Function
8-28
A) Linear counter
■ Linear Count range: -2,147,483,648 ~ 2,147,483,647
■ If count value reaches the maximum value while increased, Carry will occur, and if count
value reaches the minimum value while decreased, Borrow will occur.
■ If Carry occurs, count stops and increasing is not available but decreasing is available.
■ If Borrow occurs, count stops and decreasing is not available but increasing is available.
B) Ring count
Set Ring Counter Min. Value and Max. value. Preset value and compared set value should
be in range of ring counter min. value and max. value.
Ring counter max. and min value is saved at the following special K area.

type Area per each channel (Double word) Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Ring counter
min. value
K308 K338 K368 K398 K2228 K2258 K2288 K2318 -
Ring counter
max. value
K310 K340 K270 K400 K2230 K2260 K2290 K2320 -

+2,147,483,647
Decreasing Increasing
Borrow
Carry
-2,147,483,648

Count start point

Chapter 8 Built-in High-speed Counter Function
8-29
▪ Range of Ring counter: user defined min. value ~ user defined max. value
▪ Counter display: in case of using ring counter, user defined max. value is not displayed.
a. During increasing count
■ Even if count value exceeds user-defined maximum value during increasing count,
Carry only occurs and count does not stop differently to Linear Count.
b. During decreasing count
■ Even if count value exceeds user-defined minimum value during decreasing count,
Borrow only occurs and count does not stop differently to Linear Count.
c. Operation when setting Ring Count based on present count value (during increasing
count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to increase up to the user-defined maximum value and
down to the user-defined minimum value and keeps counting after Carry occurs.
- Not the maximum but the minimum value only is displayed with count kept on as
shown below.
Borrow occurred
Ring Count
maximum value
Preset value
Ring Count
Minimum value (0)

Present positi on ○:Not
●:

included
Included

○:
●:
Present posit ion

Not included
Included
Carry occurred
Ring Count
maximum value
Preset value
Ring Count
minimum value

Chapter 8 Built-in High-speed Counter Function
8-30
d. Operation when setting Ring Count based on present count value (during decreasing count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to decrease down to the user-defined minimum value and up to
the user-defined maximum value and keeps counting after Borrow occurs.

1. Based on count value within or out of user-defined range, count will be decided to be within or out
of the range when setting Ring Count.
2. Ring Count setting when count value is out of the range is regarded as user’s mistake. The count
is not available within the Ring Count range.
3. Use preset function or the like when using Ring Count so to surely position the count value within
the range.
Remark

2,147,483,647
Ring Count
maximum value
-2,147,483,648
Ring Count
minimum value (0)
※If within the user-defined range
Carry occurred

Carry occurred
Present position ○:Not included
●:Included
Present position

※If out of the user-defined
range
2,147,483,647
Ring Count
maximum value
-2,147,483,648
Ring Count
minimum value
※If within the userdefined range

Borrow occurred
position
Borrow occurred
○:
●:I
ncluded
Present position

※If out of the userdefined range
Present
Not included

Chapter 8 Built-in High-speed Counter Function
8-31
(3) Compared output
(a) High Speed counter module has a compared output function used to compare present count
value with compared value in size to output as compared.
(b) Available compared outputs are 2 for 1 channel, which can be used separately.
(c) Compared output conditions are 7 associated with >, =, < .
(d) Parameter setting
■ Comp. output mode setting
■ Upper setting value is saved in special K area.

Compared output condition Memory address (word) Value*2)
Comp output 0 Comp output 1
Present Value < Compared Value Ch.0 K302
Ch.1 K332
Ch.2 K362
Ch.3 K392
Ch.4 K2222
Ch.5 K2252
Ch.6 K2282
Ch.7 K2312
Ch.0 K303
Ch.1 K333
Ch.2 K363
Ch.3 K393
Ch.4 K2223
Ch.5 K2253
Ch.6 K2283
Ch.7 K2313
Set to “0”
Present Value ≤ Compared Value Set to “1”
Present Value = Compared Value Set to “2”
Present Value ≥ Compared Value Set to “3”
Present Value > Compared Value Set to “4”
Compared value 1 ≤ Count value ≤ Compared value 2 Set to “5”
Count value Compared value 1,
Count value Compared value 2
Set to “6”

*2) If compared output mode set value is other than 0~6 at using counter, error code ‘23’ occurs.
Chapter 8 Built-in High-speed Counter Function
8-32
■ In order to output the compared output signal, compared output enable flag set to ‘1’ after
compared output condition set.

Classification Area per channel Operation
Ch. 0 Ch. 1 Ch. 2 Ch. 3 Ch. 4 Ch. 5 Ch. 6 Ch. 7
Count enable
signal
K2600 K2700 K2800 K2900 K21800 K21900 K22000 K22100 0:disable, 1:
enable
Compared 0
enable signal
K2604 K2704 K2804 K2904 K21804 K21904 K22004 K22104 0: disable, 1:
enable
Compared 1
enable signal
K2607 K2707 K2807 K2907 K21807 K21907 K22007 K22107 0: disable, 1:
enable

▪ In order to make external output, the compared coincidence output signal (P20~P2F) must
be set. If Compared output contact is ‘Off’ at Special Module Parameter Setting of XG5000,
Compared coincidence output signal (internal device) is only output.

Classification Area per channel Operation
Ch. 0 Ch. 1 Ch. 2 Ch.4 Ch.5 Ch. 6 Ch.7
Compared coincidence
output signal 0
K2612 K2712 K2812 K2912 K21812 K22012 K22112 0: Compared output Off
1: Compared output On
Compared coincidence
output signal 1
K2613 K2713 K2813 K2913 K21813 K22013 K22113 0: Compared output Off
1: Compared output On

• Comp. output point (P20 ~ P2F) setting
Chapter 8 Built-in High-speed Counter Function
8-33
(e) Detail of comparator output
It describes detail of comparator output (based on comparator output 0)
1) Mode 0 (Present value < Compared value)
■ If counted present value is less than the minimum value of compared output 0, output
is sent out, and if present value increases to be equal to or greater than the minimum
value of compared output 0, output is not sent out.
2) Mode1 (Count value ≤ Compared value)
■ If present count value is less than or equal to the minimum set value of compared
output 0, output is sent out, and if count value increases to be greater than the
minimum set value of compared output 0, output is not sent out.
123456 123457 123458 123459 123460 123461 123462

123460
)

Count value
Compared output 0
min. set value
Compared output 0
Output Signal
Compared output 0
Enable
External output
(in case of
designated outputCount value
Compared output

0
0
0
123456 123457 123458 123459 123460 123461 123462
123460

Min. set value
Compared Output output signal
Compared Output Enable
External output
(in case of
designated output)

Chapter 8 Built-in High-speed Counter Function
8-34
3) Mode 2 (Count value = Compared value)
■ If present count value is equal to the minimum set value of compared output 0, output is sent
out. In order to turn the output Off, Compared output Enable signal 0 or Compared
Coincidence Output Enable signal 0 is to be Off.
D) Mode 3 (Count value ≥ Compared value)
■ If present count value is greater than or equal to the minimum set value of compared output
0, output is sent out, and if count value decreases to be less than the minimum set value of
compared output 0, output is not sent out.
123456 123457 123458 123459 123460 123461 123462

123457
0
0
0

Count value
Compared output Min. set value
External output
(in case of designated output)
Compared Output output signal
Compared Output Enable
123456 123457 123458 123459 123460 123461 123462

123460
0
0
0

Count value
Compared output Min. set value
External output
(in case of designated output)
Compared Output output signal
Compared Output Enable

Chapter 8 Built-in High-speed Counter Function
8-35
E) Mode 4 (Count value > Compared Output value)
■ If present count value is greater than the minimum set value of compared output 0, output is
sent out, and if count value decreases to be less than or equal to the minimum set value of
compared output 0, output is not sent out.
F) Mode 5
(Section comparison: Min. set value of Compared Output 0 ≤ Count value ≤ Max. set value of
Compared Output 0)
■ If present count value is greater than or equal to the minimum set value of compared
output 0 and less than or equal to the maximum set value of compared output 0, output is
sent out, and if count value increases/decreases to exceed compared value’s range,
output is not sent out.
123456 123457 123458 123459 123460 123461 123462

123459
0
0
0

Count value
Compared Output Min. set value
External output
(in case of designated output)
Compared Output output signal
Compared Output output Enable
123456 123457 123458 123459 123460 123461 123462

123458
123460

Count value
Compared Output 0
Min. set value
Compared Output 0
Max. set value
External output
(in case of designated output

)

Compared Output 0
output signal
Compared Output 0
output Enable

Chapter 8 Built-in High-speed Counter Function
8-36
G) Mode 6 (Count value ≤ Min. set value of Compared Output 0 or Count value ≥ Max. set
value of Compared Output 0)
■ If present count value is less than or equal to the minimum set value of compared 0 and
greater than or equal to the maximum set value of compared 0, output is sent out, and if
count value increases/decreases to exceed compared value’s range, output is not sent out.
123456 123457 123458 123459 123460 123461 123462

123457
0
123461
0
0

Count value
Compared Output Min. set value
Compared Output 0
Max. set value
External output
(in case of designated
Compared Output output signal
Compared Output output Enable

Chapter 8 Built-in High-speed Counter Function
8-37
(4) 4 Carry signal
A) Carry signal occurs
(1) When count range maximum value of 2,147,483,647 is reached during Linear Count.
(2) When user-defined maximum value of Ring Count changed to the minimum value during Ring
Count.
B) Count when Carry Signal occurs
(1) Count stops if Carry occurs during Linear Count.
(2) Count does not stop even if Carry occurs during Ring Count.
C) Carry reset
(1) The Carry generated can be cancelled by Carry/Borrow reset signal On.

Classification Device area per channel
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Carry signal K2610 K2710 K2810 K2910 K21810 K21910 K22010 K22110

(5) Borrow signal
A) Borrow signal occurs
(1) When count range minimum value of -2,147,483,648 is reached during Linear Count.
(2) When user-defined minimum value of Ring Count changed to the maximum value during
Ring Count.
B) Count when Borrow signal occurs
(1) Count stops if Borrow occurs during Linear Count.
(2) Count does not stop even if Borrow occurs during Ring Count.
C) Borrow reset
(1) The Borrow generated can be cancelled by Carry/Borrow reset signal On.

Classification Device area per channel
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Borrow signal K2611 K2711 K2811 K2911 K21811 K21911 K22011 K22111

Chapter 8 Built-in High-speed Counter Function
8-38
(6) Revolution/Unit time
While the Flag about the number of revolution per unit time is On, it counts the number of input
pulses for a specified time.
A) Setting
(1) Unit time setting
1) Set the unit time and the number of pulse per 1 revolution.
Setting value is saved at the following special K area and user can designate directly.

Class Device per each channel (Word) Setting
range
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Unit time K322 K352 K382 K412 K2242 K2272 K2302 K2332 1~60000
Pulse/Rev
value
K323 K353 K383 K413 K2243 K2273 K2303 K2333 1~60000

2) In case of using Rev/unit time function, enable the following special K area

Class Device per each channel (Word) Operation
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Rev/unit
time
command
K2605 K2705 K2805 K2905 K21805 K21905 K22005 K22105 0: disable
1: enable

3) Rev/unit time value is saved at the following special K area.

Class Device per each channel (Word) Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Rev/unit
time
K264 K274 K284 K294 K2184 K2194 K2204 K2214 -

Chapter 8 Built-in High-speed Counter Function
8-39
B) Count function of Revolution/Unit time is used to count the number of pulses for a
specified time while auxiliary mode enable signal is On.
C) With the displayed number of pulses updated for a specified time and the number of
pulses per revolution input, Revolution/Unit time can be counted.
D) Number of Revolution per 1 second is indicated after number of pulse per 1 revolution is
set and time is set to 1 second (1000ms). In order to indicate by Revolutions per minute
(RPM), the operation is executed in program.
E) The example that number of pulse per 1 revolution set to ‘1’ and time is set to 1000 ms is
as shown below. (Ch0)
F) In order to indicate revolution per minute (RPM), the program is as shown below. In case
of DMUL operation, RPM value is saved 64 bit in D100~D103. If operated RPM value is
used, it can use to Word or Dword type according to system (case of RPM value is small
number).
Command
Count value
1000
500
0

300 400
700 500
350
1000
100
1000
300
1000
200
1000
150

Revolution
per time

Chapter 8 Built-in High-speed Counter Function
8-40
G) The example that number of pulse per 1 revolution set to ‘10’ and time is set to 60,000 ms
is as shown below.
(7) Count latch
▪ When Count latch signal is On, present count value is latched.
▪ Setting
If present counter value is to latch, Count Latch function is set ‘Use’.

Class Device area per channel Operation
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Count latch
command
K2606 K2706 K2806 K2906 K21806 K21906 K22006 K22106 0: disable
1: enable

▪ Count latch function is operated when Count latch signal is On. Namely, counter value is not
cleared when power supply Off =>On and mode change, it is counted from previous value.
▪ In latch counter function, internal or external preset function has to use for clearing present
value.
Command
Count value
1000
500
0

300 400
700 500
350
60000
10
60000
30
60000
20
60000
15

Revolution
per time

Chapter 8 Built-in High-speed Counter Function
8-41
(8) Preset function
It changes the current value into preset value.
There are two types of preset function, internal preset and external preset. External preset is fixed
as input contact point.
• Preset setting value is saved at the following special K area.

Type Area per each channel (Double word) Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Internal
preset value
K304 K334 K364 K394 K2224 K2254 K2284 K2314 -
External
preset value
K306 K336 K366 K396 K2226 K2256 K2286 K2316 -

• Preset command is specified through the following special K area, external preset is used by
executing the designated input contact point after allowance bit is on.

Type Area per each channel (Bit) Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Internal
preset
command
K2601 K2701 K2801 K2901 K21801 K21901 K22001 K22101 -
External
preset
allowance
K2602 K2702 K2802 K2902 K21802 K21902 K22002 K22102 -
External
preset
command
P008 P009 P00A P00B P00C P00D P00E P00F -

Chapter 8 Built-in High-speed Counter Function
8-42
8.2 Installation and Wiring
8.2.1 Precaution for wiring
Pay attention to the counteractions against wiring noise especially for High-speed pulse input.
1) Surely use twisted pair shielded cable, grounded with 3 class applied.
2) Keep away from power cable or I/O line which may cause noise.
3) Stabilized power should be used for filter.
▶ Connect A-phase only for 1-phase input.
▶ Connect A-phase and B-phase for 2-phase input.
8.2.2 Example of wiring
(1) In case of pulse generator (encoder) is voltage output type
Pulse Generator
CHSC

A

 

B
M

24V
24VG
(2) In case of pulse generator is open collector type
Pulse Generator

A
COM

 

B

24V
24VG
High-speed counter input
High-speed counter input

Chapter 8 Built-in High-speed Counter Function
8-43
8.3 Internal Memory
8.3.1 Special area for High-speed counter
Parameter and operation command area of built-in high-speed counter use a special K device.
If values set in parameter are changed, it works with the changed values. At the moment, makes sure
to use WRT command to save the changed value to flash. If not saved in flash, the changed values
with the power off => on and mode changed may not be maintained.
▪ The following example shows that the internal preset values of CH1 set in parameter are changed by
program and saved in flash.
- Receiving an order command (M000), it moves (MOV) the new internal preset value (5000) to the
CH1 present area (K332).
- To save the changed settings into flash, it uses WRT command. At the moment, slot information is
set to ’0’ in case of built-in function.
Slot info Unused
0: High speed counter
1: determining a location
2: PID

Chapter 8 Built-in High-speed Counter Function
8-44
(1) “S” type
(a) Parameter setting

Parameter Description Device area per channel Remark
Value Setting Ch 0 Ch 1 Ch 2 Ch 3
Counter
mode
h0000 Linear count K300 K330 K360 K390 Word
h0001 Ring count
Pulse input
mode
h0000 1 phase 1 input 1 multiplication K301 K331 K361 K391 Word
h0001 1 phase 2 input 1 multiplication
h0002 CW / CCW
h0003 2 phase 4 multiplication
Comp.
Output mode
h0000 (Magnitude) < K302 K332 K362 K392 Word
h0001 (Magnitude)
h0002 (Magnitude) =
h0003 (Magnitude)
h0004 (Magnitude) >
h0005 (Range) Include
h0006 (Range) Exclude
Internal
preset value
setting
-2,147,483,648 ~ 2,147,483,647 K304 K334 K364 K394 DWord
External
preset value
setting
-2,147,483,648 ~ 2,147,483,647 K306 K336 K366 K396 DWord

Chapter 8 Built-in High-speed Counter Function
8-45

Parameter Description Device area per channel Remark
Value Setting Ch 0 Ch 1 Ch 2 Ch 3

 

Ring counter
Max. value
setting
-2,147,483,648 ~ 2,147,483,647 K310 K340 K370 K400 DWord
Comp. Output
Min. value
setting
-2,147,483,648 ~ 2,147,483,647 K312 K342 K372 K402 DWord
Comp. output
Max. value
setting
-2,147,483,648 ~ 2,147,483,647 K314 K344 K374 K404 DWord
Comp. output
point
designation
HFFFF No use K320 K350 K380 K410 Word
h0000 P0020
h0001 P0021
h0002 P0022
h0003 P0023
h0004 P0024
h0005 P0025
h0006 P0026
h0007 P0027
Unit time [ms] 1 ~ 60,000 K322 K352 K382 K412 DWord
Pulse/Rev.value 1 ~ 60,000 K323 K353 K383 K413 DWord

Chapter 8 Built-in High-speed Counter Function
8-46
(b) Operation command

Parameter Device area per channel
Ch 0 Ch 1 Ch 2 Ch 3
Counter enabling K2600 K2700 K2800 K2900
Internal preset
designation of counter
K2601 K2701 K2801 K2901
External preset enabling
of counter
K2602 K2702 K2802 K2902
Designation of
decremental counter
K2603 K2703 K2803 K2903
Comp. output enabling K2604 K2704 K2804 K2904
Enabling of revolution
time per unit time
K2605 K2705 K2805 K2905
Designation of latch
counter
K2606 K2706 K2806 K2906
Carry signal (Bit) K2610 K2710 K2810 K2910
Borrow signal K2611 K2711 K2811 K2911
Comp. output signal K2612 K2712 K2812 K2912

(c) Area of monitoring

Parameter Device area per channel Remark
Ch 0 Ch 1 Ch 2 Ch 3
Current counter value K262 K272 K282 K292 DWord
Revolution time per unit time K264 K274 K284 K294 DWord

Chapter 8 Built-in High-speed Counter Function
8-47
(2) “H” type
(a) Parameter setting

Parameter Description Device area per channel Remark
Value Setting Ch 0 Ch 1 Ch 2 Ch 3
Ch 4 Ch 5 Ch 6 Ch 7
Counter
mode
h0000 Linear count K300 K330 K360 K390 Word
h0001 Ring count K2220 K2250 K2280 K2310
Pulse input
mode
setting
h0000 1 phase 1 input 1 multiplication K301 K331 K361 K391 Word
h0001 1 phase 2 input 1 multiplication
h0002 CW / CCW K2221 K2251 K2281 K2311 Word
h0003 2 phase 4 multiplication
Comp.
Output 0
mode
setting
h0000 (Magnitude) < K302 K332 K362 K392 Word
h0001 (Magnitude)
h0002 (Magnitude) =
h0003 (Magnitude)
h0004 (Magnitude) > K2222 K2252 K2282 K2312
h0005 (Range) Include
h0006 (Range) Exclude
Comp.
Output 1
mode
setting
h0000 (Magnitude) < K303 K333 K363 K393 Word
h0001 (Magnitude)
h0002 (Magnitude) =
h0003 (Magnitude)
h0004 (Magnitude) > K2223 K2253 K2283 K2313
h0005 (Range) Include
h0006 (Range) Exclude
Internal
preset value
setting
-2,147,483,648 ~ 2,147,483,647 K304 K334 K364 K394 DWord
K2224 K2254 K2284 K2314
External
preset
value
setting
-2,147,483,648 ~ 2,147,483,647 K306 K336 K366 K396 DWord
K2226 K2256 K2286 K2316

Chapter 8 Built-in High-speed Counter Function
8-48

Parameter Description Device area per channel Remark
Value Setting Ch 0 Ch 1 Ch 2 Ch 3
Ch 4 Ch 5 Ch 6 Ch 7
Ring counter
min. value
setting
-2,147,483,648 ~ 2,147,483,645 K308 K338 K368 K398 DWord
K2228 K2258 K2288 K2318
Ring counter
max. value
setting
-2,147,483,646 2,147,483,647 K310 K340 K370 K400 DWord
K2230 K2260 K2290 K2320
Comp. output
min. value
setting
-2,147,483,648 ~ 2,147,483,647 K312 K342 K372 K402 DWord
K2232 K2262 K2292 K2322
Comp. output
max. value
setting
-2,147,483,648 ~ 2,147,483,647 K314 K344 K374 K404 DWord
K2234 K2264 K2294 K2324
Comp. output 0
point
designation
HFFFF No use K320 K350 K380 K410 Word
h0000 P0020
h0001 P0021
h0002 P0022
h0003 P0023
h0004 P0024
h0005 P0025
h0006 P0026
h0007 P0027
h0008 P0028 K2240 K2270 K2300 K2330
h0009 P0029
h000A P002A
h000B P002B
h000C P002C
h000D P002D
h000E P002E
h000F P002F

Chapter 8 Built-in High-speed Counter Function
8-49

Parameter Description Device area per channel Remark
Value Setting Ch 0 Ch 1 Ch 2 Ch 3
Ch 4 Ch 5 Ch 6 Ch 7
Comp. output 1
point
designation
HFFFF No use K321 K351 K381 K411 Word
h0000 P0020
h0001 P0021
h0002 P0022
h0003 P0023
h0004 P0024
h0005 P0025
h0006 P0026
h0007 P0027
h0008 P0028 K2241 K2271 K2301 K2331
h0009 P0029
h000A P002A
h000B P002B
h000C P002C
h000D P002D
h000E P002E
h000F P002F
Unit time [ms] 1 ~ 60,000 ms K322 K352 K382 K412 Word
K2242 K2272 K2302 K2332
Pulse/Rev.value 1 ~ 60,000 K323 K353 K383 K413 Word
K2243 K2273 K2303 K2333

Chapter 8 Built-in High-speed Counter Function
8-50
(b) Operation command

Parameter Device area per channel
Ch 0 Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7
Counter enabling K2600 K2700 K2800 K2900 K21800 K21900 K22000 K22100
Internal preset designation
of counter
K2601 K2701 K2801 K2901 K21801 K21901 K22001 K22101
External preset enabling of
counter
K2602 K2702 K2802 K2902 K21802 K21902 K22002 K22102
Designation of decremental
counter
K2603 K2703 K2803 K2903 K21803 K21903 K22003 K22103
Comp. output 0 enabling K2604 K2704 K2804 K2904 K21804 K21904 K22004 K22104
Comp. output 1 enabling K2607 K2707 K2807 K2907 K21807 K21907 K22007 K22107
Enabling of revolution time
per unit time
K2605 K2705 K2805 K2905 K21805 K21905 K22005 K22105
K2606 K2706 K2806 K2906 K21806 K21906 K22006 K22100
Carry signal (Bit) K2610 K2710 K2810 K29100 K21810 K21910 K22010 K22110
Borrow signal K2611 K2711 K2811 K29101 K21811 K21911 K22011 K22111
Comp. output 0 signal K2612 K2712 K2812 K29102 K21812 K21912 K22012 K22112
Comp. output 1 signal K2613 K2713 K2813 K29103 K21813 K21913 K22013 K22113

Designation of latch
counter
(c) Area of monitoring

Parameter Device area per channel
Ch 0 Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7
Current counter value K262 K272 K282 K292 K2182 K2192 K2202 K2212
Revolution per unit time K264 K274 K284 K294 K2184 K2194 K2204 K2214

Chapter 8 Built-in High-speed Counter Function
8-51
8.3.2 Error code
It describes errors of the built-in high-speed counter.
▪ Error occurred is saved in the following area.

Category Device area per channel Remark
Ch0 Ch1 Ch2 Ch3 Ch4 Ch5 Ch6 Ch7
Error code K266 K276 K286 K296 K2186 K2196 K2206 K2216 Word

▪ Error codes and descriptions

Error code
(Decimal)
Description Remark
20 Counter type is set out of range
21 Pulse input type is set out of range
22 Requesting #1(3,5,7)channel Run during the 2-phase operation of #0(2,4,6)
* During #0(2,4,6) channel 2-phase operation, using #1(3,5,7)channel is not
possible.
23 Compared output type setting is set out of range.
25 Internal preset value is set out of counter range
26 External present value is set out of counter range
27 Ring counter setting is set out of range
* Note ring counter setting should be 2 and more.
28 Compared output min. value is set out of permissible max. input range
29 Compared output max. value is set out of permissible max. input range
30 Error of Compared output min. value>Compared output max. value
31 Output point designation value of Compared output is set out of range
34 Set value of Unit time is out of the range
35 Pulse value per 1 revolution is set out of range
36 Compared output min. value is set out of permissible max. input range
(Compared output 1)
“H” type
37 Compared output max. value is set out of permissible max. input range
(Compared output 1)
“H” type
38 Error of Compared output min. value>Compared output max. value
(Compared output 1)
“H” type
39 Output point designation value of Compared output is set out of range
(Compared output 1)
“H” type

 

Remark

Chapter 8 Built-in High-speed Counter Function
8-52

▪ If two and more errors occur, the module saves the latter error code and removes
the former one.

8.4 Examples: Using High-speed Counter
It describes examples of using high-speed counter.
1) Setting high-speed counter parameter
How to set types of parameters to operate a high-speed counter is described as follows.
A) Set
Internal Parametersin the basic project window.
B) Selecting high-speed counter opens a window to set high-speed counter parameters as follows.
For details regarding each parameter setting, refer to 8.1~8.3.
(Every parameter settings are saved in the special K device area.)

Chapter 8 Built-in High-speed Counter Function
8-53
C) Turn ‘ON’ the high-speed counter Enable signal (CH0:K2600) in the program.
D) To use additional functions of the high-speed counter, you needs to turn on the flag allowing
an operation command.
* Refer to 2. Operation Command, <8.3.1 Special K Area for High-speed Counter>
For instance, turn on 2605 bit if among additional functions, rotation number function is used.
E) Upon the setting, download program and parameter to PLC.

Chapter 8 Built-in High-speed Counter Function
8-54
2) Monitoring and setting command
Monitoring and command setting of high-speed counter are described as follows.
A) If starting a monitor and clicking a Special Module Monitor, the following window is opened.

Chapter 8 Built-in High-speed Counter Function
8-55
B) Clicking
Monitorshows monitor and test window of high-speed counter.

Item Description
FLAG Monitor Show flag monitoring and command window of high-speed counter
Start Monitoring Start monitoring each item (special K device area monitor).
Test Write each item setting to PLC.
(Write the setting to special K device)
Close Close monitor

Chapter 8 Built-in High-speed Counter Function
8-56
C) Clicking
Start Monitoringshows the high-speed counter monitor display, in which you
may set each parameter. At this moment, if any, changed values are not saved if power off=>
on or mode is changed.
D) Clicking
FLAG Monitorshows the monitor of each flag in high-speed counter, in which
you may direct operation commands by flags (clicking commands reverse turn).

Chapter 9 Installation and Wiring
9 1
Chapter 9 Installation and Wiring
9.1 Safety Instruction
Please design protection circuit at the external of PLC for entire system to operate safely because an
abnormal output or an malfunction may cause accident when any error of external power or malfunction
of PLC module.
(1) It should be installed at the external side of PLC to emergency stop circuit, protection circuit,
interlock circuit of opposition action such as forward /reverse operation and interlock circuit for
protecting machine damage such as upper/lower limit of positioning.
(2) If PLC detects the following error, all operation stops and all output is off.
(Available to hold output according to parameter setting)
(a) When over current protection equipment or over voltage protection operates
(b) When self diagnosis function error such as WDT error in PLC CPU occurs
In case of error about IO control part that is not detected by PLC CPU, all output is off.
Design Fail Safe circuit at the external of PLC for machine to operate safely. Refer to 10.2 Fail Safe
circuit.
(1) Because of error of output device, Relay, TR, etc., output may not be normal. About output signal that
may cause the heavy accident, design supervisory circuit to external.
In case load current more than rating or over current by load short flows continuously, danger of heat, fire
may occur so design safety circuit to external such as fuse.
Design for external power supply to be done first after PLC power supply is done. If external power
supply is done first, it may cause accident by misoutput, misoperation.
In case communication error occurs, for operation status of each station, refer to each communication
manual.
In case of controlling the PLC while peripheral is connected to CPU module, configure the interlock circuit
for system to operate safely. During operation, in case of executing program change, operation status
change, familiarize the manual and check the safety status. Especially, in case of controlling long
distance PLC, user may not response to error of PLC promptly because of communication error or etc.
Limit how to take action in case of data communication error between PLC CPU and external device
adding installing interlock circuit at the PLC program.
Danger
Chapter 9 Installation and Wiring
9 2
Don’t close the control line or communication cable to main circuit or power line. Distance should be more
than 100mm. It may cause malfunction by noise.
In case of controlling lamp load, heater, solenoid valve, etc. in case of Off -> On, large current (10 times of
normal current) may flows, so consider changing the module to module that has margin at rated current.
Process output may not work properly according to difference of delay of PLC main power and external
power for process (especially DC in case of PLC power On-Off and of start time.
For example, in case of turning on PLC main power after supplying external power for process, DC output
module may malfunction when PLC is on, so configure the circuit to turn on the PLC main power first
Or in case of external power error or PLC error, it may cause the malfunction.
Not to lead above error to entire system, part causing breakdown of machine or accident should be
configured at the external of PLC
Danger
Chapter 9 Installation and Wiring
9 3
9.1.1 Fail safe circuit
(1) example of system design (In case of not using ERR contact point of power module)
In case of AC In case of AC . DC
(2)
시스템 설계 회로 예 (전원모듈의 ERR 접점을 사용하지 않는 경우)
P080
0.5 초 간격으로 On/Off 를 반복하므로 무접점의 출력모듈을 사용하여 주십시오.
(5)
소비 전력 계산
PLC 제어반내의 온도는 사용주변 온도인 55이하로 억제할 필요가 있습니다.
제어반내의 방열 설계를 위하여 내부에 있는 각기긱들의 평균 소비 전력(발열량)
(a) PLC
시스템의 전력 소비 블록도
Check direct
current
Signal input
Timer setting
which DC input
signal is
configured.
Voltage relay
equipped
Output for warning
(Lamp or buzzer)
RUN by F009C
Power off to output
device
Output for warning
(Lamp or buzzer)
Power Off to
output device
Configure part that
lead opposite operation
or breakdown such as
interlock circuit
forward, reverse
revolution by external
interlock circuit
(Emergency
stop,
stop by limit
switch)
Emergency stop,
Stop by limit
Start sequence of power
In case of AC
(1) Turn on power
(2) Run CPU.
(3) Turn on start switch
(4) Output device runs by program through
magnetic contactor (MC) [On]
Start sequence of power
In case of AC DC
Run CPU after power is on
(1) Turn on RA2 as DC power on
(2) Turn on timer after DC power is stable.
(3) Turn on start switch
(4) Output device runs by program through
magnetic contactor (MC) [On]
F0045
F009C
F0045
Pm
Pn
Pm
Pm
F009C
Pm
Pm
Tm
Pm
Pm
PLC RUN output

Start available as
RA1

Run by F009C
Trans
Fuse
Start
switch
Stop
SW Input module
Program
Output module
Output module
Output module
Output module
Start Program
switch
Stop
SW
Trans
Fuse
Trans
Fuse
Fuse
DC power
Power
Power

Chapter 9 Installation and Wiring
9 4
(2) System design circuit example (In case of using ERR contact point of power module)

Checking
current
DC

Signal input
Timer setting
which DC input
signal is
configured.
Output for warning
(Lamp or buzzer)
(Emergency stop,
stop by limit
)
Stop by ERR
Error Off
Configure part that
lead opposite operation
or breakdown such as
interlock circuit
forward, reverse
revolution by external
interlock circuit
Pm
Pm
Tm
Pm
Tm
Pm
Pn
Pm
F0045
F009C
ERR
ERR contact point off
to output device
power off
RA3
Voltage relay
equipped
Start stop circuit
PLC RUN output
Available to start as
RA1
Start sequence of power
In case of AC DC
(1) Run CPU after turning on power.
(2) Turn on RA2 with DC power supplied
(3) Turn on timer after DC power is stable
(4) Turn on start switch Output device runs by program through magnetic
contactor (MC) [On]
Trans
Fuse
Trans
Fuse
DC power
Fuse
Start
SW
Power
Program
Stop SW
Output module
Output module

Chapter 9 Installation and Wiring
9 5
(3) Fail safe countermeasure in case of PLC error
Error of PLC CPU and memory is detected by self diagnosis but in case error occurs in IO control part, etc., CPU
can detect the error. At this case, though it is different according to status of error, all contact point is on or off, so
safety may not be guaranteed. Though we do out best to our quality as producer, configure safety circuit
preparing that error occurs in PLC and it lead to breakdown or accident.
System example

Main
unit
Input
16
point
Input
16
point
Input
16
point
Input
16
point
Output
16
point
Output
16
point

Equip output module for fail safe to last slot of system.
[Fail safe circuit example]
Since P80 turn on/off every 0.5s, use TR output.
F0093
P80
P80
0.5s 0.5s
P80
P81
~
P8F
24V
0V
T1 T2
MC
- +
DC24
V
MC
T1
T2
L L
External load
CPU unit
Output module
On delay timer
Off delay timer
Output module for fail safe

Chapter 9 Installation and Wiring
9 6
9.1.2 PLC heat calculation
(1) Power consumption of each part
(a) Power consumption of module
The power conversion efficiency of power module is about 70% and the other 30% is gone with
heat; 3/7 of the output power is the pure power consumption. Therefore, the calculation is as follows.
Wpw = 3/7 {(I5V X 5) + (I24V X 24)} (W)
I
5V : power consumption of each module DC5V circuit(internal current consumption)
I
24V: the average current consumption of DC24V used for output module
(current consumption of simultaneous On point)
If DC24V is externally supplied or a power module without DC24V is used, it is not applicable.
(b) Sum of DC5V circuit current consumption
The DC5V output circuit power of the power module is the sum of power consumption used by each
module.
W5V = I5V X 5 (W)
(c) DC24V average power consumption(power consumption of simultaneous On point)
The DC24V output circuit’s average power of the power module is the sum of power consumption
used by each module.
W24V = I24V X 24 (W)
(d) Average power consumption by output voltage drop of the output module(power consumption of
simultaneous On point)
Wout = Iout X Vdrop X output point X simultaneous On rate (W)
I
out : output current (actually used current) (A)
V
drop: voltage drop of each output module (V)
Main unit
input

constant
Voltage
transforme
r

AC power
100V~240V
Comm. Comm. output input Special
DC5V
DC24V
load
Iout Iin
I5V
I24V
AC power
DC 100V~240V
power
24V

Chapter 9 Installation and Wiring
9 7
(e) Input average power consumption of input module
(power consumption of simultaneous On point)
Win = lin X E X input point X simultaneous On rate (W)
I
in: input current (root mean square value in case of AC) (A)
E : input voltage (actually used voltage) (V)
(f) Power consumption of special module power assembly
WS = I5V X 5 + I24V X 24 + I100V X 100 (W)
The sum of power consumption calculated by each block is the power consumption of the entire
PLC system.
W = WPW + W5V + W24V + Wout + Win + Ws (W)
Calculate the heats according to the entire power consumption(W) and review the temperature
increase within the control panel.
The calculation of temperature rise within the control panel is displayed as follows.
T = W / UA [
C]
W : power consumption of the entire PLC system (the above calculated value)
A : surface area of control panel [m
2]
U : if equalizing the temperature of the control panel by using a fan and others - - - 6
If the air inside the panel is not ventilated - - - - - - - - - - 4
If installing the PLC in an air-tight control panel, it needs heat-protective(control) design considering the
heat from the PLC as well as other devices. If ventilating by vent or fan, inflow of dust or gas may affect
the performance of the PLC system.

Chapter 9 Installation and Wiring
9 8
9.2 Attachment/Detachment of Modules
9.2.1 Attachment/Detachment of modules
Caution in handling
Use PLC in the range of general specification specified by manual.
In case of using out of range, it may cause electric shock, fire, malfunction, damage of product.
Module must be mounted to hook for fixation properly before its fixation. The module may be damaged
from over-applied force. If module is not mounted properly, it may cause malfunction.
Do not drop or impact the module case, terminal block connector.
Do not separate the PCB from case.
(1) Equipment of module
Eliminate the extension cover at the upper of module.
Push the module and connect it in agreement with hook for fixation of four edges and hook for
connection at the bottom.
After connection, get down the hook for fixation at the upper part and lower part and fix it completely.
Warning
Module fixation (Hook)
Chapter 9 Installation and Wiring
9 9
(2) Detachment of module
Get up the hook for fixation of upper part and lower part and disconnect it.
Detach the module with two hands. (Don’t force over-applied force.)
When separating module, don’t force over-applied power. If so, hook may be damaged.
Hook for module fixation
Caution
Chapter 9 Installation and Wiring
9 10
(3) Installation of module
XGB PLC main unit and expansion unit are having the hook for DIN rail (rail width 35mm).
So they can be installed at DIN rail.
(a) In case of installing at DIN rail
Pull out the hook for DIN rail in the bottom of module and install the module at DIN rail.
After installing the module at DIN rail, push the hook and fix the module at DIN rail.
(b) In case of installing at the panel
You can install the XGB compact type main unit at the panel directly by using screw hole.
When installing the product at the panel directly, use M4 type screw
Hook for DIN rail
Panel
Hole for installation

Chapter 9 Installation and Wiring
9 11
(4) Module equipment location
Keep the following distance between module and structure or part for well ventilation and easy detachment
and attachment.
*1 : In case height of wiring duct is less than 50 mm (except this 40mm or above)
*2 : In case of equipping cable without removing near module, 20mm or above
*3 : In case of connector type, 80mm or above
(5) Module equipment direction
(a) For easy ventilation, install like the following figure.
Panel
PLC
20

or abov e*3

30 or above *1
30 or above*1

5 or above*1 5

or above
Chapter 9 Installation and Wiring
9 12
(b) Don’t install like the following figure
(6) Distance with other device
To avoid radiation noise or heat, keep the distance between PLC and device (connector and relay) as far as the
following figure.
Device installed in front of PLC: 100
or above
Device installed beside PLC: 50
or above
100mm or above
50mm or above
50mm or above

Chapter 9 Installation and Wiring
9 13
9.2.2 Caution in handling
Here describes caution from open to install
Don’t drop or impact product.
Don’t disassemble the PCB from case. It may cause the error.
In case of wiring, make sure foreign substance not to enter upper part of module. If it enters, eliminate it.
(1) Caution in handling IO module
It describes caution in handling IO module.
(a) Recheck of IO module specification
For input module, be cautious about input voltage, for output module, if voltage that exceeds the max.
open/close voltage is induced, it may cause the malfunction, breakdown or fire.
(b) Used wire
When selecting wire, consider ambient temp, allowed current and minimum size of wire is
AWG22(0.3mm
2) or above.
(c) Environment
In case of wiring IO module, if device or material that induce high heat is too close or oil contacts wire
too long time, it may cause short, malfunction or error.
(d) Polarity
Before supplying power of module which has terminal block, check the polarity.
(e) Wiring
In case of wiring IO with high voltage line or power line, induced obstacle may cause error.
Let no cable pass the IO operation indication part (LED).
(You can’t discriminate the IO indication.)
In case induced load is connected with output module, connect the surge killer or diode load to load
in parallel. Connect cathode of diode to + side of power.
(f) Terminal block
Check close adhesion status. Let no foreign material of wire enter into PLC when wring terminal block
or processing screw hole. At this case, it may cause malfunction.
(g) Don’t impact to IO module or don’t disassemble the PCB from case.
OUT
COM
Output module
Induced load
Surge killer
OUT
COM
Output module
Induced load
Diode
+ -
Chapter 9 Installation and Wiring
9 14
9.3 Wire
In case using system, it describes caution about wiring.
When wiring, cut off the external power.
If all power is cut, it may cause electric shock or damage of product.
In case of flowing electric or testing after wiring, equip terminal cover included in product. It not, it may cause
electric shock.
Do D type ground (type 3 ground) or above dedicated for PLC for FG and LG terminal. It may cause electric
shock or malfunction.
When wiring module, check the rated voltage and terminal array and do properly.
If rating is different, it may cause fire, malfunction.
For external connecting connector, use designated device and solder.
If connecting is not safe, it may cause short, fire, malfunction.
For screwing, use designated torque range. If it is not fit, it may cause short, fire, malfunction.
Let no foreign material enter such as garbage or disconnection part into module. It may cause fire, malfunction,
error.
9.3.1Power wiring
(1) In case voltage regulation is larger than specified, connect constant voltage transformer.
(2) Connect noise that include small noise between line and earth.
(When there are many noise, connect insulated transformer.)
Caution
Danger
AC power

Constant
voltage
transformer

AC power
100V~240V
RS-232C
01
02
03
04
05
06
07
19
20
08
09
10
11
12
13
14
15
16
17
18
B A
01
02
03
04
05
06
07
19
20
08
09
10
11
12
13
14
15
16
17
18
B A
00
IN
10
20
30
O UT
01
11
21
31
02
12
22
32
03
13
23
33
04
14
24
34
05
15
25
35
06
16
26
36
07
17
27
37
08
18
28
38
09
19
29
39
0A
1A
2A
3A
0B
1B
2B
3B
0C
1C
2C
3C
0D
1D
2D
3D
0E
1E
2E
3E
0F
1F
2F
3F
RUN
PWR
ERR
In:24VDC, 7m A
185VA 50/60Hz
XBC- DR64H
AC100-240V
Chapter 9 Installation and Wiring
9 15
(3) Isolate the PLC power, I/O devices and power devices as follows.
(4) If using DC24V of the power module
(a) Do not connect DC24V of several power modules in parallel. It may cause the destruction of a module.
(b) If a power module can not meet the DC24V output capacity, supply DC24V externally as presented
below.
(5)AC110V/AC220V/DC24V cables should be compactly twisted and connected in the shortest distance.
(6) AC110V/AC220V cable should be as thick as possible(2mm
2) to reduce voltage drop.
(7) AC110V/ DC24V cables should not be installed close to main circuit cable(high voltage/high current) and I/O
signal cable. They should be 100mm away from such cables

Main unit
AC100-240V

AC220V
Main
power

Constant
Voltage
Transformer

PLC
power
Main circuit device
IO power

I O 24V
CPU

 

I O 24V
CPU

Power
Supply
DC 24V

I O 24V
CPU

Chapter 9 Installation and Wiring
9 16
(8) To prevent surge from lightning, use the lightning surge absorber as presented below.

Note
(1) Isolate the grounding(E1) of lightning surge absorber from the grounding(E2) of the PLC.
(2) Select a lightning surge absorber type so that the max. voltage may not the specified
allowable voltage of the absorber.

(9) When noise may be intruded inside it, use an insulated shielding transformer or noise filter.
(10) Wiring of each input power should be twisted as short as possible and the wiring of shielding transformer or
noise filter should not be arranged via a duct.
E2
PLC
I/O device
E1

Surge absorber to prevent
lighting
낙뢰 방지용 서지 업소

Chapter 9 Installation and Wiring
9 17
9.3.2 I/O Device wiring
(1) The size of I/O device cable is limited to 0.3~2 mm2 but it is recommended to select a size(0.3 mm2) to use
conveniently.
(2) Please isolate input signal line from output signal line.
(3) I/O signal lines should be wired 100mm and more away from high voltage/high current main circuit cable.
(4) Batch shield cable should be used and the PLC side should be grounded unless the main circuit cable and
power cable can not be isolated.
(5) When applying pipe-wiring, make sure to firmly ground the piping.
9.3.3 Grounding wiring
(1) The PLC contains a proper noise measure, so it can be used without any separate grounding if there is a
large noise. However, if grounding is required, please refer to the followings.
(2) For grounding, please make sure to use the exclusive grounding.
For grounding construction, apply type 3 grounding(grounding resistance lower than 100
)
(3) If the exclusive grounding is not possible, use the common grounding as presented in B) of the figure below.
A) Exclusive grounding : best B) common grounding : good C) common grounding: defective
(4) Use the grounding cable more than 2 mm
2. To shorten the length of the grounding cable, place the grounding
point as close to the PLC as possible.
(5) If any malfunction from grounding is detected, separate the FG of the base from the grounding.

input
output
RA

PLC Shield cable
DC

PLC

 

Other devices

 

PLC

 

Other devices

 

PLC Other devices

Type 3 Grounding Type 3 Grounding
제 3 종 접지
Chapter 9 Installation and Wiring
9 18
9.3.4 Specifications of wiring cable
The specifications of cable used for wiring are as follows.

Types of external
connection
Cable specification (mm2)
Lower limit Upper limit
Digital input 0.18 (AWG24) 1.5 (AWG16)
Digital output 0.18 (AWG24) 2.0 (AWG14)
Analogue I/O 0.18 (AWG24) 1.5 (AWG16)
Communication 0.18 (AWG24) 1.5 (AWG16)
Main power 1.5 (AWG16) 2.5 (AWG12)
Protective grounding 1.5 (AWG16) 2.5 (AWG12)

Chapter 10 Maintenance
10-1
Chapter 10 Maintenance
Be sure to perform daily and periodic maintenance and inspection in order to maintain the PLC in the best
conditions.
10.1 Maintenance and Inspection
The I/O module mainly consist of semiconductor devices and its service life is semi-permanent. However,
periodic inspection is requested for ambient environment may cause damage to the devices. When inspecting
one or two times per six months, check the following items.

Check Items Judgment Corrective Actions
Change rate of input voltage Within change rate of input
voltage
(Less than
-15% to +20% )
Hold it with the allowable range.
Power supply for input/output Input/Output specification of
each module
Hold it with the allowable range of each module.
Ambient
environment
Temperature 0 ~ + 55 Adjust the operating temperature and humidity with the
defined range.
Humidity 5 ~ 95%RH
Vibration No vibration Use vibration resisting rubber or the vibration prevention
method.
Play of modules No play allowed Securely enrage the hook.
Connecting conditions of
terminal screws
No loose allowed Retighten terminal screws.
Spare parts Check the number of
Spare parts and their
Store conditions
Cover the shortage and improve the conditions.

10.2 Daily Inspection
The following table shows the inspection and items which are to be checked daily.

Check Items Check Points Judgment Corrective
Actions
Connection conditions of
base
Check the screws. Screws should not be loose. Retigh Screwsten .
Connection conditions of
Input/Output module
Check the connecting screws
Check module cover.
Screws should not be loose. Retighten Screws.
Connecting conditions of
terminal block or extension
cable
Check for loose mounting screws. Screws should not be loose. Retighten
Screws.
Check the distance between solderless
terminals.
Proper clearance should be provided. Correct.
Connecting of expansion cable. Connector should not be loose. Correct.
LED
indicator
PWR LED Check that the LED is On. On(Off indicates an error) See chapter 5.
Run LED Check that the LED is On during Run. On (flickering indicates an error) See chapter 5.
ERR LED Check that the LED is Off during Run. Off(On indicates an error) See chapter 5.
Input LED Check that the LED turns On and Off. On when input is On,
Off when input is off.
See chapter 5.
Output LED Check that the LED turns On and Off On when output is On,
Off when output is off
See chapter 5.

Chapter 10 Maintenance
10-2
10.3 Periodic Inspection
Check the following items once or twice every six months, and perform the needed corrective actions.

Check Items Checking Methods Judgment Corrective
Actions
Ambient
environment
Ambient
temperature
-. Measure with thermometer
and hygrometer
-. measure corrosive gas
0 ~ 55 °C Adjust to general
standard
(Internal environmental
standard of control
section)
Ambient Humidity 5 ~ 95%RH
Ambient pollution
level
There should be no
corrosive gases
PLC
Conditions
Looseness,
Ingress
The module should be move
the unit
The module should be
mounted securely.
Retighten screws
dust or foreign
material
Visual check No dust or foreign material
Connecting
conditions
Loose terminal
screws
Re-tighten screws Screws should not be loose Retighten
Distance between
terminals
Visual check Proper clearance Correct
Loose connectors Visual check Connectors should not be
loose.
Retighten connector
mounting
screws
Line voltage check Measure voltage between
input terminals
DC24V: DC20.4 ~ 28.8V Change supply power

Chapter 11 Troubleshooting
11-1
Chapter 11 Troubleshooting
The following explains contents, diagnosis and corrective actions for various errors that can occur during system
operation.
11.1 Basic Procedure of Troubleshooting
System reliability not only depends on reliable equipment but also on short downtimes in the event of fault. The
short discovery and corrective action is needed for speedy operation of system. The following shows the basic
instructions for troubleshooting.
1) Visual checks
Check the following points.
Machine operating condition (in stop and operation status)
Power On/Off
Status of I/O devices
Condition of wiring (I/O wires, extension and communications cables)
Display states of various indicators (such as POWER LED, RUN LED, ERR LED and I/O LED)
After checking them, connect peripheral devices and check the operation status of the PLC and the
program contents.
2) Trouble Check
Observe any change in the error conditions during the following.
Switch to the STOP position, and then turn the power on and off.
3) Narrow down the possible causes of the trouble where the fault lies, i.e.:
Inside or outside of the PLC ?
I/O module or another module?
PLC program?
11.2 Troubleshooting
This section explains the procedure for determining the cause of troubles as well as the errors and corrective
actions.
Symptoms
Is the power LED turned
Off ?
Flowchart used when the POWER LED is turned Off.
Is the ERR LED flickering ? Flowchart used when the ERR LED is flickering.
Are the RUN LED turned
Off ?
Flowchart used when the RUN turned Off.
I/O module doesn’t operate
properly.
Flowchart used when the output load of the output module
doesn’t turn on.
Program cannot be written. Flowchart used when a program can’t be written to the
PLC.

Chapter 11 Troubleshooting
11-2
11.2.1 Troubleshooting flowchart used when the PWR (Power) LED turns Off.
The following flowchart explains corrective action procedure used when the power is supplied or the power LED
turns Off during operation.
Yes
Power LED is turned Off.
Is the power supply
operating?
Is the voltage within the
rated power?
Write down the troubleshooting
Questionnaire and contact
the nearest service center
.

Supply the power.

Does the power LED
turns On?

Supply the power
properly.

Does the power LED
turns On?

1) Eliminate the excess current
2) Switch the input power Off then
On.

Does the power LED
turns On?
No
No
No
Yes
Yes
No
No
Yes
Yes
Yes
Complete
Over current protection
device activated?

Chapter 11 Troubleshooting
11-3
11.2.2 Troubleshooting flowchart used with when the ERR (Error) LED is flickering
The following flowchart explains corrective action procedure use when the power is supplied star
ts or the ERR LED is flickering during operation.

Warning
Though warning error appears, PLC system doesn’t stop but corrective action is needed
promptly. If not, it may cause the system failure.

STOP LED goes flickering
No
No
Yes
Check the error code, with
connected XG5000.
Write down the Troubleshooting
Questionnaires and contact the nearest
service center.
See Appendix 1 Flag list
and remove the cause of
the error.
Complete
Yes
Warning error?
Is ERR LED still
flicking ?

Chapter 11 Troubleshooting
11-4
11.2.3 Troubleshooting flowchart used with when the RUN , STOP LED turns Off.
The following flowchart explains corrective action procedure to treat the lights-out of RUN LED when the power
is supplied, operation starts or operation is in the process.
RUN, STOP LED is Off.
No
Yes
Write down the Troubleshooting
Questionnaires and contact the nearest
service center.
Complete

Turn the power unit Off and On.

Is RUN/ STOP LED Off?
Chapter 11 Troubleshooting
11-5
11.2.4 Troubleshooting flowchart used when the I/O part doesn’t operate
normally.
The following flowchart explains corrective action procedure used when the I/O module doesn’t
operate normally.
When the I/O module doesn’t work normally.

Check the status of SOL1 by
XG5000.

Is the output LED of SOL1
On?
No

Replace the connector of
the terminal block.

 

Measure the voltage of terminal
in SOL1 by Tester.

 

Correct wiring.

Yes
Is the measured value
normal?
Is the output
wiring correct?
Is the
terminal connector
appropriate?
Is it normal condition?

Separate the external
wiring than check the
condition of output module.

Is it normal condition?
Check the status of SOL1. Replace the Unit
Continue
Yes
Yes
Yes
No
Yes No
Yes
Yes
No
No

Chapter 11 Troubleshooting
11-6
Continue
Are the indicator LED of the
switch 1 and 2 on?
No
Check voltage of switch 1,2
by tester
Yes
Is the measured value
normal?

Separate the external
wiring witch then check
the status by forced input

Is the measured value
normal?
Check the status of the switch 1
and 2.
Input unit replacement
is Needed.
Check voltage of switch 1,2
by tester
Is the measured value
normal?
Is the
terminal screw tighten
securely?
Is input wiring correct?

Correct wiring

Retighten the terminal
screw.

Replace the terminal
board connector.

Input unit replacement is
Check from the beginning. Needed.
Is the condition
of the terminal board connector
appropriate?
Yes
No
No

Yes

 

N

Yes
Yes
No
Yes
No

No

Chapter 11 Troubleshooting
11-7
11.3 Troubleshooting Questionnaire
When problems have been met during operation of the XGC series, please write down this Questionnaires and
contact the service center via telephone or facsimile.
For errors relating to special or communication modules, use the questionnaire included in the User’s manual
of the unit.
1. Telephone & FAX No

Tell)
2. Using equipment model:
FAX)

3. Details of using equipment

CPU model: ( ) OS version No.:( ) Serial No.( )
XG5000 (for program compile) version No.: ( )

4.General description of the device or system used as the control object:
5. The kind of the base unit:
- Operation by the mode setting switch ( ),
- Operation by the XG5000 or communications ( ),
- External memory module operation ( ),
6. Is the ERR. LED of the CPU module turned On ? Yes( ), No( )
7. XG5000 error message:
8. History of corrective actions for the error message in the article 7:
9. Other tried corrective actions:
10. Characteristics of the error

Repetitive(
Sometimes(
): Periodic( ), Related to a particular sequence( ), Related to environment( )
): General error interval:

11. Detailed Description of error contents:
12. Configuration diagram for the applied system:

Chapter 11 Troubleshooting
11-8

~
Leakage current
C
AC
input
~
Leakage current
~
~ ~
E E1
External device

11.4 Troubleshooting Examples
Possible troubles with various circuits and their corrective actions are explained.
11.4.1 Input circuit troubles and corrective actions
The followings describe possible troubles with input circuits, as well as corrective actions.

Condition Cause Corrective Actions
Input signal
doesn’t turn
off.
Leakage current of external device
(Such as a drive by non-contact switch)
Connect an appropriate register and
capacity, which will make the voltage lower
across the terminals of the input module.
CR values are determined by the leakage
current value.
- Recommended value C : 0.1 ~ 0.47
R: 47 ~ 120 (1/2W)
Or make up another independent display
circuit.
Input signal
doesn’t turn
off.
(Neon lamp
may be still
on)
Leakage current of external device
(Drive by a limit switch with neon lamp)
Input signal
doesn’t turn
off.
Leakage current due to line capacity of wiring
cable.
Locate the power supply on the external
device side as shown below.
Input signal
doesn’t turn
off.
Leakage current of external device (Drive by
switch with LED indicator)
Connect an appropriate register, which will make
the voltage higher than the OFF voltage across the
input module terminal and common terminal.
Input signal
doesn’t turn
off.
Sneak current due to the use of two
different power supplies.
E1 > E2, sneaked.
Use only one power supply.
Connect a sneak current prevention diode.

R
C
External device
AC input
R
C
External device
AC input
R
AC input
External device
External device
AC input
Leakage current
DC input
L
E
DC input
L
E
DC input
R
Leakage current
DC input
R
Chapter 11 Troubleshooting
11-9
11.4.2 Output circuit and corrective actions
The following describes possible troubles with output circuits, as well as their corrective actions.

Condition Cause Corrective Action
When the output
is off, excessive
voltage is
applied to the
load.
Load is half-wave rectified inside (in some
cases, it is true of a solenoid)
When the polarity of the power supply is as
shown in
①, C is charged. W hen the polarity is
as shown in②, the voltage charged in C plus
the line voltage are applied across D. Max.
voltage is approx. 2√2.
*) If a resistor is used in this way, it does not
pose a problem to the output element. But it may
make the performance of the diode (D), which is
built in the load, drop to cause problems.
Connect registers of tens to hundreds KΩ
across the load in parallel.
The load
doesn’t
turn off.
Leakage current by surge absorbing circuit,
which is connected to output element in parallel.
Connect C and R across the load, which are of
registers of tens KΩ. When the wiring distance
from the output module to the load is long, there
may be a leakage current due to the line
capacity.
When the load
is C-R type
timer, time
constant
fluctuates.
Leakage current by surge absorbing circuit,
which is connected to output element in parallel.
Drive the relay using a contact and drive the
C-R type timer using the since contact.
Use other timer than the C-R contact some
timers have half-ware rectified internal circuits
therefore, be cautious.
The load does
not turn off.
Sneak current due to the use of two different
power supplies.
E1<E2, sneaks. E1 is off (E2 is on), sneaks.
Use only one power supply.
Connect a sneak current prevention diode.
If the load is the relay, etc, connect a
counter-electromotive voltage absorbing code as
shown by the dot line.

 

R
Load
C
~
E E1
~ X
T
Timer
Output
~
← ↑
~
~

R
Load
Output
Load
E
Load
E2
Output
C
R
Load
Leakage current
Output
C
R
Load
Leakage current
Output
C
R
Load
D
C
R
Load
R
D

Chapter 11 Troubleshooting
11-10
Output circuit troubles and corrective actions (continued).

Condition Cause Corrective actions
The load off
response
time is long.
Over current at off state [The large
solenoid current fluidic load (L/R is large)
such as is directly driven with the transistor
output.
The off response time can be delayed by
one or more second as some loads make
the current flow across the diode at the off
time of the transistor output.
Insert a small L/R magnetic contact and
drive the load using the same contact.
Output
transistor is
destroyed.
Surge current of the white lamp
A surge current of 10 times or more when
turned on.
To suppress the surge current make the
dark current of 1/3 to 1/5 rated current flow.

Output

E
Sink type transistor output
Source type transistor
output
E
E1
E
Off current

R
Outpu
Loa
Output
R Output
Outpu
Loa

Chapter 11 Troubleshooting
11-11
11.5 Error Code List

Error
code
Error cause (restart mode after taking an action) Action Operation status status LED Diagnosis point
23 Program to execute is
abnormal
Start after reloading the program Warning 0. Flicker 5 second RUN mode
24 I/O parameter error Start after reloading I/O parameter,
Battery change if battery has a problem.
Check the preservation status after I/O
parameter reloading and if error occurs,
change the unit.
Warning 0.5 second
Flicker
Reset
RUN
mode
switching
25 Basic parameter error Start after reloading Basic parameter,
Change battery if it has a problem.
Check the preservation status after Basic
parameter reloading and if error occurs,
change the unit.
Warning 0.5 second
Flicker
Reset
RUN
mode
switching
30 Module set in
parameter and the
installed module does
not match
modify the module or parameter and then
restart.
Warning 0. Flicker 5 second RUN mode
switching
31 Module falling during
operation or additional
setup
After checking the position of
attachment/detachment of expansion module
during Run mode
Warning 0.1 second
Flicker
Every
scan
33 Data of I/O module
does not access
normally during
operation.
After checking the position of slot where the
access error occurs by XG5000, change the
module and restart (acc.to parameter.)
Heavy
error
0.1 second
Flicker
Scan end
34 Normal access of
special/link module
data during operation
not available
After checking the position of slot that access
error occurred by XG5000, change the
module and restart (acc.to parameter).
Heavy
error
0.1 second
Flicker
Scan end
39 Abnormal stop of
CPU or malfunction
Abnormal system end by noise or hard ware
error.
1) If it occurs repeatedly when power
reinput, request service center
2) Noise measures
Heavy
error
0.1 second
Flicker
Ordinary
time
40 Scan time of program
during operation
exceeds the scan
watchdog time
designated by
parameter.
After checking the scan watchdog time
designated by parameter, modify the
parameter or the program and then restart.
Warning 0.5 second
Flicker
While
running
the
program
41 Operation error
occurs while
running the user
program.
Remove operation error → reload the
program and restart.
Warning 0.5 second
Flicker
While
running
the
program
44 Timer index user
error
After reloading a timer index program
modification, start
Warning 0.5Flicker second Scan end
50 Heavy error of
external device
Refer to Heavy error detection flag and
modifies the device and restart. (Acc.
Parameter)
Heavy
error
1 second
Flicker
Scan end
60 E_STOP function
executed
After removing error causes which starts
E_STOP function in program, power reinput
Heavy
error
1 second
Flicker
While
running
the
program

Chapter 11 Troubleshooting
11-12

Error
code
Error cause (restart mode after taking an action) Action Operation status status LED Diagnosis point
500 Data memory backup
not possible
If not error in battery, power reinput
Remote mode is switched to STOP mode.
Warning 1 second Flicker Reset
501 Abnormal clock data Setting the time by XG5000 if there is no
error
Warning 0.1 second
Flicker
Ordinary
time
502 Battery voltage falling Battery change at power On status Warning 0.1 second
Flicker
Ordinary
time

Appendix 1 Flag List
App. 1-1
Appendix 1 Flag List

Appendix 1.1 Special Relay (F) List

 

Word Bit Variables Function Description
F000~1 - _SYS_STATE Mode and state Indicates PLC mode and operation State.
F0000 _RUN Run Run state.
F0001 _STOP Stop Stop state.
F0002 _ERROR Error Error state.
F0003 _DEBUG Debug Debug state.
F0004 _LOCAL_CON Local control Local control mode.
F0006 _REMOTE_CON Remote mode Remote control mode.
F0008 _RUN_EDIT_ST Editing during RUN Editing program download during RUN.
F0009 _RUN_EDIT_CHK Editing during RUN Internal edit processing during RUN.
F000A _RUN_EDIT_DONE Edit done during RUN Edit is done during RUN.
F000B _RUN_EDIT_END Edit end during RUN Edit is ended during RUN.
F000C _CMOD_KEY Operation mode Operation mode changed by key.
F000D _CMOD_LPADT Operation mode Operation mode changed by local PADT.
F000E _CMOD_RPADT Operation mode Operation mode changed by Remote PADT.
F000F _CMOD_RLINK Operation mode Operation mode changed by Remote
communication module.
F0010 _FORCE_IN Forced input Forced input state.
F0011 _FORCE_OUT Forced output Forced output state.
F0014 _MON_On Monitor Monitor on execution.
F0015 _USTOP_On Stop Stop by Stop function.
F0016 _ESTOP_On EStop Stop by EStop function.
F0017 _CONPILE_MODE Compile Compile on execution.
F0018 _INIT_RUN Initialize Initialization task on execution.
F001C _PB1 Program Code 1 Program Code 1 selected.
F001D _PB2 Program Code 2 Program Code 2 selected.
F001E _CB1 Compile Code 1 Compile Code 1 selected.
F001F _CB2 Compile Code2 Compile Code 2 selected.
F002~3 - _CNF_ER System error Reports heavy error state of system.
F0021 _IO_TYER Module Type error Module Type does not match.
F0022 _IO_DEER Module detachment
error
Module is detached.
F0024 _IO_RWER Module I/O error Module I/O error.
F0025 _IP_IFER Module interface error Special/communication module interface error.
F0026 _ANNUM_ER External device error Detected heavy error in external
Device.

Appendix 1 Flag List
App. 1-2

Word Bit Variable Function Description
F002~3 F0028 _BPRM_ER Basic parameter Basic parameter error.
F0029 _IOPRM_ER IO parameter I/O configuration parameter error.
F002A _SPPRM_ER Special module parameter Special module parameter is
Abnormal.
F002B _CPPRM_ER Communication module
parameter
Communication module parameter
is abnormal.
F002C _PGM_ER Program error Program error.
F002D _CODE_ER Code error Program Code error.
F002E _SWDT_ER System watchdog System watchdog operated.
F0030 _WDT_ER Scan watchdog Scan watchdog operated.
F004 - _CNF_WAR System warning Reports light error state of system.
F0041 _DBCK_ER Backup error Data backup error.
F0043 _ABSD_ER Operation shutdown error Stop by abnormal operation.
F0046 _ANNUM_WAR External device error Detected light error of external device.
F0048 _HS_WAR1 High speed link 1 High speed link – parameter 1 error.
F0049 _HS_WAR2 High speed link 2 High speed link – parameter 2 error.
F0054 _P2P_WAR1 P2P parameter 1 P2P – parameter 1 error.
F0055 _P2P_WAR2 P2P parameter 2 P2P – parameter 2 error.
F0056 _P2P_WAR3 P2P parameter 3 P2P – parameter 3 error.
F005C _CONSTANT_ER Constant error Constant error.
F009 - _USER_F User contact Timer used by user.
F0090 _T20MS 20ms 20ms cycle Clock.
F0091 _T100MS 100ms 100ms cycle Clock.
F0092 _T200MS 200ms 200ms cycle Clock.
F0093 _T1S 1s Clock 1s cycle Clock.
F0094 _T2S 2 s Clock 2s cycle Clock.
F0095 _T10S 10 s Clock 10s cycle Clock.
F0096 _T20S 20 s Clock 20s cycle Clock.
F0097 _T60S 60 s Clock 60s cycle Clock.
F0099 _On Ordinary time On Always On state Bit.
F009A _Off Ordinary time Off Always Off state Bit.
F009B _1On 1scan On First scan On Bit.
F009C _1Off 1scan Off First scan OFF bit.
F009D _STOG Reversal Reversal every scan.

Appendix 1 Flag List
App. 1-4

Word Bit Variable Function Description
F010 - _USER_CLK User Clock Clock available for user setting.
F0100 _USR_CLK0 Setting scan repeat On/Off as much as set scan Clock 0.
F0101 _USR_CLK1 Setting scan repeat On/Off as much as set scan Clock 1.
F0102 _USR_CLK2 Setting scan repeat On/Off as much as set scan Clock 2.
F0103 _USR_CLK3 Setting scan repeat On/Off as much as set scan Clock 3.
F0104 _USR_CLK4 Setting scan repeat On/Off as much as set scan Clock 4.
F0105 _USR_CLK5 Setting scan repeat On/Off as much as set scan Clock 5.
F0106 _USR_CLK6 Setting scan repeat On/Off as much as set scan Clock 6.
F0107 _USR_CLK7 Setting scan repeat On/Off as much as set scan Clock 7.
F011 - _LOGIC_RESULT Logic result Indicates logic results.
F0110 _LER operation error On during 1 scan in case of operation
error.
F0111 _ZERO Zero flag On when operation result is 0.
F0112 _CARRY Carry flag On when carry occurs during operation.
F0113 _ALL_Off All output OFF On in case that all output is Off.
F0115 _LER_LATCH Operation error
Latch
Keeps On during operation error.
F012 - _CMP_RESULT Comparison result Indicates the comparison result.
F0120 _LT LT flag On in case of “less than”.
F0121 _LTE LTE flag On in case of “equal or less than”.
F0122 _EQU EQU flag On in case of “equal”.
F0123 _GT GT flag On in case of “greater than”.
F0124 _GTE GTE flag On in case of “equal or greater than”.
F0125 _NEQ NEQ flag On in case of “not equal”.
F014 - _FALS_NUM FALS no. Indicates FALS no.
F015 - _PUTGET_ERR0 PUT/GET error 0 Main base Put / Get error.
F023 - _PUTGET_NDR0 PUT/GET end 0 Main base Put/Get end.
F044 - _CPU_TYPE CPU Type Indicates information for CPU Type.
F045 - _CPU_VER CPU version Indicates CPU version.
F046 - _OS_VER OS version Indicates OS version.
F048 - _OS_DATE OS date Indicates OS distribution date.
F050 - _SCAN_MAX Max. scan time Indicates max. scan time.
F051 - _SCAN_MIN Min. scan time Indicates min. scan time.
F052 - _SCAN_CUR Current scan time Current scan time.
F0053 - _MON_YEAR Month/year Clock data (month/year)
F0054 - _TIME_DAY Hour/date Clock data (hour/date)
F0055 - _SEC_MIN Second/minute Clock data (Second/minute)
F0056 - _HUND_WK Hundred year/week Clock data (Hundred year/week)

Appendix 1 Flag List
App. 1-4

Word Bit Variable Function Description
F057 - _FPU_INFO N/A -
F0570 _FPU_LFLAG_I N/A -
F0571 _FPU_LFLAG_U N/A -
F0572 _FPU_LFLAG_O N/A -
F0573 _FPU_LFLAG_Z N/A -
F0574 _FPU_LFLAG_V N/A -
F057A _FPU_FLAG_I N/A -
F057B _FPU_FLAG_U N/A -
F057C _FPU_FLAG_O N/A -
F057D _FPU_FLAG_Z N/A -
F057E _FPU_FLAG_V N/A -
F057F _FPU_FLAG_E Irregular input Reports in case of irregular input.
F058 - _ERR_STEP Error step Saves error step.
F060 - _REF_COUNT Refresh Increase when module Refresh.
F062 - _REF_OK_CNT Refresh OK Increase when module Refresh is normal.
F064 - _REF_NG_CNT Refresh NG Increase when module Refresh is
Abnormal.
F066 - _REF_LIM_CNT Refresh Limit Increase when module Refresh is
abnormal (Time Out).
F068 - _REF_ERR_CNT Refresh Error Increase when module Refresh is
Abnormal.
F070 - _MOD_RD_ERR_CNT - -
F072 - _MOD_WR_ERR_CNT - -
F074 - _CA_CNT - -
F076 - _CA_LIM_CNT - -
F078 - _CA_ERR_CNT - -
F080 - _BUF_FULL_CNT Buffer Full Increase when CPU internal buffer is full.
F082 - _PUT_CNT Put count Increase when Put count.
F084 - _GET_CNT Get count Increase when Get count.
F086 - _KEY Current key indicates the current state of local key.
F088 - _KEY_PREV Previous key indicates the previous state of local key
F090 - _IO_TYER_N Mismatch slot Module Type mismatched slot no.
F091 - _IO_DEER_N Detach slot Module detached slot no.
F093 - _IO_RWER_N RW error slot Module read/write error slot no.
F094 - _IP_IFER_N IF error slot Module interface error slot no.
F096 - _IO_TYER0 Module Type 0 error Main base module Type error.

Appendix 1 Flag List
App. 1-6

Word Bit Variable Function Description
F104 - _IO_DEER0 Module Detach 0 error Main base module Detach error.
F120 - _IO_RWER0 Module RW 0 error Main base module read/write error.
F128 - _IO_IFER_0 Module IF 0 error Main base module interface error.
F140 - _AC_FAIL_CNT Power shutdown times Saves the times of power shutdown.
F142 - _ERR_HIS_CNT Error occur times Saves the times of error occur.
F144 - _MOD_HIS_CNT Mode conversion times Saves the times of mode conversion.
F146 - _SYS_HIS_CNT History occur times Saves the times of system history.
F148 - _LOG_ROTATE Log Rotate Saves log rotate information.
F150 - _BASE_INFO0 Slot information 0 Main base slot information.
F200 - _USER_WRITE_F Available contact point Contact point available in program.
F2000 _RTC_WR RTC RW Data write and read in RTC.
F2001 _SCAN_WR Scan WR Initializing the value of scan.
F2002 _CHK_ANC_ERR Request detection of
external serious error
Request detection of external error.
F2003 _CHK_ANC_WAR Request detection of
external slight error
(warning)
Request detection of external slight error
(warning).
F201 - _USER_STAUS_F User contact point User contact point.
F2010 _INIT_DONE Initialization completed Initialization complete displayed.
F202 - _ANC_ERR Display information of
external serious error
Display information of external serious
error
F203 - _ANC_WAR Display information of
external slight error
(warning)
Display information of external slight
error (warning)
F210 - _MON_YEAR_DT Month/year Clock data (month/year)
F211 - _TIME_DAY_DT Hour/date Clock data (hour/date)
F212 - _SEC_MIN_DT Second/minute Clock data (Second/minute)
F213 - _HUND_WK_DT Hundred year/week Clock data (Hundred year/week)

Appendix 1 Flag List
App. 1-6

Appendix 1.2 Communication Relay (L) List

Here describes data link communication relay(L).
1. High-speed Link 1

Device Keyword Type Description
L000 _HS1_RLINK Bit High speed link parameter 1 normal operation of all station
Indicates normal operation of all station according to parameter set
in High speed link, and On under the condition as below.
1. In case that all station set in parameter is RUN mode and no
error,
2. All data block set in parameter is communicated normally, and
3. The parameter set in each station itself is communicated
normally.
Once RUN_LINK is On, it keeps On unless stopped by
LINK_DISABLE.
L001 _HS1_LTRBL Bit Abnormal state after _HS1RLINK On
In the state of _HSmRLINK flag On, if communication state of the
station set in the parameter and data block is as follows, this flag
shall be On.
1. In case that the station set in the parameter is not RUN mode, or
2. There is an error in the station set in the parameter, or
3. The communication state of data block set in the parameter is not
good.
LINK TROUBLE shall be On if the above 1, 2 & 3 conditions occur,
and if the condition return to the normal state, it shall be OFF
again.
L0020 ~
L005F
_HS1_STATE[k]
(k = 00~63)
Bit
Array
High speed link parameter 1, K block general state
Indicates the general state of communication information for each
data block of setting parameter.
_HS1_STATE[k] = HS1MOD[k]&_HS1TRX[k]&(~_HS1_ERR[k])
L0060 ~
L009F
_HS1_MOD[k]
(k = 00~63)
Bit
Array
High speed link parameter 1, k block station RUN operation mode
Indicates operation mode of station set in K data block of
parameter.
L0100 ~
L013F
_HS1_TRX[k]
(k = 00~63)
Bit
Array
Normal communication with High speed link parameter 1, k block
station
Indicates if communication state of Kdata of parameter is
communicated smoothly according to the setting.
L0140 ~
L017F
_HS1_ERR[k]
(k = 00~63)
Bit
Array
High speed link parameter 1, K block station operation error mode
Indicates if the error occurs in the communication state of k data
block of parameter.
L0180 ~
L021F
_HS1_SETBLOCK[k] B Array it High speed link parameter 1, K block setting
Indicates whether or not to set k data block of parameter.

Appendix 1 Flag List
App. 1-7
2. High-speed Link2

Device Keyword Type Description
L0260 _HS2_RLINK Bit High-speed link parameter 2 normal operation of all station.
Indicates normal operation of all station according to parameter set in
High-speed link and On under the condition as below.
1. In case that all station set in parameter is Run mode and no error
2. All data block set in parameter is communicated and
3.The parameter set in each station itself is communicated normally.
Once RUN_LINK is On, it keeps On unless stopped by LINK_DISABLE.
L0261 _HS2_LTRBL Bit Abnormal state after _HS2RLINK On.
In the state of _HSmRLINK flag On, if communication state of the station
set in the parameter and data block is as follows, this flag shall be On.
1. In case that the station set in the parameter is not RUN mode, or
2. There is an error in the station set in the parameter, or
3. The communication state of data block set in the parameter is not
good.
LINK TROUBLE shall be On if the above 1, 2 & 3 conditions occur, and
if the condition return to the normal state, it shall be OFF again.
L0280 ~
L031F
_HS2_STATE[k]
(k = 00~63)
Bit
Array
High speed link parameter 1, k block general state.
Indicates the general state of communication information for each data
block of setting parameter.
_HS2_STATE[k]=HS2MOD[k]&_HS2TRX[k]&(~_HS2_ERR[k])
L0320 ~
L035F
_HS2_MOD[k]
(k = 00~63)
Bit
Array
High speed link parameter 1, k block station RUN operation mode.
Indicates operation mode of station set in k data block of parameter.
L0360 ~
L039F
_HS2_TRX[k]
(k = 00~63)
Bit
Array
Normal communication with High speed link parameter 1, K block
station.
Indicates if communication state of K data of parameter is
communicated smoothly according to the setting.
L0400 ~
L043F
_HS2_ERR[k]
(k = 00~63)
Bit
Array
High speed link parameter 1, K block station operation error mode.
Indicates if the error occurs in the communication state of k data block of
parameter.
L0440 ~
L047F
_HS2_SETBLOCK[k] Bit Array High speed link parameter 1, K block setting.
Indicates whether or not to set k data block of parameter.

Appendix 1 Flag List
App. 1-9
3. Common area
Communication flag list according to P2P service setting.
P2P parameter: 1~3, P2P block: 0~31

Device Keyword Type Description
L5120 _P2P1_NDR00 Bit Indicates P2P parameter 1, 0 Block service
normal end.
L5121 _P2P1_ERR00 Bit Indicates P2P parameter 1, 0 Block service
abnormal end.
L513 _P2P1_STATUS00 Word Indicates error code in case of P2P parameter 1, 0 Block
service abnormal end.
L514 _P2P1_SVCCNT00 DWord Indicates P2P parameter 1, 0 Block service
normal count.
L516 _P2P1_ERRCNT00 DWord Indicates P2P parameter 1, 0 Block service
abnormal count.
L5180 _P2P1_NDR01 Bit P2P parameter 1, 1 Block service normal end.
L5181 _P2P1_ERR01 Bit P2P parameter 1, 1 Block service abnormal end.
L519 _P2P1_STATUS01 Word Indicates error code in case of P2P parameter 1, 1 Block
service abnormal end.
L520 _P2P1_SVCCNT01 DWord Indicates P2P parameter 1, 1 Block service
normal count.
L522 _P2P1_ERRCNT01 DWord Indicates P2P parameter 1, 1 Block service
abnormal count.
L524~L529 - Word P2P parameter 1,2 Block service total.
L530~L535 - Word P2P parameter 1,3 Block service total.
L536~L697 - Word P2P parameter 1,4~30 Block service total.
L698~L703 - Word P2P parameter 1,31 Block service total.

Appendix 1 Flag List
App. 1-9

Appendix 1.3 Network Register (N) List

Here describes Network Register for communication (N). P2P parameter: 1~3, P2P block: 0~31

Device Keyword Type Description
N000 _P1B00SN Word Saves another station no. of P2P parameter 1, 00 block.
N0000~0004 _P1B00RD1 Word Saves area device 1 to read P2P parameter 1, 01 block.
N005 _P1B00RS1 Word Saves area size 1 to read P2P parameter 1, 01 block.
N0006~0009 _P1B00RD2 Word Saves area device 2 to read P2P parameter 1, 01 block.
N010 _P1B00RS2 Word Saves area size 2 to read P2P parameter 1, 01 block.
N0011~0014 _P1B00RD3 Word Saves area device 3 to read P2P parameter 1, 01 block.
N015 _P1B00RS3 Word Saves area size 3 to read P2P parameter 1, 01 block.
N0016~0019 _P1B00RD4 Word Saves area device 4 to read P2P parameter 1, 01 block.
N020 _P1B00RS4 Word Saves area size 4 to read P2P parameter 1, 01 block.
N0021~0024 _P1B00WD1 Word Saves area device 1 to save P2P parameter 1, 01 block.
N025 _P1B00WS1 Word Saves area size 1 to save P2P parameter 1, 01 block.
N0026~0029 _P1B00WD2 Word Saves area device 2 to save P2P parameter 1, 01 block.
N030 _P1B00WS2 Word Saves area size 2 to save P2P parameter 1, 01 block.
N0031~0034 _P1B00WD3 Word Saves area device 3 to save P2P parameter 1, 01 block.
N035 _P1B00WS3 Word Saves area size 3 to save P2P parameter 1, 01 block.
N0036~0039 _P1B00WD4 Word Saves area device 4 to save P2P parameter 1, 01 block.
N040 _P1B00WS4 Word Saves area size 4 to save P2P parameter 1, 01 block.
N0041~0081 - Word Saving area of P2P parameter 1, 01 block.
N0082~0122 - Word Saving area of P2P parameter 1, 02 block. P2P
N0123~1311 - Word Saving area of P2P parameter 1, 03~31 block.
N1312~2623 - Word Saving area of P2P parameter 2.
N2624~3935 - Word Saving area of P2P parameter 3.

 

Remark
In XGB series, Network register is available only monitoring. (Read Only)

Appendix 2 Dimension
App.2
Appendix 2 Dimension (Unit: mm)
(1) standard type main unit (“S” type)
-. XBM-DN16S/32S
-. XBM-DR16S
P00~07 P20~27
RUN
PWR
ERR
XBM-DN16S
RUN
RS-232C
RUN
PWR
ERR
XBM-DR16S
RS-232C
RUN
P00~07 P20~27

Appendix 2 Dimension
App.2
(2) Compact type main unit (“H” type)
-. XBC-DN32H(/DC)
-. XBC-DR32H (/DC)

Appendix 2 Dimension
App.2
-. XBC-DN64H (/DC)
-. XBC-DR64H (/DC)

Appendix 2 Dimension
App.2
(3) Extension I/O module
-. XBE-DC32A, XBE-TN32A, XBE-TP32A
01
02
03
04
05
06
07
19
20
08
09
10
11
12
13
14
15
16
17
18
B A
-. XBE-RY16A
Appendix 2 Dimension
App.2
-. XBE-DC08A, XBE-DC16A, XBE-TN08A, XBE-TP08A, XBE-TN16A, XBE-TP16A
-. XBE-DR16A, XBE-RY08A

Appendix 3 Compatibility with MASTER-K (Special Relay)
App. 3-1
Appendix 3 Compatibility with MASTER-K (Special Relay)

MASTER-K XGB
Device Function Symbol Device Function
F0000 RUN mode _RUN F0000 RUN Edit mode
F0001 Program mode _STOP F0001 Program mode
F0002 Pause mode _ERROR F0002 Error mode
F0003 Debug mode _DEBUG F0003 Debug mode
F0004 N/A _LOCAL_CON F0006 Remote mode
F0005 N/A _MODBUS_CON F0006 Remote mode
F0006 Remote mode _REMOTE_CON F0006 Remote mode
F0007 User memory setup - F0007 N/A
F0008 N/A _RUN_EDIT_ST F0008 Editing during RUN
F0009 N/A _RUN_EDIT_CHK F0009 Editing during RUN
F000A User memory operation _RUN_EDIT_DONE F000A Edit done during RUN
F000B N/A _RUN_EDIT_END F000B Edit end during RUN
F000C N/A _CMOD_KEY F000C Operation mode change by KEY
F000D N/A _CMOD_LPADT F000D Operation mode change by PADT
F000E N/A _CMOD_RPADT F000E Operation mode change by Remote
PADT
F000F STOP command execution _CMOD_RLINK F000F Operation mode change cause by
remote communication module
F0010 Ordinary time On _FORCE_IN F0010 Forced input
F0011 Ordinary time Off _FORCE_OUT F0011 Forced output
F0012 1 Scan On _SKIP_ON F0012 I/O Skip execution
F0013 1 Scan Off _EMASK_ON F0013 Error mask execution
F0014 Reversal every Scan _MON_ON F0014 Monitor execution
F0015 ~
F001C
N/A _USTOP_ON F0015 Stop by Stop Function
_ESTOP_ON F0016 Stop by ESTOP Function
_CONPILE_MODE F0017 Compile
_INIT_RUN F0018 Initialize
- F0019 ~
F001F
N/A
_PB1 F001C Program Code 1
F001D N/A _PB2 F001D Program Code 2
F001E N/A _CB1 F001E Compile code 1
F001F N/A _CB2 F001F Compile code 2

Appendix 3 Compatibility with MASTER-K (Special Relay)
App. 3-2

MASTER-K XGB
Device Function Symbol Device Function
F0020 1 Step RUN _CPU_ER F0020 CPU configuration error
F0021 Break Point RUN _IO_TYER F0021 Module type mismatch error
F0022 Scan RUN _IO_DEER F0022 Module detach error
F0023 Contact value match RUN _FUSE_ER F0023 Fuse cutoff error
F0024 Word value match RUN _IO_RWER F0024 I/O module read/write error
F0025 ~
F002F
N/A _IP_IFER F0025 Special/communication module interface
error
_ANNUM_ER F0026 Heavy error detection of external
equipment error
- F0027 N/A
_BPRM_ER F0028 Basic parameter error
_IOPRM_ER F0029 I/O configuration parameter error
_SPPRM_ER F002A Special module parameter error
_CPPRM_ER F002B Communication module parameter
error
_PGM_ER F002C Program error
_CODE_ER F002D Program Code error
_SWDT_ER F002E System watchdog error
_BASE_POWER
_ER
F002F Base power error
F0030 Heavy error _WDT_ER F0030 Scan watchdog
F0031 Light error - F0031 -
F0032 WDT error - F0032 -
F0033 I/O combination error - F0033 -
F0034 Battery voltage error - F0034 -
F0035 Fuse error - F0035 -
F0036 ~
F0038
N/A - F0036 ~ F0038 -
F0039 Backup normal - F0039 -
F003A Clock data error - F003A -
F003B Program change - F003B -
F003C Program change error - F003C -
F003D ~
F003F
N/A - F003D ~ F003F N/A
F0040~
F005F
N/A _RTC_ER F0040 RTC data error
_DBCK_ER F0041 Data backup error
_HBCK_ER F0042 Hot restart disabled error
_ABSD_ER F0043 Abnormal operation stop
_TASK_ER F0044 Task collision
_BAT_ER F0045 Battery error
_ANNUM_ER F0046 Light error detection of external
equipment

Appendix 3 Compatibility with MASTER-K (Special Relay)
App. 3-3

MASTER-K XGB
Device Function Symbol Device Function
F0040 ~ F005F N/A _LOG_FULL F0047 Log memory full warning
_HS_WAR1 F0048 High speed link parameter 1 error
_HS_WAR2 F0049 High speed link parameter 2 error
- F004A ~ F0053 N/A
_P2P_WAR1 F0054 P2P parameter 1 error
_P2P_WAR2 F0055 P2P parameter 2 error
_P2P_WAR3 F0056 P2P parameter 3 error
- F0057 ~ F005B N/A
_Constant_ER F005C Constant error
- F005D ~ F005F N/A
F0060 ~ F006F Error Code save - F0060 ~ F006F N/A
F0070 ~ F008F Fuse cutoff save - F0070 ~ F008F N/A
F0090 20ms cycle Clock _T20MS F0090 20ms cycle Clock
F0091 100ms cycle Clock _T100MS F0091 100ms cycle Clock
F0092 200ms cycle Clock _T200MS F0092 200ms cycle Clock
F0093 1s cycle Clock _T1S F0093 1s cycle Clock
F0094 2s cycle Clock _T2S F0094 2s cycle Clock
F0095 10s cycle Clock _T10S F0095 10s cycle Clock
F0096 20s cycle Clock _T20S F0096 20s cycle Clock
F0097 60s cycle Clock _T60S F0097 60s cycle Clock
F0098 ~F009F N/A - F0098 N/A
_ON F0099 Ordinary time On
_OFF F009A Ordinary time Off
_1ON F009B 1 Scan On
_1OFF F009C 1 Scan Off
_STOG F009D Reversal every Scan
- F009B ~ F009F N/A
F0100 User Clock 0 - F0100 User Clock 0
F0101 User Clock 1 - F0101 User Clock 1
F0102 User Clock 2 - F0102 User Clock 2
F0103 User Clock 3 - F0103 User Clock 3
F0104 User Clock 4 - F0104 User Clock 4
F0105 User Clock 5 - F0105 User Clock 5
F0106 User Clock 6 - F0106 User Clock 6
F0107 User Clock 7 - F0107 User Clock 7

Appendix 3 Compatibility with MASTER-K (Special Relay)
App. 3-4

MASTER-K XGB
Device Function Symbol Device Function
F0108 ~ F010F - F0108 ~ F010F N/A
F0110 Operation error flag _Ler F0110 Operation error flag
F0111 Zero flag _Zero F0111 Zero flag
F0112 Carry flag _Carry F0112 Carry flag
F0113 Full output Off _All_Off F0113 Full output Off
F0114 Common RAM R/W
error
- F0114 N/A
F0115 Operation error flag
(latch)
_Ler_Latch F0115 Operation error flag(latch)
F0116 ~ F011F - F0116 ~ F011F N/A
F0120 LT flag _LT F0120 LT flag
F0121 LTE flag _LTE F0121 LTE flag
F0122 EQU flag _EQU F0122 EQU flag
F0123 GT flag _GT F0123 GT flag
F0124 GTE flag _GTE F0124 GTE flag
F0125 NEQ flag _NEQ F0125 NEQ flag
F0126 ~ F012F N/A - F0126 ~ F012F N/A
F0130~ F013F AC Down Count _AC_F_CNT F0130~ F013F AC Down Count
F0140~ F014F FALS no. _FALS_NUM F0140~ F014F FALS no.
F0150~ F015F PUT/GET error flag _PUTGET_ERR F0150~ F030F PUT/GET error flag
CPU TYPE F0440 ~ F044F CPU TYPE
CPU VERSION F0450 ~ F045F CPU VERSION
OS version no. F0460 ~ F047F System OS version no.
F0160~ F049F N/A OS date F0480 ~ F049F System OS DATE

Appendix 3 Compatibility with MASTER-K (Special Relay)
App. 3-5

MASTER-K XGB
Device Function Symbol Device Function
F0500~ F050F Max. Scan time _SCAN_MAX F0500~ F050F Max. Scan time
F0510~ F051F Min. Scan time _SCAN_MIN F0510~ F051F Min. Scan time
F0520~ F052F Current Scan time _SCAN_CUR F0520~ F052F Current Scan time
F0530~ F053F Clock data
(year/month)
_YEAR_MON F0530~ F053F Clock data (year/month)
F0540~ F054F Clock data (day/hr) _DAY_TIME F0540~ F054F Clock data(day/hr)
F0550~ F055F Clock data (min/sec) _MIN_SEC F0550~ F055F Clock data(min/sec)
F0560~ F056F Clock data
(100year/weekday)
_HUND_WK F0560~ F056F Clock data(100year/weekday)
F0570~ F058F N/A _FPU_LFlag_I F0570 -
_FPU_LFlag_U F0571 -
_FPU_LFlag_O F0572 -
_FPU_LFlag_Z F0573 -
_FPU_LFlag_V F0574 -
- F0575 ~ F0579 N/A
_FPU_Flag_I F057A -
_FPU_Flag_U F057B -
_FPU_Flag_O F057C -
_FPU_Flag_Z F057D -
_FPU_Flag_V F057E -
_FPU_Flag_E F057F -
Error Step F0580~ F058F Error step save
F0590~ F059F Error step save - F0590~ F059F N/A
F0600~ F060F FMM detailed error
information
_REF_COUNT F060~F061 Refresh Count
F0610~ F063F N/A _REF_OK_CNT F062~F063 Refresh OK Count
_REF_NG_CNT F064~F065 Refresh NG Count
_REF_LIM_CNT F066~F067 Refresh Limit Count
_REF_ERR_CNT F068~F069 Refresh Error Count
_MOD_RD_ERR_CNT F070~F071 MODULE Read Error Count
_MOD_WR_ERR_CNT F072~F073 MODULE Write Error Count
_CA_CNT F074~F075 Cmd Access Count
_CA_LIM_CNT F076~F077 Cmd Access Limit Count
_CA_ERR_CNT F078~F079 Cmd Access Error Count
_BUF_FULL_CNT F080~F081 Buffer Full Count

Appendix 4 Instruction List
App. 4-1
Appendix 4 Instruction List
Appendix 4.1 Classification of Instructions

Classification Instructions Details Remarks
Basic
Instructions
Contact Point Instruction LOAD, AND, OR related Instructions
Unite Instruction AND LOAD, OR LOAD, MPUSH, MLOAD, MPOP
Reverse Instruction NOT
Master Control Instruction MCS, MCSCLR
Output Instruction OUT, SET, RST, 1 Scan Output Instruction, Output Reverse
Instruction (FF)
Sequence/Last-input
Preferred Instruction
Step Control Instruction ( SET Sxx.xx, OUT Sxx.xx )
End Instruction END
Non-Process Instruction NOP
Timer Instruction TON, TOFF, TMR, TMON, TRTG
Counter Instruction CTD, CTU, CTUD, CTR
Application
Instructions
Data Transfer Instruction Transfers specified Data, Group, String 4/8/64 Bits
available
Conversion Instruction Converts BIN/BCD of specified Data & Group 4/8 Bits
available
Data Type Conversion
Instruction
Converts Integer/Real Number
Output Terminal Compare
Instruction
Saves compared results in special relay Compare to Unsigned
Input Terminal Compare
Instruction
Saves compared results in BR. Compares Real Number,
String & Group. Compares 3 Operands
Compare to
Signed
Increase/Decrease
Instruction
Increases or decreases specified data 1 by 1 4/8 Bits available
Rotate Instruction Rotates specified data to the left and right,
including Carry
4/8 Bits
available
Move Instruction Moves specified data to the left and right, word by word, bit
by bit
4/8 Bits
available
Exchange Instruction Exchanges between devices, higher & lower byte, group
data
BIN Operation Instruction Addition, Subtraction, Multiplication & Division for Integer/
Real Number, Addition for String, Addition & Subtraction for
Group
BCD Operation Instruction Addition, Subtraction, Multiplication, Division.
Logic Operation Instruction Logic Multiplication, Logic Addition, Exclusive OR, Exclusive
NOR, Group Operation
System Instruction Error Display, WDT Initialize, Output Control, Operation
Stop, etc.
Data Process Instruction Encode, Decode, Data Disconnect/Connect, Search, Align,
Max., Min., Total, Average, etc.
Data Table Process
Instruction
Data Input/Output of Data Table
String Process Instruction String related Convert, Comment Read, String Extract,
ASCII Convert, HEX Convert, String Search, etc.
Special Function
Instruction
Trigonometric Function, Exponential/Log Function, Angle/
Radian Convert, etc.
Data Control Instruction Max/Min Limit Control, Dead-zone Control, Zone Control
Time related Instruction Date Time Data Read/Write, Time Data Adjust & Convert
Diverge Instruction JMP, CALL
Loop Instruction FOR/NEXT/BREAK
Flag related Instruction Carry Flag Set/Reset, Error Flag Clear
Special/Communication
related Instruction
Data Read/Write by BUSCON Direct Access
Interrupt related Instruction Interrupt Enable/Disable
Signal Reverse Instruction Reverse Integer/Real Signals, Absolute Value Operation

Appendix 4 Instruction List
App. 4-2
Appendix 4.2 Basic Instructions
1) Contact point instruction

Classification Designations Symbol Description Support
XGK XGB
Contact
Point
LOAD A Contact Point Operation Start
LOAD NOT B Contact Point Operation Start
AND A Contact Point Series
Connected
AND NOT B Contact Point Series
Connected
OR A Contact Point Parallel
Connected
OR NOT B Contact Point Parallel
Connected
LOADP P Positive Convert Detected
Contact Point
LOADN N Negative Convert Detected
Contact Point
ANDP P Positive Convert Detected
Contact Point Series-Connected
ANDN N Negative Convert Detected
Contact Point Series-Connected
ORP P Positive Convert Detected
Contact Point Parallel
C t d
ORN N Negative Convert Detected
Contact Point Parallel
C t d

2) Union instruction

Classification Designations Symbol Description Support
XGK XGB
Unite AND LOAD A B A,B Block Series-Connected
OR LOAD A B A,B Block Parallel-Connected
MPUSH Operation Result Push up to
present
MLOAD Operation Result Load
Previous to Diverge Point
MPOP Operation Result Pop Previous
to Diverge Point

MPUSH
MLOAD
MPOP

Appendix 4 Instruction List
App. 4-3
3) Reverse instruction

Classification Designations Symbol Description Support
XGK XGB
Reverse NOT Previous Operation results
Reverse

4) Master Control instruction

Classification Designations Symbol Description Support
XGK XGB
Master
Control
MCS MCS n Master Control Setting (n:0~7)
MCSCLR Master Control Cancel (n:0~7)

5) Output instruction

Classification Designations Symbol Description Support
XGK XGB
Output OUT Operation Results Output
OUT NOT Operation Results Reverse
Output
OUTP 1 Scan Output if Input
Condition rises
OUTN 1 Scan Output if Input
Condition falls
SET Contact Point Output ON kept
RST Contact Point Output OFF
kept
FF FF D Output Reverse if Input
Condition rises

6) Sequence/Last-input preferred instruction

Classification Designations Symbol Description Support
XGK XGB
Step
Control
SET S Sequence Control
OUT S Last-input Preferred

7) End instruction

Classification Designations Symbol Description Support
XGK XGB
End END END Program End

8) Non-process instruction

Classification Designations Symbol Description Support
XGK XGB
Non-Process NOP Ladder not displayed Non in Nimonic -Process Instruction, used

MCSCLR n

P
N
S
R

 

Syy.xx
S
Syy.xx

Appendix 4 Instruction List
App. 4-4
9) Timer instruction

Classification Designations Symbol Description Support
XGK XGB
Timer TON TON T t
TOFF TOFF T t
TMR TMR T t
TMON TMON T t
TRTG TRTG T t

10) Counter instruction

Classification Designations Symbol Description Support
XGK XGB
Counter CTD CTD C c
CTU CTU C c
CTUD CTUD C U D c Setting
Reset
Pulse
Present
Output
Increased
Pulse
Decreased
CTR CTR C c Setting
Reset
Count
Pulse
Present
Output

 

t
Input
T
t Input
Input
T
t Input
t
Input
T

T
t1→ ←t2
t1+t2 = t

T

Setting
Reset
Count
Pulse
Present
Output
Setting
Reset
Count
Pulse
Present
Output

Appendix 4 Instruction List
App. 4-5
Appendix 4.3 Application Instruction
1) Data transfer instruction

Classification Designations Symbol Description Support
XGK XGB
16 bits
Transfer
MOV MOV S D
MOVP MOVP S D
32 bits
Transfer
DMOV DMOV S D
DMOVP DMOVP S D
Short
Real Number
Transfer
RMOV RMOV S D
RMOVP RMOVP S D
Long
Real Number
Transfer
LMOV LMOV S D
LMOVP LMOVP S D
4 bits
Transfer
MOV4 MOV4 Sb Db
MOV4P MOV4P Sb Db
8 bits
Transfer
MOV8 MOV8 Sb Db
MOV8P MOV8P Sb Db
1’s complement
Transfer
CMOV CMOV S D
CMOVP CMOVP S D
DCMOV DCMOV S D
DCMOVP DCMOVP S D
16 bits
Group Transfer
GMOV GMOV S D N
GMOVP GMOVP S D N
Multiple
Transfer
FMOV FMOV S D N
FMOVP FMOVP S D N
Specified Bits
Transfer
BMOV BMOV S D N
BMOVP BMOVP S D N
Specified Bits
Group Transfer
GBMOV GBMOV S D Z N

Appendix 4 Instruction List
App. 4-6
1) Data Transfer Instruction (continued)

Classification Designations Symbol Description Support
XGK XGB
String
Transfer
$MOV $MOV S D String started from (S)
String started from (D)
$MOVP $MOVP S D

2) BCD/BIN conversion instruction

Classification Designations Symbol Description Support
XGK XGB
BCD
Conversion
BCD BCD S D
BCDP BCDP S D
DBCD